OTHER Other Function Telecom Interface ICs 989

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

PCD5071-T

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

70 Cel

-25 Cel

QUAD

S-PQFP-G44

Not Qualified

TEA1081T/C2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

935263011118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10.3 mm

HTRM800/CED,122

NXP Semiconductors

TELECOM CIRCUIT

OTHER

PLASTIC/EPOXY

-15 V

.55 mA

15 V

+-15

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Telecom ICs

70 Cel

-25 Cel

Not Qualified

HTSICC5601EW/C7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

HTSICH5601EW/V4,00

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTSH4801ETK

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

HTSH5601ETK

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

MC33696FCAER2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

40

260

5 mm

HTCICC6401EW/C1

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

MC33596FCAE

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-XQCC-N32

3

1 mm

5 mm

40

260

5 mm

MC33696FCAE

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

40

260

5 mm

HTSICC4801EW/C7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

HTSICH5601EW/V4

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTSICH5601EW/V7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

HTSMOH4801EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N2

NOT APPLICABLE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HTSMOH5601EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N2

NOT APPLICABLE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MC33596FJAER2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

QUAD

S-PQFP-G32

1.6 mm

5 mm

40

260

5 mm

HTSICH3201EW/V4

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTSFCH3201EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTSICH4801EW/V4,00

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HT1ICS3002W/V6F

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N

HTSMOH4801EV,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

SILVER

UPPER

X-XUUC-N

Not Qualified

e4

CGY2110CU

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

GAAS

.1 mA

5.7 V

5.7

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-10 Cel

UPPER

R-XUUC-N13

Not Qualified

HTSICH4801EW/V4

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

MC33696FJAER2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

QUAD

S-PQFP-G32

1.6 mm

5 mm

40

260

5 mm

HTSFCH3201EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTSFCH4801EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

METAL

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-MUUC-N2

Not Qualified

HTSFCH5601EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

UPPER

X-XUUC-N

Not Qualified

e4

HTSMOH3201EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTSICH3201EW/V4,00

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HT1MOA4S30/E/3

NXP Semiconductors

TELECOM CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

PLASTIC/EPOXY

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

UNSPECIFIED

R-PXMA-X

MC33596FCAER2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-XQCC-N32

3

1 mm

5 mm

40

260

5 mm

HTSICH4801EW/V7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

MC33596FJAE

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

TIN

QUAD

S-PQFP-G32

3

1.6 mm

5 mm

e3

40

260

5 mm

HTSMOH3201EV,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HT1ICS3002W/V6F,00

NXP Semiconductors

TELECOM CIRCUIT

OTHER

WAFER

Other Telecom ICs

85 Cel

-25 Cel

Not Qualified

HT2MOA2S20/E/3/RJ

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

HYBRID

UNCASED CHIP

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

MF0MOA4U10/D

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

DUAL

R-XDMA-N4

Not Qualified

HTSFCH4801EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

UPPER

X-XUUC-N

Not Qualified

e4

MC145446AFW

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G28

2.65 mm

7.51 mm

17.9 mm

MC33696FJAE

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

TIN

QUAD

S-PQFP-G32

3

1.6 mm

5 mm

e3

40

260

5 mm

HT1MOA2S30/E/3

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.5 V

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N

HTSFCH5601EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

METAL

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-MUUC-N2

Not Qualified

HTSMOH5601EV,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

SILVER

UPPER

X-XUUC-N

Not Qualified

e4

CLRC66303HN/T/R

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

PN5321A3HN/C1XX

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

CLRC66302HN/T/R

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.