OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LBEE5KL1DX-883	Murata Manufacturing	TELECOM CIRCUIT	OTHER	BUTT	46		RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				70 Cel	-30 Cel		UNSPECIFIED		R-XXMA-B46	3	1.1 mm	5.15 mm						6.95 mm
BGS12SN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.6 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel	TIN	BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm			e3			1.1 mm
PN5321A3HN/C106;55	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.4 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40	2	1 mm	6 mm						6 mm
PN5120A0HN1/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified				260	5 mm
PN5120A0HN1/C2,118	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES							1.8/3.3,2.5/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	1			Not Qualified				260
RN4020-V/RM123	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel		UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module		NOT SPECIFIED	NOT SPECIFIED	19.5 mm
CLRC66302HN,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
MP45DT02TR-M	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		GRID ARRAY				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-XBGA-N6	3	1.35 mm	3.76 mm			e4		260	4.72 mm
RN4020-V/RMBEC133	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module	e4			19.5 mm
RN4020-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm			e4			19.5 mm
PN5321A3HN/C106,51	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40	2	1 mm	6 mm					260	6 mm
LBEE5HY1MW-230	Murata Manufacturing	TELECOM CIRCUIT	OTHER	NO LEAD	72		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N72	3	1.1 mm	7.3 mm				10	250	7.9 mm
LBWA1UZ1GC-958	Murata Manufacturing	TELECOM CIRCUIT	OTHER	NO LEAD		LGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY				85 Cel	-30 Cel		BOTTOM		S-PBGA-N
CLRC63201T/0FE,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm			e4	30	250	20.5 mm
BQ51013ARHLT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
RN4020-V/RM	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel		UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module		NOT SPECIFIED	NOT SPECIFIED	19.5 mm
PN5120A0HN1/C2,157	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES							1.8/3.3,2.5/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	1			Not Qualified				260
MFRC53101T/0FE,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm	Not Qualified		e4	30	250	20.5 mm
CC2564MODACMOG	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N35	3		7 mm			e3			14 mm
PE4312C-Z	Psemi	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		-3.3 V	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e4	30	260	4 mm
ST60-SIPT	Laird Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	84	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		UNSPECIFIED	866.7 Mbps	R-XXMA-N84		1.87 mm	13 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
CYBT-343026-01	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1.22 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N24	3	1.95 mm	12 mm						15.5 mm
PN5120A0HN1/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
BGSA14GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm						1.5 mm
CLRC66302HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
CC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm			e3			7 mm
AD9671KBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.4 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm				30	260	10 mm
CC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm			e3			7 mm
MFRC53001T/0FE,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm					250	20.5 mm
PN5321A3HN/C106	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm			e4	30	260	6 mm
PCM3060PWR	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
BGSF18DM20E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1		CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel	GOLD NICKEL	BOTTOM		R-XBGA-B20	3	.98 mm	2.8 mm			e4			3.2 mm
PN5120A0HN1/C1,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
CLRC66301HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
CYBT-353027-02	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	19		SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1.05 mm	85 Cel	-30 Cel		UNSPECIFIED		S-XXMA-N19	3	1.75 mm	9 mm						9 mm
BGS12AL74E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.8 V		CHIP CARRIER			.55 mm	85 Cel	-30 Cel	GOLD	BOTTOM		R-XBCC-B6	1	.5 mm	1.5 mm			e4			2.3 mm
PCM3060PW	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
HTSH5601ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel	-25 Cel		DUAL		R-PDSO-N2	1			Not Qualified			30	260
PN5120A0HN1/C1,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
BGSF110GN26E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	26	HQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		R-PQCC-N26	1	.77 mm	2.6 mm			e4			3.4 mm
BQ51013ARHLR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
MFRC63002HN,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
MFRC52302HN1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
GS2972-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	3	1.7 mm	11 mm			e1		260	11 mm
BQ51013AYFPT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
CLRC63201T/0FE,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm					250	20.5 mm
BGS12PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBCC-N10	1	.4 mm	1.1 mm						1.5 mm
TDA7200XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.