OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC570LC5	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1			3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel	GOLD OVER NICKEL	QUAD	S-XQCC-N32		1.12 mm	5 mm	Not Qualified	e4			5 mm
LTC5800HWR-IPMA#PBF	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel	SILVER	QUAD	S-PQCC-N72		1 mm	10 mm		e4			10 mm
ADN2821ACHIPS-20K	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-25 Cel		UPPER	R-XUUC-N15				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
ADN2820	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-15 Cel	TIN LEAD	UPPER	R-XUUC-N14				Not Qualified	e0
AD8315ARMZ-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	40	260	3 mm
HMC560LM3TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel	-55 Cel	MATTE TIN	QUAD	S-PQCC-N6	1	1.14 mm	5.08 mm		e3		250	5.08 mm
AD8315ARMZ-RL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.0129 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC556	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N6				Not Qualified	e4
AD8315ARM	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified	e0			3 mm
AD8316ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-XQCC-N16		1 mm	4 mm	Not Qualified	e0			4 mm
ADN2821ACHIPS-05K	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-25 Cel		UPPER	R-XUUC-N15				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD9862BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3	30	260	20 mm
AD9860BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3	30	260	20 mm
HMC571LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1			3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel		QUAD	S-XQCC-N32		1.12 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
AD8315ACPZ-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.0129 mA	2.7 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	Matte Tin (Sn) - annealed	DUAL	R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e3			3 mm
HMC555	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N6				Not Qualified	e4
HMC560	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	3	DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N3				Not Qualified	e4
ADN2928	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B49		1.7 mm	6 mm	Not Qualified	e0			6 mm
AD9862BST	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e0		240	20 mm
AD8316ARM-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified	e0			3 mm
HMC571	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.5 V		UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N7				Not Qualified	e4
HMC5846LS6	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	1			7 V		CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel	-55 Cel		QUAD	S-XQCC-N16	3	1.09 mm	6 mm				260	6 mm
AD8316ACP-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.012 mA	2.7 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-XQCC-N16		1 mm	4 mm	Not Qualified	e0			4 mm
AD9862BSTZRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3	30	260	20 mm
AD8316ACP-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.012 mA	2.7 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N16		1 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
AD8316ARM	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified	e0			3 mm
ADN2820ACHIPS	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-15 Cel		UPPER	R-XUUC-N14				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD8316ARM-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified	e0			3 mm
ADN2821ACHIPS-10K	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-25 Cel		UPPER	R-XUUC-N15				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD9862BSTRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e0		240	20 mm
HMC571LC5	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1			3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel	GOLD OVER NICKEL	QUAD	S-XQCC-N32	3	1.12 mm	5 mm	Not Qualified	e4		260	5 mm
AD8315ARM-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	Tin/Lead (Sn85Pb15)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0		240	3 mm
AD8315ARM-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified	e0			3 mm
ADN2821ACHIPS-02K	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-25 Cel		UPPER	R-XUUC-N15				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD8315ACP-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.0129 mA	2.7 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e0		240	3 mm
AD9860BSTRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e0		240	20 mm
HMC572	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.5 V		UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N7				Not Qualified	e4
MAX2850ITK+T	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N68	3	.8 mm	10 mm		e3	30	260	10 mm
MAX2850ITK+	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N68	3	.8 mm	10 mm	Not Qualified	e3	30	260	10 mm
TCP-3082N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-4133UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
TCP-4118UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
TCP-3068N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCC-106B-RT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B20		.65 mm	2.23 mm					2.58 mm
TCP-3033H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-4133UA-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.862 mm
TCP-3156H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.15 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B12		.32 mm	.652 mm			NOT SPECIFIED	NOT SPECIFIED	1.134 mm
MTK-40130	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE				85 Cel	-30 Cel		DUAL	R-PDSO-G28				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.