Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
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STMicroelectronics |
TELECOM CIRCUIT |
MATTE TIN |
3 |
e3 |
260 |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
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STMicroelectronics |
TELECOMM CIRCUIT |
3 |
260 |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOMM CIRCUIT |
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STMicroelectronics |
TELECOMM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
18 |
XMA |
RECTANGULAR |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.5 mm |
85 Cel |
-40 Cel |
TRIPLE |
.8 Mbps |
R-XXMA-N18 |
2.9 mm |
11.6 mm |
13.5 mm |
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STMicroelectronics |
TELECOMM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.45 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
.4 mm |
105 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B25 |
.9 mm |
2.2 mm |
also operates with 1.8v supply |
NOT SPECIFIED |
NOT SPECIFIED |
2.2 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
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STMicroelectronics |
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STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
34 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B34 |
.5 mm |
2.56 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.66 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
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STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
BALL |
49 |
BGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
105 Cel |
-40 Cel |
BOTTOM |
2 Mbps |
S-XBGA-B49 |
.42 mm |
3.14 mm |
3.14 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
BALL |
49 |
BGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
2 Mbps |
S-XBGA-B49 |
.42 mm |
3.14 mm |
3.14 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.4 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
OTHER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
3 V |
IN-LINE |
2.54 mm |
85 Cel |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
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STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
QUAD |
S-PQFP-G64 |
3 |
Not Qualified |
e1 |
30 |
260 |
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STMicroelectronics |
TELECOM CIRCUIT |
BALL |
49 |
BGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
105 Cel |
-40 Cel |
BOTTOM |
2 Mbps |
S-XBGA-B49 |
.42 mm |
3.14 mm |
3.14 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
QUAD |
S-PQFP-G64 |
3 |
Not Qualified |
e1 |
30 |
260 |
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STMicroelectronics |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
8.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.