STMicroelectronics Other Function Telecom Interface ICs 625

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

STA5635S

STMicroelectronics

TELECOM CIRCUIT

MATTE TIN

3

e3

260

STA8135GATR

STMicroelectronics

TELECOM CIRCUIT

S2-LPSQTR

STMicroelectronics

TELECOM CIRCUIT

L3751

STMicroelectronics

STA8135GA

STMicroelectronics

TELECOMM CIRCUIT

3

260

STA5635STR

STMicroelectronics

TELECOM CIRCUIT

TESEO-VIC3DTR

STMicroelectronics

TELECOMM CIRCUIT

STA8100GATR

STMicroelectronics

TELECOMM CIRCUIT

ST25TV02KC-TFF9

STMicroelectronics

TELECOM CIRCUIT

ST25TV512C-TFG9

STMicroelectronics

TELECOM CIRCUIT

ST25TV512C-TFF9

STMicroelectronics

TELECOM CIRCUIT

ST25TV02KC-TFG9

STMicroelectronics

TELECOM CIRCUIT

ST25TV512C-AFF9

STMicroelectronics

TELECOM CIRCUIT

ST25TV02KC-TFH9

STMicroelectronics

TELECOM CIRCUIT

ST25TV512C-AFG9

STMicroelectronics

TELECOM CIRCUIT

ST25TV512C-TFH9

STMicroelectronics

TELECOM CIRCUIT

ST25TV02KC-AFG9

STMicroelectronics

TELECOM CIRCUIT

ST25TV02KC-AFH9

STMicroelectronics

TELECOM CIRCUIT

ST25TV512C-AFH9

STMicroelectronics

TELECOM CIRCUIT

ST25TV02KC-AFF9

STMicroelectronics

TELECOM CIRCUIT

SPBT4.0DP

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

18

XMA

RECTANGULAR

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.5 mm

85 Cel

-40 Cel

TRIPLE

.8 Mbps

R-XXMA-N18

2.9 mm

11.6 mm

13.5 mm

TESEO-LIV4FTR

STMicroelectronics

TELECOMM CIRCUIT

ST60A2G0C1C7GYO

STMicroelectronics

TELECOM CIRCUIT

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.45 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

.4 mm

105 Cel

-40 Cel

BOTTOM

100 Mbps

S-PBGA-B25

.9 mm

2.2 mm

also operates with 1.8v supply

NOT SPECIFIED

NOT SPECIFIED

2.2 mm

ST60A2G0

STMicroelectronics

TELECOM CIRCUIT

ST60A3G1

STMicroelectronics

TELECOM CIRCUIT

TDA7541W

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

STM32WB55CG

STMicroelectronics

STRADA770

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

BLUENRGCSP

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

34

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B34

.5 mm

2.56 mm

NOT SPECIFIED

NOT SPECIFIED

2.66 mm

TDA7541

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TDA7541WTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

BLUENRG-355MC

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

2 Mbps

S-PQCC-N48

3

1 mm

6 mm

e4

260

6 mm

BLUENRG-345VT

STMicroelectronics

TELECOM CIRCUIT

BALL

49

BGA

SQUARE

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

105 Cel

-40 Cel

BOTTOM

2 Mbps

S-XBGA-B49

.42 mm

3.14 mm

3.14 mm

BLUENRG-355VC

STMicroelectronics

TELECOM CIRCUIT

BALL

49

BGA

SQUARE

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

2 Mbps

S-XBGA-B49

.42 mm

3.14 mm

3.14 mm

BLUENRG-355MT

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

2 Mbps

S-PQCC-N48

3

1 mm

6 mm

e4

260

6 mm

TDA7212

STMicroelectronics

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

3 V

IN-LINE

2.54 mm

85 Cel

-20 Cel

TIN LEAD

DUAL

R-PDIP-T8

5.08 mm

7.62 mm

Not Qualified

e0

BLUENRG-355AT

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

105 Cel

-40 Cel

QUAD

2 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

BLUENRG-355AC

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

QUAD

2 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

TDA7541B

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

BLUENRGQTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TDA7541BWTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

TIN SILVER COPPER

QUAD

S-PQFP-G64

3

Not Qualified

e1

30

260

BLUENRG-355VT

STMicroelectronics

TELECOM CIRCUIT

BALL

49

BGA

SQUARE

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

105 Cel

-40 Cel

BOTTOM

2 Mbps

S-XBGA-B49

.42 mm

3.14 mm

3.14 mm

TDA7541BW

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

TIN SILVER COPPER

QUAD

S-PQFP-G64

3

Not Qualified

e1

30

260

STM32WB55RG

STMicroelectronics

TDA7541TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

TDA7541BTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

BLUENRG-332VC

STMicroelectronics

TELECOM CIRCUIT

BLUENRG-332VT

STMicroelectronics

TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.