STMicroelectronics Other Function Telecom Interface ICs 625

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Hybrid	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Battery Feed	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CRX14-MQ/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V			SMALL OUTLINE			1.27 mm	85 Cel		-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified					9.9 mm
M5916B1	STMicroelectronics
M2560NB1	STMicroelectronics
STA311BTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	90 Cel		-40 Cel		QUAD	S-XQCC-N56		1 mm			8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
SRT512-A3T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V		3		DIE OR CHIP	Other Telecom ICs		85 Cel		-20 Cel									Not Qualified
STA9100MGATR	STMicroelectronics	TELECOM CIRCUIT		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32		.8 mm					BOTTOM	S-PBGA-B81		1.7 mm			8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
MK2180AQ	STMicroelectronics		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			10 mA	5 V		5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44				T-1(DS1)		Not Qualified		e0
STV0196	STMicroelectronics		OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES					480 mA	3.3 V		3.3	FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G64						Not Qualified		e0
MK5025Q00/01	STMicroelectronics
STV0288	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm					QUAD	S-PQFP-G64		1.6 mm			10 mm	Not Qualified					10 mm
LB1020AF	STMicroelectronics			THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				-6 V	9 mA	6 V		+-6	IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm					DUAL	R-PDIP-T24						Not Qualified
ST7590	STMicroelectronics		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			30 mA	18 V		18	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-N48	3					Not Qualified		e3	40	260
SPWF04SC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V			MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel		-40 Cel		UNSPECIFIED	R-XXMA-N30		2.3 mm			15.24 mm				NOT SPECIFIED	NOT SPECIFIED	26.924 mm
L3234T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	7		RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			.003 mA	5 V		5	FLANGE MOUNT	GWZIP7H,.08,.26	Telephone Circuits		70 Cel		0 Cel		ZIG-ZAG	R-PZFM-T7						Not Qualified
SRIX512-A3T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V		3		DIE OR CHIP	Other Telecom ICs		85 Cel		-20 Cel									Not Qualified
STLC5465B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		5	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G160		4.07 mm			28 mm	Not Qualified		e4			28 mm
STLC60845	STMicroelectronics	TELECOM CIRCUIT		BALL	292	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V			GRID ARRAY								BOTTOM	S-PBGA-B292						Not Qualified
XRAG2-W4I/1GI	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1								UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		55 Cel		-20 Cel		UPPER	X-XUUC-N						Not Qualified
STA8089GA	STMicroelectronics	TELECOM CIRCUIT																																		NOT SPECIFIED	NOT SPECIFIED
STA8089A	STMicroelectronics	TELECOM CIRCUIT
GS-BT2416C2.AT1	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	45		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V			MICROELECTRONIC ASSEMBLY				70 Cel		-20 Cel		UNSPECIFIED	R-XXMA-X45						Not Qualified
STA8089GR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.1 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16		.4 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N56		.9 mm			7 mm						7 mm
STA8090EXGBDTR	STMicroelectronics	TELECOM CIRCUIT
EF73321P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS			40 mA	5 V		5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		e0
ST70134	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	80 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64		1.6 mm			10 mm	Not Qualified		e4			10 mm
L3845D	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					20 V		20	SMALL OUTLINE	SOP8,.25	Analog Transmission Interfaces	1.27 mm	70 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8		1.75 mm			3.9 mm	Not Qualified		e4			4.9 mm
SPBT2632C1A.AT2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1					2.5 V			MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel		-40 Cel		DUAL	R-XDMA-N24		2.9 mm			15.24 mm				NOT SPECIFIED	NOT SPECIFIED	26.9 mm
XRAG2-MATG/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.08,20	Other Telecom ICs	.5 mm	55 Cel		-20 Cel		DUAL	R-PDSO-N6		.6 mm			1.8 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	2 mm
L3000NSO	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V		5 V	2-4 CONVERSION	+-5	SMALL OUTLINE, HEAT SINK/SLUG	SOP20,.56	Analog Transmission Interfaces	1.27 mm	70 Cel	-48 AND +72	0 Cel	TIN LEAD	DUAL	R-PDSO-G20		3.6 mm			11 mm	Not Qualified	RESISTIVE	e0			15.9 mm
TS7524	STMicroelectronics
STC1041-F10S	STMicroelectronics		OTHER	GULL WING	208	QFP	SQUARE	CERAMIC	YES		CMOS				5 V		5	FLATPACK	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	100 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-XQFP-G208						Not Qualified		e0
ST25R3916-BQWT	STMicroelectronics	TELECOM CIRCUIT
STA8090EXGAJTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm			9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
EFB7510	STMicroelectronics
LB1026AB	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			1 mA			2/15	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	50 Cel		0 Cel		DUAL	R-PDIP-T8						Not Qualified
ST25TV02KC-TFG3	STMicroelectronics	TELECOM CIRCUIT
MK50H27N33	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS				5 V		5	IN-LINE	DIP48,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T48						Not Qualified		e3
BT-STA2416C1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	NO	1					3.3 V			MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL	R-XDMA-N						Not Qualified
LS656B	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			2 mA	2.5 V		2.5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel		-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16						Not Qualified		e0
L3030	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V	85 mA	5 V	2-4 CONVERSION	+-5	CHIP CARRIER	LDCC44,.7SQ	Analog Transmission Interfaces	1.27 mm	70 Cel	-48 TO 72	0 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.57 mm			16.5862 mm	Not Qualified	CONSTANT CURRENT/RESISTIVE	e0			16.5862 mm
STA8089GRTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.1 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16		.4 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N56		.9 mm			7 mm						7 mm
RSTA8088GA	STMicroelectronics
STLC5460P	STMicroelectronics
FC106/10	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G64		2.45 mm			10 mm	Not Qualified		e0			10 mm
LB1006AB	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			.9 mA			TIP-RING VOLTAGE	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel		-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8						Not Qualified		e0
MK68591J	STMicroelectronics
ST75C530PQFP	STMicroelectronics
SRT512-A5S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V		3		DIE OR CHIP	Other Telecom ICs		85 Cel		-20 Cel									Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.