STMicroelectronics Other Function Telecom Interface ICs 625

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
L4969MD	STMicroelectronics	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				14 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
STA8090F4GDTR	STMicroelectronics	TELECOM CIRCUIT
STSAFA100XSR8XXX	STMicroelectronics	TELECOM CIRCUIT
ST25R3917-AWLT	STMicroelectronics	TELECOM CIRCUIT
STA8088CWG	STMicroelectronics	TELECOM CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
SPBT2563C2A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	33		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X33			Not Qualified
QAMI5107	STMicroelectronics	TELECOM CIRCUIT								1																	Not Qualified
LB1010AD	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		22 mA		3/5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T18			Not Qualified
L3211	STMicroelectronics
LS025T	STMicroelectronics		OTHER	WIRE	10		ROUND	METAL			BIPOLAR		2.5 mA		-12/-30	CYLINDRICAL	CAN10,.23	Other Telecom ICs		85 Cel	-25 Cel		BOTTOM	O-MBCY-W10			Not Qualified
M5916F1	STMicroelectronics
L3092N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	-5 V		5 V	+-5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T28		15.24 mm	Not Qualified	e0			36.83 mm
STLC5464	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.65 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G160	4.07 mm	28 mm	Not Qualified	e0			28 mm
LRI2K-MBTG/4	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL	R-PDSO-N8			Not Qualified
STA260	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS				1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B289			Not Qualified
SRT512-A5T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel						Not Qualified
MK5025P00/01	STMicroelectronics
STLC2500A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B84	1.2 mm	6 mm	Not Qualified				6 mm
MK68591P	STMicroelectronics
SPWF01SC.11	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N25	2.45 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
STA8089GAT	STMicroelectronics	TELECOM CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
STA8100GADTR	STMicroelectronics	TELECOM CIRCUIT
ST5481TQF7	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e4			7 mm
STA8090EXGB	STMicroelectronics	TELECOM CIRCUIT
STA240	STMicroelectronics		INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS				1.2,3.3	GRID ARRAY	BGA288,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B288			Not Qualified
MK68590N	STMicroelectronics
STA5620TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.019 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32	1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MK50H27Q33	STMicroelectronics		COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC52,.8SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	S-PQCC-J52			Not Qualified	e3
MK50H25Q10/02	STMicroelectronics
STA8090F4GTR	STMicroelectronics	TELECOM CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
LRIS2K-MBTG	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL	R-PDSO-N8			Not Qualified
STA8089GATDTR	STMicroelectronics	TELECOM CIRCUIT
STB3300	STMicroelectronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			.06 mA	5 V	5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1.6 mm	7 mm	Not Qualified	e0			7 mm
ST25TV512C-TFG3	STMicroelectronics	TELECOM CIRCUIT
TEA7062DP	STMicroelectronics			THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					2.5 V	2.5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified	e0
PBL3726/8	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA		3.5/9	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16			Not Qualified	e0
L4969	STMicroelectronics	TELECOM CIRCUIT		GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				14 V		SMALL OUTLINE, HEAT SINK/SLUG			1.27 mm			MATTE TIN	DUAL	R-PDSO-G20	3.6 mm	11 mm	Not Qualified	e3			15.9 mm
C65SPACE-HSSL	STMicroelectronics	TELECOM CIRCUIT
STA8058ATR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS				2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104			Not Qualified
M7020R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272	2.6 mm	27 mm	Not Qualified				27 mm
STA2500DC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B48	1.25 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
STLC60243	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	-5 V		5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1.2 mm	4.4 mm	Not Qualified	e0			9.7 mm
M7020R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272	2.6 mm	27 mm	Not Qualified				27 mm
LRI2K-MBTG/2	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL	R-PDSO-N8			Not Qualified
STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B144			Not Qualified
M6579B1	STMicroelectronics
SRI4K-A4S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA		2.5/3.3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel						Not Qualified
LS356B1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16			Not Qualified	e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.