STMicroelectronics Other Function Telecom Interface ICs 625

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STMPE610QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	1	1 mm			3 mm	Not Qualified	e3	30	260	3 mm
SRI4K-A3S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA		2.5/3.3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel										Not Qualified
SPBT2563C1	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	24		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		DUAL		R-XDMA-X24						Not Qualified		NOT SPECIFIED	NOT SPECIFIED
XRAG2-W41/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1							UNCASED CHIP				55 Cel	-20 Cel		UPPER		X-XUUC-N						Not Qualified
STV0299B	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-10 Cel		QUAD		S-PQFP-G64		1.6 mm			10 mm	Not Qualified				10 mm
TEA7036DP	STMicroelectronics
ST25R3914-AQFT	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
STA8089GATR	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
STC101F10S	STMicroelectronics	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		FLATPACK			.65 mm		0 Cel	TIN LEAD	QUAD		R-PQFP-G100		3.4 mm			14 mm	Not Qualified	e0			20 mm
ST95HF-VMD5T	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	1	1 mm			5 mm		e4		260	5 mm
STA8090EXGTR	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
TEA7050DP	STMicroelectronics			THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					26 mA	2.8 V	2.8	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28						Not Qualified	e0
STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B676						Not Qualified
GS-BT2416C2.H	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	45		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-X45						Not Qualified
STA8090EXG	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
RSTA8088GATR	STMicroelectronics
LS288AB	STMicroelectronics
M7040N-100ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm			35 mm	Not Qualified	e0			35 mm
ST25R3917-BQWT	STMicroelectronics	TELECOM CIRCUIT
LRI2K-MBTG/3	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES					.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8						Not Qualified
STSAFA110S8XXXYY	STMicroelectronics
XRAG2-SBN18I/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1							UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		55 Cel	-20 Cel		UPPER		X-XUUC-N						Not Qualified
L3845D1013TR	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	70 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8		1.75 mm			3.9 mm	Not Qualified	e0			4.9 mm
EF6850EM	STMicroelectronics
STA8090EXGBD	STMicroelectronics	TELECOM CIRCUIT
E-STLC2500CTR	STMicroelectronics
STLC60133N	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			-6 V		6 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		1.2 mm			4.4 mm	Not Qualified				9.7 mm
STA8090WGBD	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	24 Mbps	S-PBGA-B208		1.7 mm			17 mm	Not Qualified	e1			17 mm
L3092FN	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V		5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm			11.5062 mm	Not Qualified	e0			11.5062 mm
STA8100GADS	STMicroelectronics	TELECOM CIRCUIT
STLC2415	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B120		1.4 mm			10 mm	Not Qualified				10 mm
STA8090F4GBDTR	STMicroelectronics	TELECOM CIRCUIT
ST6294M8	STMicroelectronics
STSAFA100XDFXXX	STMicroelectronics	TELECOM CIRCUIT
STA8090WGR	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
MTC20154TQ-C	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G64		1.6 mm			10 mm	Not Qualified				10 mm
STHVDAC-256MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B20		.64 mm			1.94 mm			NOT SPECIFIED	NOT SPECIFIED	2.23 mm
CRX14-MQ	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL		R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
STA8089GATTR	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
ST5451N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS				5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDIP-T28					15.24 mm	Not Qualified	e0			36.83 mm
EFB7332P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS			30 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
STLC60844	STMicroelectronics	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	8	BICMOS				3.3 V		GRID ARRAY							BOTTOM		S-PBGA-B196						Not Qualified
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm			1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
E-ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B208		1.7 mm			17 mm	Not Qualified				17 mm
XRAG2-W41/1GI	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1							UNCASED CHIP				55 Cel	-20 Cel		UPPER		X-XUUC-N						Not Qualified
STA8088	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm			7 mm					7 mm
STA8090GAD	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.