STMicroelectronics Other Function Telecom Interface ICs 625

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STB5701	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N32		1 mm		5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
SRI4K-A5S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA		2.5/3.3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel								Not Qualified
STA8089GATD	STMicroelectronics	TELECOM CIRCUIT
M104B1	STMicroelectronics	TELECOM CIRCUIT		THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS				5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified	e0
SRI512-A3T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel								Not Qualified
STM7E1AR	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			-3.3 V		3.3 V	+-3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm		10 mm	Not Qualified	e4	30	260	10 mm
E-STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B676	3				Not Qualified	e1
XRA00-W41/XXX	STMicroelectronics	TELECOM CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1							UNCASED CHIP							UPPER	R-XUUC-N
ST20GP6X33S	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQFP-G100		3.4 mm		14 mm	Not Qualified	e4			20 mm
ST21NFCB	STMicroelectronics	TELECOM CIRCUIT
FC106/14	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V	3.3	FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64		2.35 mm		14 mm	Not Qualified	e0			14 mm
L3845-20	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE	SOP20,.4	Analog Transmission Interfaces	1.27 mm	70 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified	e4			12.8 mm
LS288B	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO								IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel		DUAL	R-PDIP-T16					Not Qualified
M088F1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		MOS			180 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified	e0
STA8058TR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS					2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104					Not Qualified
ST20GP1X33S	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQFP-G100		3.4 mm		14 mm	Not Qualified	e4			20 mm
LS656D1	STMicroelectronics		OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			2 mA	2.5 V	2.5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20					Not Qualified	e0
STA8089TR	STMicroelectronics	TELECOM CIRCUIT
ST952	STMicroelectronics		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		HYBRID						FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G32					Not Qualified	e0
STW3101	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES						2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM	S-PBGA-B104					Not Qualified
PBL3726/12	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			100 mA		3.7/13	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18					Not Qualified	e0
ST72E94F1	STMicroelectronics
SPZB260-PRO	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	17		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-X17				13.7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	25 mm
E-STLC2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B120		1.4 mm		10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
STA8090FG	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B99		1.2 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8088GTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm		7 mm					7 mm
M7010R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
M7010R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm		27 mm	Not Qualified				27 mm
ST75C530	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				150 mA	5 V		FLATPACK, LOW PROFILE			.65 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.6 mm		14 mm	Not Qualified				14 mm
STA8088GA5	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm		8 mm					8 mm
STA5630A	STMicroelectronics	TELECOM CIRCUIT
STRADA431-TR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	40		SQUARE	UNSPECIFIED	YES	1		AEC-Q100			3.3 V			LCC40,.24SQ,20						QUAD	S-XQCC-N40				6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STLC5466	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G176		1.6 mm		24 mm	Not Qualified	e4			24 mm
STA5630TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Silver (Ag)	QUAD	S-XQCC-N32	3	1 mm		5 mm		e4	30	260	5 mm
STA8089	STMicroelectronics	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
L3092TFN	STMicroelectronics		INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		-5 V		5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J28					Not Qualified	e0
STB6100	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER			.5 mm			Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	3	1 mm		5 mm	Not Qualified	e3	30	260	5 mm
STA8089G	STMicroelectronics	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
STA8089GD	STMicroelectronics	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
MK2180AN	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40			T-1(DS1)		Not Qualified	e0
E-STLC2500D	STMicroelectronics
STA5620CTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL			VQCCN	SQUARE			1	BICMOS				2.7 V					.5 mm	85 Cel	-40 Cel	TIN			3	1 mm		5 mm		e3	30	260	5 mm
STSAFA110DFSFX02	STMicroelectronics
LS156B	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR						IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel		DUAL	R-PDIP-T16					Not Qualified
SRT512-A3S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel								Not Qualified
STA8088A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm		7 mm					7 mm
STA8090FGDTR	STMicroelectronics	TELECOM CIRCUIT
STLC2411	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B132		1.2 mm		8 mm	Not Qualified	e0			8 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.