STMicroelectronics Other Function Telecom Interface ICs 625

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
E-STLC2500DBTR	STMicroelectronics	TELECOM CIRCUIT
STLC1512	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e4			7 mm
STA8089GTR	STMicroelectronics	TELECOM CIRCUIT																												NOT SPECIFIED	NOT SPECIFIED
STA8088CFTR	STMicroelectronics	TELECOM CIRCUIT
ST25TV02KC-AFH3	STMicroelectronics	TELECOM CIRCUIT
STA8089GBDTR	STMicroelectronics	TELECOM CIRCUIT																												NOT SPECIFIED	NOT SPECIFIED
MK50H25P10/02	STMicroelectronics
LRIS2K-MBTG/3	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL	R-PDSO-N8				Not Qualified
M044F1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		MOS			5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T28				Not Qualified	e0
EF68A50JM	STMicroelectronics
STA8100GASTR	STMicroelectronics	TELECOM CIRCUIT
ST25R3917-BWLT	STMicroelectronics	TELECOM CIRCUIT
STS3922	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD			ROUND	UNSPECIFIED	YES	1							DIE OR CHIP			85 Cel	-25 Cel		UNSPECIFIED	O-XUUC-N
E-STLC2500DTR	STMicroelectronics
GS-BT2416C1.A	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED	51		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	R-XXMA-X51				Not Qualified
ST25TV512C-AFG3	STMicroelectronics	TELECOM CIRCUIT
ST25TV02KC-AFF3	STMicroelectronics	TELECOM CIRCUIT
EF68A50JV	STMicroelectronics
SPWF01SA.11	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N25		2.45 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B676				Not Qualified
TEA7052DP	STMicroelectronics			THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				26 mA	4 V	4	IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24				Not Qualified	e0
STV0360	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified				10 mm
ST25TV512C-TFF3	STMicroelectronics	TELECOM CIRCUIT
ST72T94B1	STMicroelectronics
STSAFA110DFXXXYY	STMicroelectronics
M7020R-050ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
SRIX512-A3S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
M3488F1	STMicroelectronics			THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40				Not Qualified	e0
STSAFA110S8SFX02	STMicroelectronics
STV0297E	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e4	30	260	10 mm
L3000NSOT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		-5 V		5 V		SMALL OUTLINE, HEAT SINK/SLUG			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G20		3.6 mm	11 mm	Not Qualified				15.9 mm
GS-BT2416C1.AT1	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	45		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	R-XXMA-X45				Not Qualified
LRIS2K-SBN18/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER										.15 mA		1.5/3		WAFER	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
ST25DV16KC	STMicroelectronics	TELECOM CIRCUIT
STA8089FGADTR	STMicroelectronics	TELECOM CIRCUIT																												NOT SPECIFIED	NOT SPECIFIED
LRIS2K-MBTG/1	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL	R-PDSO-N8				Not Qualified
LB1026AA	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL								BIPOLAR		1 mA		2/15		WAFER	Other Telecom ICs		50 Cel	0 Cel							Not Qualified
TESEO-DRAW	STMicroelectronics	TELECOM CIRCUIT
M7040N-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
SRIX512-A5T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
STI5300ZUA	STMicroelectronics	TELECOM CIRCUIT		BALL	336	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM	S-PBGA-B336				Not Qualified
SRIX4K-A3S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
LS588N1	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		150 mA			IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
STA8090EXGD	STMicroelectronics	TELECOM CIRCUIT
XRAG2-SBN18I/1GI	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		55 Cel	-20 Cel		UPPER	X-XUUC-N				Not Qualified
ETC5051J	STMicroelectronics
STSAFA100DFSPL02	STMicroelectronics	TELECOM CIRCUIT
SRI512-A3S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.