STMicroelectronics Other Function Telecom Interface ICs 625

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Hybrid	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	Battery Feed	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STA8089FGBD	STMicroelectronics	TELECOM CIRCUIT																																		NOT SPECIFIED	NOT SPECIFIED
STA8090EXGADTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
STBLC01QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1					3 V			CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N24		1 mm	5 mm					NOT SPECIFIED	NOT SPECIFIED	5 mm
STA8090FGD	STMicroelectronics	TELECOM CIRCUIT
STA8100GADSTR	STMicroelectronics	TELECOM CIRCUIT
ST4SIM-110S	STMicroelectronics	TELECOM CIRCUIT
STA2500D	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V		2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B48	3	1.25 mm	6 mm	Not Qualified			e1	30	260	6 mm
L3000N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	15		RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		-5 V	85 mA	5 V	2-4 CONVERSION	+-5	FLANGE MOUNT	SIP15,.1	Analog Transmission Interfaces	2.54 mm	70 Cel	-48 AND +72	0 Cel	TIN LEAD	SINGLE		R-PSFM-T15				Not Qualified		RESISTIVE	e0
SRIX4K-A5S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V		3		DIE OR CHIP	Other Telecom ICs		85 Cel		-20 Cel								Not Qualified
ST72T94B8	STMicroelectronics
EF68A50CV	STMicroelectronics
STA8090GTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm	8 mm							8 mm
SPBT2532C2.AT2	STMicroelectronics	TELECOM CIRCUIT
STA9100MGA	STMicroelectronics	TELECOM CIRCUIT		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32		.8 mm					BOTTOM		S-PBGA-B81		1.7 mm	8 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
STA8090FGBTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8089FGBDTR	STMicroelectronics	TELECOM CIRCUIT																																		NOT SPECIFIED	NOT SPECIFIED
STC104	STMicroelectronics		OTHER	GULL WING	208	QFP	SQUARE	CERAMIC	YES		CMOS				5 V		5	FLATPACK	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	100 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-XQFP-G208				Not Qualified			e0
ST25TV512C-AFF3	STMicroelectronics	TELECOM CIRCUIT
L3092NT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			-5 V		5 V			IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T28			15.24 mm	Not Qualified						36.83 mm
SRIX512-A4S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V		3		DIE OR CHIP	Other Telecom ICs		85 Cel		-20 Cel								Not Qualified
M7020R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified						27 mm
SPZB260	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V			MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N17				Not Qualified
LRIS2K-MBTG/2	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES					.15 mA			1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel		-20 Cel		DUAL		R-PDSO-N8				Not Qualified
TEA7530FP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.03 mA	3 V		3	SMALL OUTLINE	DIP8,.3	Telephone Circuits	1.27 mm	70 Cel		-20 Cel	TIN LEAD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified			e0			4.9 mm
SPBT2932DM	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1					2.5 V			MICROELECTRONIC ASSEMBLY				60 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N18		2.9 mm	11.6 mm					NOT SPECIFIED	NOT SPECIFIED	13.5 mm
MK5025Q	STMicroelectronics
LS025M	STMicroelectronics		OTHER	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			2.5 mA			-12/-30	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel		-25 Cel		DUAL		R-PDSO-G14				Not Qualified
SRIX512-A4T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V		3		DIE OR CHIP	Other Telecom ICs		85 Cel		-20 Cel								Not Qualified
STPAC01F2	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel		BOTTOM		S-PBGA-B8		.715 mm	1.57 mm	Not Qualified						1.57 mm
STA610	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-XQCC-N64		1 mm	9 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
GS-BT2416C1	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	51		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V			MICROELECTRONIC ASSEMBLY				70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-X51				Not Qualified
STA264	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES									GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B249				Not Qualified
STA8088TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N56		.9 mm	7 mm							7 mm
STA8090EXGA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	BOTTOM		S-PBGA-B169	3	1.2 mm	9 mm				e3		260	9 mm
STSAFA100S8SPL02	STMicroelectronics	TELECOM CIRCUIT
SRI512-A5S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V		3		DIE OR CHIP	Other Telecom ICs		85 Cel		-20 Cel								Not Qualified
STLC60133	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			-6 V		6 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified			e0			9.7 mm
SPBT2532C2.AT	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	1					3 V			MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel		-40 Cel		DUAL		R-XDMA-N14			10.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
ST25TV16K-AP6G3	STMicroelectronics	TELECOM CIRCUIT		NO LEAD		DIE	ROUND	UNSPECIFIED	YES	1								UNCASED CHIP	DIE OR CHIP			85 Cel		-40 Cel		UNSPECIFIED	.053 Mbps	X-XUUC-N
ST25RU3980-AQFT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel		-40 Cel		QUAD	5 Mbps	S-XQCC-N48		1 mm	7 mm		ESD for RF Pins 5,23,24 is 1C					7 mm
M7040N-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.5 V		1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified			e0			35 mm
STA8088CWTR	STMicroelectronics	TELECOM CIRCUIT
STA8090F4G	STMicroelectronics	TELECOM CIRCUIT																																		NOT SPECIFIED	NOT SPECIFIED
STS39230	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20		RECTANGULAR	PLASTIC/EPOXY	YES	1									BGA20(UNSPEC)			85 Cel		-25 Cel		BOTTOM		R-PBGA-B20
L3092TN	STMicroelectronics		INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		-5 V		5 V		+-5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28				Not Qualified			e0
STLC1502	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V			FLATPACK, FINE PITCH			.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified			e4			28 mm
TESEO-LIV4F	STMicroelectronics	TELECOM CIRCUIT
S2-LPSCBQTR	STMicroelectronics	TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.