STMicroelectronics Other Function Telecom Interface ICs 625

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

STLC1502P

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1

HCMOS

2.5 V

FLATPACK, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G208

4.1 mm

28 mm

Not Qualified

28 mm

LS356B

STMicroelectronics

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

50 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

L3845B

STMicroelectronics

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

20 V

20

IN-LINE

DIP8,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T8

5.08 mm

7.62 mm

Not Qualified

e3

LRIS64K-SBN18I/2

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

.15 mA

2 V

2

WAFER

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

SPBTLE-1STR

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

STA8089GB

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

STRADA770M

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

FC106

STMicroelectronics

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

3.3 V

3.3

FLATPACK

QFP64,.51SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G64

Not Qualified

e0

M7040N-066ZA1

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.5 V

1.5,2.5/3.3

GRID ARRAY

BGA388,26X26,50

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B388

2.46 mm

35 mm

Not Qualified

e0

35 mm

PBL3726/6

STMicroelectronics

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

100 mA

3.7/13

IN-LINE

DIP18,.4

Other Telecom ICs

2.54 mm

70 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

e0

E-STLC61266

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B676

3

Not Qualified

e1

ST25DV04KC

STMicroelectronics

TELECOM CIRCUIT

STB6100T

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

32

VQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER

.5 mm

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

CRX14-MQP

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

1.75 mm

3.9 mm

Not Qualified

e4

9.9 mm

E-STLC60243

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

Not Qualified

e3/e4

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

ST7291C6M1

STMicroelectronics

STLC5432Q

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G44

1.6 mm

CEPT PCM-30/E-1

10 mm

Not Qualified

e0

10 mm

ST72E94F8

STMicroelectronics

STA8090F4GB

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

SN250QT

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

SPZB32W1A1.1

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

26

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N26

3.925 mm

16.4 mm

26.5 mm

STA5630ATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

SPWF01SA.21

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N25

2.45 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

SRIX4K-A3T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

3 V

3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

TEA7091FQ

STMicroelectronics

STA8090F4GBTR

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

SPZB32W1C1.1

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

26

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N26

3.925 mm

16.4 mm

26.5 mm

MTC20136MB-I1

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B160

1.7 mm

12 mm

Not Qualified

e1

12 mm

PBL3726/11

STMicroelectronics

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

100 mA

3.7/13

IN-LINE

DIP18,.3

Other Telecom ICs

2.54 mm

70 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

e0

STA8090EXGAD

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

M3444F1

STMicroelectronics

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC

NO

MOS

5 V

5

IN-LINE

DIP28,.6

Other Telecom ICs

2.54 mm

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T28

Not Qualified

e0

TS75320CP

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5 V

5

IN-LINE

DIP48,.6

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T48

Not Qualified

e0

LRI64-MBTG/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

.15 mA

1.5/3

SMALL OUTLINE

SOLCC8,.11,20

Other Telecom ICs

.5 mm

85 Cel

-20 Cel

DUAL

R-PDSO-N8

Not Qualified

L3000TNSO

STMicroelectronics

STA264TR

STMicroelectronics

INDUSTRIAL

BALL

249

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

BGA249,17X17,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B249

Not Qualified

L3212

STMicroelectronics

STEPHY1

STMicroelectronics

STA8090EXGAJD

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

ST25DV64KC

STMicroelectronics

TELECOM CIRCUIT

GS-BT2416C1.H

STMicroelectronics

TELECOM CIRCUIT

OTHER

UNSPECIFIED

51

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-X51

Not Qualified

ST3854

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

NMOS

.15 mA

2.7 V

3

SMALL OUTLINE

SOP28,.4

Telephone Circuits

1.27 mm

55 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

e0

17.9 mm

ST25TV02KC-TFH3

STMicroelectronics

TELECOM CIRCUIT

STB5701TR

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

BPF8089-01SC6

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

M7020R-066ZA1T

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

1.8,2.5/3.3

GRID ARRAY

BGA272,20X20,50

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B272

2.6 mm

27 mm

Not Qualified

27 mm

MK5025P-I

STMicroelectronics

M105B1

STMicroelectronics

TELECOM CIRCUIT

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

5 V

5

IN-LINE

DIP24,.6

Other Telecom ICs

2.54 mm

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T24

Not Qualified

e0

STA8100GAS

STMicroelectronics

TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.