STMicroelectronics Other Function Telecom Interface ICs 625

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STA8089FGATR	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
STLC5465	STMicroelectronics		COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES				5 V	5	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.635 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G160						Not Qualified	e0
M7040N-100ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm			35 mm	Not Qualified	e0			35 mm
ST25R3910-BQFT	STMicroelectronics	TELECOM CIRCUIT
CRX14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	20 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3					Not Qualified	e4	30	260
STA8088CFGBTR	STMicroelectronics	TELECOM CIRCUIT
M7010R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm			27 mm	Not Qualified				27 mm
STLC2500ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B84		1.2 mm			6 mm	Not Qualified				6 mm
EF68A50CM	STMicroelectronics
STA8058A	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104						Not Qualified
SPZB32W1A14	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N25		3.7 mm			16.4 mm					26.5 mm
ST70134A	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64		1.6 mm			10 mm	Not Qualified	e4			10 mm
SRI4K-A5T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS	.25 mA		2.5/3.3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel									Not Qualified
XRAG2-W4I/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		55 Cel	-20 Cel		UPPER	X-XUUC-N						Not Qualified
STA8089GBD	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
STA8088GATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.9 mm			7 mm		e3	40	260	7 mm
STLC2690WTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	61	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA61,8X8,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B61		.6 mm			3.315 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3.56 mm
ST75C540	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		FLATPACK, LOW PROFILE			.65 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.6 mm			14 mm	Not Qualified				14 mm
SPZB32W1A2.1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	26		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N26		3.925 mm			16.4 mm			NOT SPECIFIED	NOT SPECIFIED	26.5 mm
ST25R3916-AWLT	STMicroelectronics	TELECOM CIRCUIT																			TIN SILVER COPPER			1						e1		260
L3234	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	7		RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	.003 mA	5 V	5	FLANGE MOUNT	GWZIP7H,.08,.26	Telephone Circuits		70 Cel	0 Cel		ZIG-ZAG	R-PZFM-T7						Not Qualified
FINGERTIP	STMicroelectronics	TELECOM CIRCUIT
ST25TV02KC-AFG3	STMicroelectronics	TELECOM CIRCUIT
STA2500DCTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B48		1.25 mm			6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
SPZB32W1C2.1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	26		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N26		3.925 mm			16.4 mm			NOT SPECIFIED	NOT SPECIFIED	26.5 mm
EF7510C	STMicroelectronics
STA8089FGD	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
ST25RU3993-AQFT	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
STW3100	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES				2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM	S-PBGA-B104						Not Qualified
ST25R3915-AQWT	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
MK68591N	STMicroelectronics
SPBT2632C2A.AT2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED	YES	1			2.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	NICKEL GOLD	UNSPECIFIED	R-XXMA-N16	3				11.6 mm		e4		245	13.5 mm
SRI4K-A3T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS	.25 mA		2.5/3.3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel									Not Qualified
STA8090F4GD	STMicroelectronics	TELECOM CIRCUIT
STLC1502D	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	HCMOS		2.5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e0			28 mm
CR14-MQP/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
EFB7332C	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS	30 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-XDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
ST72T94M1	STMicroelectronics
SRI4K-A4T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS	.25 mA		2.5/3.3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel									Not Qualified
ST25TV512C-AFH3	STMicroelectronics	TELECOM CIRCUIT
SRT512-A4S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS	.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel									Not Qualified
EF7150P	STMicroelectronics
M7020R-050ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm			27 mm	Not Qualified				27 mm
STA8088GA5TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm			8 mm					8 mm
STA260TR	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B289						Not Qualified
LB1004AC	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	1.9 mA		TIP-RING VOLTAGE	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T16						Not Qualified
STA8088CF	STMicroelectronics	TELECOM CIRCUIT
STA311B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	90 Cel	-40 Cel		QUAD	S-XQCC-N56		1 mm			8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.