STMicroelectronics Other Function Telecom Interface ICs 625

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ST72T94M8	STMicroelectronics
STA8089GBTR	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
L3000NT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	15		RECTANGULAR	PLASTIC/EPOXY	NO	1			-5 V	85 mA	5 V		FLANGE MOUNT				70 Cel	0 Cel		SINGLE	R-PSFM-T15				Not Qualified
STA8090G	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.9 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
SRI512-A5T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
CRX14-MQP/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
LS285AB1	STMicroelectronics		OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			120 mA			IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T14				Not Qualified	e0
GS-BT2416C2	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	45		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	R-XXMA-X45				Not Qualified
STA8089FGA	STMicroelectronics	TELECOM CIRCUIT																					MATTE TIN			3				e3		260
STA8090GAT	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
STA8089FGDTR	STMicroelectronics	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
M7040N-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
SPZB32W1C14	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N25		3.7 mm	16.4 mm					26.5 mm
STA8090GATD	STMicroelectronics	TELECOM CIRCUIT
LRI2K-MBTG/1	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES					.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL	R-PDSO-N8				Not Qualified
STD8010AWB	STMicroelectronics	TELECOM CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM	S-PBGA-B				Not Qualified
STA2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B120		1.4 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TEA7530DP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			.03 mA	3 V	3	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e0
L3280B	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR				20 V	20	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	55 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T14				Not Qualified	e0
MTC20136PQ-I1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G144		4.07 mm	28 mm	Not Qualified				28 mm
SPBT3.0DP2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N18		3 mm	11.6 mm			NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SPWF01SC.21	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N25		2.45 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
MTC20455MB-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	BOTTOM	S-PBGA-B160		1.7 mm	12 mm	Not Qualified	e1			12 mm
STLC2500	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B84		1.2 mm	6 mm	Not Qualified	e1		260	6 mm
L3000TN	STMicroelectronics
CR14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
STA8088CFB	STMicroelectronics	TELECOM CIRCUIT
SRIX4K-A5T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS			.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
XRAG2-MATG/1GI	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.08,20	Other Telecom ICs	.5 mm	55 Cel	-20 Cel		DUAL	R-PDSO-N6		.6 mm	1.7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	1.9 mm
UAA4009	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR				12 V	12	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18				Not Qualified	e0
E-STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144				Not Qualified	e1
STLC2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B120		1.4 mm	10 mm	Not Qualified	e0			10 mm
STA260-8X8	STMicroelectronics		INDUSTRIAL	BALL	244	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS					1.2,2.5	GRID ARRAY, FINE PITCH	BGA244,18X18,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B241				Not Qualified
ST75C540PQFP	STMicroelectronics
STLC1511	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e4			10 mm
STA8090EXGDTR	STMicroelectronics	TELECOM CIRCUIT
STA8100GAD	STMicroelectronics	TELECOM CIRCUIT
EF68B50C	STMicroelectronics
STHVDAC-253C7	STMicroelectronics	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,14		.35 mm	85 Cel	-30 Cel		BOTTOM	R-XBGA-B12		.64 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.45 mm
STLC2410B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B132		1.2 mm	8 mm	Not Qualified	e1			8 mm
E-STLC2500C	STMicroelectronics
STLC2150	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.7 V	2.7,3/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified	e3/e4		260	7 mm
FTM5CU56AA1BE	STMicroelectronics	TELECOM CIRCUIT
STA8090FGTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B99		1.2 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8058	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS					2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104				Not Qualified
CR14-MQ/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
TEA7052D	STMicroelectronics			GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					26 mA	4 V	4	SMALL OUTLINE	SOP28,.5	Other Telecom ICs	1.27 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28				Not Qualified	e0
STA8090EXGAJDTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.