Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD8312ACBZ-P7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm	.95 mm	Not Qualified	e1	40	260	1.45 mm
AX-SFAZ-API-1-01-TB05	Onsemi	TELECOM CIRCUIT																					Nickel/Palladium/Gold (Ni/Pd/Au)								e4
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGM210PA22JIA2R	Silicon Labs
BLUENRG-345AT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
BMD-301-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N
CC430F5135IRGZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
EFR32BG21A010F1024IM32-B	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	125 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N32	2	.9 mm	4 mm			40	260	4 mm
ELLA-W161-00B	U-blox Ag
HMC8200LP5ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	1 mm	5 mm		e4		260	5 mm
LTC5586IUH#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	.8 mm	6 mm		e3	30	260	6 mm
MAX-M8C	U-blox Ag	TELECOM CIRCUIT
MAX2851ITK+T	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N68	3	.8 mm	10 mm		e3	30	260	10 mm
MAX7060ATG+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAYA-W166-01B	U-blox Ag	TELECOM CIRCUIT
MGM12P02F1024GE-V2	Silicon Labs	TELECOM CIRCUIT
NINA-W102-00B-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	1		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B1	4	4.2 mm	10 mm					14 mm
NINA-W151-03B	U-blox Ag	TELECOM CIRCUIT																									4
NRF51822-CEAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel	-25 Cel		BOTTOM		R-PBGA-B62		.55 mm	3.5 mm			NOT SPECIFIED	NOT SPECIFIED	3.83 mm
RFFC2071SR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
RFFC5072ATR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm					5 mm
RFSA3513PCK-410	Qorvo	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
RS9116N-DB00-CC1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	107	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.85 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N107
RTL8152BN-VB-CG	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.05 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N48		1 mm	6 mm					6 mm
SI4311-B21-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL			HVQCCN				1		CMOS			3.3 V					.5 mm	85 Cel	-40 Cel						.9 mm	3 mm					3 mm
SST12LP17E-QU8E	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	3	.6 mm	2 mm		e3			2 mm
SX1273IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	3	1 mm	6 mm		e3		260	6 mm
TLE8457ASJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm			TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
WGM160PX22KGA3R	Silicon Labs	TELECOM CIRCUIT
AD6624AABCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e1		260	15 mm
AD8314ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	UNSPECIFIED	YES	1					3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e3	30	260	3 mm
ADN2915ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.3774 mA	3.3 V	1.2,1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3			4 mm
BGX13P22GA-V21R	Silicon Labs	TELECOM CIRCUIT
CC8521RHAR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC8521RHAT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CL4490-1000-485-SP	Laird Technologies	RF AND BASEBAND CIRCUIT
CYBLE-212020-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31	3	2 mm	14.52 mm					19.2 mm
CYG2021	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			HYBRID		9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
CYW20734UA1KFFB3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	90	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		R-PBGA-B90		1.2 mm	8.5 mm					8.5 mm
DS100BR111SQE/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	10300 Mbps	S-XQCC-N24	3	.8 mm	4 mm		e3	30	260	4 mm
ENW89835A1KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N		2 mm	8.7 mm			50	250	15.6 mm
EYSGCNAWY-VX	Taiyo Yuden	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
LEA-6H-0-002	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	PLASTIC/EPOXY	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-PDMA-N28	4	2.7 mm	17 mm					22.4 mm
LTC5596HDC#TRMPBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e3		260	2 mm
NEO-M8L-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100				MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24						NOT SPECIFIED	NOT SPECIFIED
NORA-B100-00B	U-blox Ag	TELECOM CIRCUIT
NTP52101G0JTZ	NXP Semiconductors																										1						260
ONET8501PRGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified	e4	NOT SPECIFIED	260	3 mm

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.