Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
BGS13PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		TIN	BOTTOM		R-XBCC-B10	1	.4 mm		1.1 mm		e3			1.5 mm
BGS13S2N9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	1	MOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN	BOTTOM		S-XBGA-B9	1	.4 mm		1.1 mm		e3			1.1 mm
BM78SPPS5MC2-0004AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm		12 mm		e4	40	255	22 mm
BTM431	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X							NOT SPECIFIED	NOT SPECIFIED
CSR1013A05-IUUM-R	Qualcomm	TELECOM CIRCUIT
DS2409P+T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-C6	1	1.5 mm		3.76 mm	Not Qualified	e3	30	260	3.94 mm
DS2409P/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-C6	1	1.5 mm		3.76 mm	Not Qualified	e0			3.94 mm
EFR32BG13P532F512GM48-B	Silicon Labs	TELECOM CIRCUIT
EFR32BG21A010F512IM32-B	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	125 Cel	-40 Cel		MATTE TIN	QUAD	2 Mbps	S-XQCC-N32	2	.9 mm		4 mm		e3	40	260	4 mm
EYSGJNAWY-VX	Taiyo Yuden	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
EYSLCNZWW	Taiyo Yuden	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
FIDO2100BGA128IR0	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	128	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B128		1.3 mm		10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC1023LP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N32	1	1 mm		5 mm		e3	30	260	5 mm
MAX-8Q	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel			DUAL		R-PDSO-N18							NOT SPECIFIED	NOT SPECIFIED
MAX9152ESE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.07 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified	e0			9.9 mm
MAX9152ESE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	9.9 mm
MAYA-W276-00B	U-blox Ag	TELECOM CIRCUIT																									4
MFRC63002HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel			QUAD		S-PQCC-N32	1	1 mm		5 mm			30	260	5 mm
MLX90109EDC-AAA-000-TU	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G8	1	1.72 mm		3.9 mm		e3		260	4.9 mm
PN7161A1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT																									3						NOT SPECIFIED	260
RN41N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		MATTE TIN	QUAD		R-XQMA-N35		2.2 mm		13.2 mm		e3			20.1 mm
RN42N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm		13.4 mm		e4			20.5 mm
SA5224D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.035 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G16		1.75 mm		3.9 mm	Not Qualified				9.9 mm
SARA-G450-01C	U-blox Ag	TELECOM CIRCUIT
SARA-G450-01C-01	U-blox Ag	TELECOM CIRCUIT
SI32919-A-FSR	Silicon Labs
ST60-2230C-U	Laird Technologies	TELECOM CIRCUIT
TMS3705BDRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm		3.91 mm	Not Qualified	e4	30	260	9.9 mm
VSC8491YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel			BOTTOM	10000 Mbps	S-PBGA-B196		1.4 mm		15 mm					15 mm
W2SG0084I-B-T	Wi2wi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			QUAD		R-XQMA-N24	1	2.3 mm		11.2 mm				245	12 mm
WF111-N-V1	Silicon Labs	TELECOM CIRCUIT
XBP9X-DMRS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
XPD1001000-01	Lantronix	SERIAL DEVICE SERVER		PIN/PEG	24	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL	.921 Mbps	R-XDMA-P24		11.7602 mm		31.75 mm					43.2308 mm
XR2211ACDTR-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			12 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		MATTE TIN	DUAL		R-PDSO-G14	2	1.75 mm		3.9 mm	Not Qualified	e3			8.65 mm
090-02789-012	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	80 Cel	-40 Cel			DUAL		R-XDMA-P9		11.68 mm		35.3 mm					40.64 mm
AD73311ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified	e0	30	240	7.2 mm	YES
AD8312ACBZ-P2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm		.95 mm	Not Qualified	e1	40	260	1.45 mm
ADF7012BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified	e3		260	7.8 mm
ADRF6821ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm		8 mm		e4	30	260	8 mm
ADRV9008BBCZ-2REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B196	3	1.27 mm		12 mm				260	12 mm
ATA5744N-TKQY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0087 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1			4.4 mm	Not Qualified	e3		260	6.625 mm
ATA5746-PXPW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.01 mA	3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel			QUAD		S-XQCC-N24		1 mm		5 mm	Not Qualified				5 mm
ATSAMW25H18-MR210PB1952	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N51		2.138 mm		14.908 mm					33.864 mm
CC1121RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm		5 mm	Not Qualified	e4	30	260	5 mm
CC2564BRVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm		7.73 mm		e3	30	260	8 mm
CC430F6137IRGC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm		9 mm	Not Qualified	e4	30	260	9 mm
DA16600MOD-AAC4WA32	Renesas Electronics	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
ENW89823C4KF	Panasonic	TELECOM CIRCUIT

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.