Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3120EUA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
NINA-W152-00B-01	U-blox Ag
NINA-W152-03B	U-blox Ag	TELECOM CIRCUIT																									4
NINA-W156-03B	U-blox Ag	TELECOM CIRCUIT																									4
PN5120A0HN/C2,518	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES							1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified		e4	30	260
RFFC5072TR7	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
RM024-S10-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.5 Mbps	R-XXMA-X					ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
SA612AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified		e4		260	7.8 mm
SC1894A-00C13	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		.9 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
SC1894A-00M13	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		.9 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
SKY66112-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N22	3	1.1 mm	3 mm			e4		260	3.5 mm
ST60-2230C	Laird Technologies	TELECOM CIRCUIT
STA8089FGAD	STMicroelectronics	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
TUSB211QRWBRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
UBX-M8030-CT	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BALL	47	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-PBGA-B47	1
XB3-24ARS	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUS-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XBP9X-DMUS-011	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XBRR-24Z8UT-J	Digi International	TELECOM CIRCUIT
ZM5101A-CME3R	Silicon Labs	TELECOM CIRCUIT
450-0152C	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47	4	2.14 mm	15.5 mm					245	21 mm
453-00046R	Laird Technologies	TELECOM CIRCUIT																															50	250
ADMV4801BCCZ	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	LGA	SQUARE	UNSPECIFIED	YES	1							GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-XBGA-N72	3						30	260
ADN2830ACP32	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e0		240	5 mm
ADV7480WBBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100		1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	3	1.4 mm	9 mm			e1			9 mm
BGM121N256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm				40	260	6.5 mm
BT111-A-HCI	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	21		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N21		2.31 mm	9.3 mm						13.05 mm
CC1125RHMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm	5 mm	Not Qualified		e4	30	260	5 mm
CC2430ZF128RTCRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC2530F64RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
ENW89823A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm				40	250	9.5 mm
JODY-W377-00A	U-blox Ag	TELECOM CIRCUIT
KSZ8695PI	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY	BGA289,17X17,40		1 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B289		2.36 mm	19 mm						19 mm
L26-M33	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24		2.4 mm	12.2 mm		OPERATES FROM 2.8V TO 3.4V SUPPLY				16 mm
LTC5800IWR-IPRA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	SILVER	QUAD		S-PQCC-N72		1 mm	10 mm			e4			10 mm
MGM111A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm	12.9 mm						15 mm
MRF24J40-I/ML	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	1 mm	6 mm	Not Qualified		e3		260	6 mm
MRF24J40MB-I/RM	Microchip Technology		INDUSTRIAL		12			PLASTIC/EPOXY								2.5/3.3		MODULE,12LEAD,.9	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
MRF24WG0MA-I/RM110	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
NINA-B111-03B	U-blox Ag	TELECOM CIRCUIT																									4
OPA381AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PN5120A0ET/C2QL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES					100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified				260
RI-I03-114A-S1	Texas Instruments	TELECOM CIRCUIT	OTHER							1											70 Cel	-25 Cel								Not Qualified			NOT SPECIFIED	NOT SPECIFIED
RI-I11-114B-S1	Texas Instruments	TELECOM CIRCUIT	OTHER							1											70 Cel	-25 Cel								Not Qualified			NOT SPECIFIED	NOT SPECIFIED
RN42SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN4678U-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949				MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)			70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N30		1.8 mm	12 mm						15 mm
RS9113-NB0-D1C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.