Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
PLMK05318RGZT	Texas Instruments	TELECOM CIRCUIT
PM5980B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY								BOTTOM		S-PBGA-B1932
PN7161B1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT																									3							NOT SPECIFIED	260
RS9113-N00-D1W-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SI32391-B-FM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel			QUAD		S-XQCC-N48		.9 mm		7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
ST25RU3992-BQFT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	64		SQUARE	UNSPECIFIED	YES	1							LCC64(UNSPEC)							QUAD		S-XQCC-N64						Operates from 4.1V to 5.5V Supply
ST7570	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.03 mA	13 V	13	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD		S-PQFP-G48	3	1 mm		7 mm	Not Qualified		e3	40	260	7 mm
ST7570TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.03 mA	13 V	13	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQFP-G48	3	1 mm		7 mm	Not Qualified		e3	40	260	7 mm
SY88403BLEY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G10		1.1 mm		3 mm	Not Qualified		e3			3 mm
SY88403BLMG-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	4250 Mbps	S-XQCC-N16	2	1 mm		3 mm	Not Qualified		e4	40	260	3 mm
XBRR-24Z8UT	Digi International	TELECOM CIRCUIT
455-00003	Laird Technologies	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
AD73322AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1.2 dB	TIN LEAD	DUAL		R-PDSO-G28	3	2.65 mm	16-BIT	7.5 mm	Not Qualified		e0		240	17.9 mm	YES
AD73322AST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	85 Cel	-40 Cel	1.2 dB	TIN LEAD	QUAD		S-PQFP-G44	3	1.6 mm	16-BIT	14 mm	Not Qualified		e0		240	14 mm	YES
AD73322AST-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	85 Cel	-40 Cel	1.2 dB	TIN LEAD	QUAD		S-PQFP-G44	3	1.6 mm	16-BIT	14 mm	Not Qualified		e0		240	14 mm	YES
AD8314ACP-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-XDSO-N8	1	1 mm		2 mm	Not Qualified		e0		240	3 mm
AD8314ACP-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-XDSO-N8	1	1 mm		2 mm	Not Qualified		e0		240	3 mm
AD8314ARM	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0		240	3 mm
AD8314ARM-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0		240	3 mm
AD8314ARMZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3		260	3 mm
ADN2830ACP32-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-XQCC-N32	3	1 mm		5 mm	Not Qualified		e0		240	5 mm
ADN2830ACP32-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-XQCC-N32	3	1 mm		5 mm	Not Qualified		e0		240	5 mm
ADRV9004BBCZ-RL	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2				1 V		GRID ARRAY			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B196	3	1.25 mm		12 mm				30	260	12 mm
AFE7903IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1				.925 V		GRID ARRAY	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm		17 mm		ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e0		220	17 mm
BGS14GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm		2 mm			e4			2 mm
BGX220S22HNA21	Silicon Labs	TELECOM CIRCUIT
BLUENRG-345AC	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	2 Mbps	S-PQCC-N32	3	1 mm		5 mm			e4		260	5 mm
BQ500211RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N48	3	1 mm		7 mm			e4	NOT SPECIFIED	260	7 mm
CMX992Q3	Cml Microcircuits	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N48		1 mm		7 mm	Not Qualified					7 mm
CY7B933-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
CYBT-253059-02	Infineon Technologies	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
CYRF7936-40LFXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				2.4 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		MATTE TIN	QUAD		S-XQCC-N40	3	1 mm		6 mm	Not Qualified		e3	20	260	6 mm
EYSKBNZWB	Taiyo Yuden	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
FC20	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR		YES	1				3.3 V		CHIP CARRIER				85 Cel	-40 Cel			QUAD	433 Mbps	R-XQCC-N52		2.05 mm		13 mm		SEATED HGT NOMINAL				16.6 mm
FC20-Q73	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER	LCC52(UNSPEC)			85 Cel	-40 Cel			QUAD	433 Mbps	R-XQCC-N52		2.1 mm		13 mm		SEATED HEIGHT NOM CONSIDERED				16.6 mm
FC20N-Q73B	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	433 Mbps	R-XXMA-N52		2.1 mm		13 mm		Seated Hgt-Nom				16.6 mm
LA72910V-TLM-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel		TIN BISMUTH	DUAL		R-PDSO-G16	3				Not Qualified		e6	30	260
LTC5100EUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm		4 mm	Not Qualified		e3	30	260	4 mm
MICRF009YM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE	SOP16,.25		1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	.002 Mbps	R-PDSO-G16	1	1.895 mm		3.9 mm		Operates from 4.75V to 5.5V	e3	30	260	9.9 mm
MRF24J40MET-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N12		3.48 mm		22.86 mm						33.02 mm
NEO-7N-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		SILVER OVER NICKEL	DUAL		R-XDMA-N24		2.6 mm		12.2 mm			e4			16 mm
PGA5807ARGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm		9 mm			e4	30	260	9 mm
QN9080CHN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel			QUAD	2 Mbps	S-PQCC-N48		1 mm		6 mm						6 mm
RFPA5201ESR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	HTSON	SQUARE	UNSPECIFIED	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE				85 Cel	-40 Cel			DUAL		S-XDSO-N14		1.05 mm		7 mm						7 mm
RFPA5201ETR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	HTSON	SQUARE	UNSPECIFIED	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE				85 Cel	-40 Cel			DUAL		S-XDSO-N14		1.05 mm		7 mm						7 mm
RM191-SM	Laird Technologies	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
RS9113-N00-D1W-X68	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-N00-D1W-X72	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.