Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
90 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.8 mm |
2.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.4 mm |
|||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
30 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.524 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N30 |
2.3 mm |
15.24 mm |
NOT SPECIFIED |
NOT SPECIFIED |
26.924 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Digi International |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BUTT |
8 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER |
NICKEL GOLD |
BOTTOM |
S-XBCC-B8 |
3 |
2.25 mm |
5.215 mm |
Not Qualified |
e4 |
20 |
260 |
5.215 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-B31 |
2.15 mm |
12.9 mm |
15 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
10 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.85 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-XBCC-N10 |
1 |
.4 mm |
1.1 mm |
1.5 mm |
||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
.9 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N36 |
1.8 mm |
13 mm |
14.7 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
43 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.7 V |
MICROELECTRONIC ASSEMBLY |
MODULE,43LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N43 |
1.9 mm |
15 mm |
29 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Laird Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
UNSPECIFIED |
47 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.8 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-X47 |
2.4 mm |
12.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
46 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-B46 |
13.8 mm |
40 |
245 |
19.8 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
39 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N39 |
3.4 mm |
18 mm |
NOT SPECIFIED |
NOT SPECIFIED |
31.4 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G56 |
1 |
2.794 mm |
7.493 mm |
Not Qualified |
e3 |
30 |
260 |
18.415 mm |
|||||||||||||||||||||||||||||||||||||
|
Melexis N V |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.72 mm |
3.9 mm |
e3 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-XQCC-N48 |
.9 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0012 mA |
2.7 V |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
2A |
.85 mm |
5 mm |
Not Qualified |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
Qualcomm |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Realtek Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G100 |
1.7 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||||||||||||||||||||||||||||||||
|
Realtek Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G100 |
1.7 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
TELECOM CIRCUIT |
TIN LEAD |
3 |
e0 |
245 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
3 |
2 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
8.65 mm |
||||||||||||||||||||||||||||||||||||
|
Telit Communications Plc |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.9 mm |
8 mm |
e3 |
250 |
8 mm |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B576 |
4 |
2.83 mm |
25 mm |
e1 |
NOT SPECIFIED |
245 |
25 mm |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3/5 |
SMALL OUTLINE |
SOP20,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
1 dB |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
30 |
240 |
12.8 mm |
YES |
|||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.02 Mbps |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BINARY/TWOS COMP |
2 |
.00097 mA |
3.3 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
Codecs |
.5 mm |
70 Cel |
16 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
VOLTAGE |
3 |
1.6 mm |
12 mm |
Not Qualified |
DIFFERENTIAL |
3.4 V |
e4 |
30 |
260 |
12 mm |
|||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N56 |
1.4 mm |
6.5 mm |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N56 |
1.4 mm |
6.5 mm |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.4 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
3 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
250 |
31.4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-N16 |
1 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
TIN |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
TIN |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Melexis N V |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.72 mm |
3.9 mm |
e3 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.