Other Function Telecom Interface ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

PE64904MLBB-Z

Psemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

10

VQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.6 V

CHIP CARRIER, VERY THIN PROFILE

LCC10,.08SQ,20

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-XQCC-N10

1

.5 mm

2 mm

e4

30

260

2 mm

QN9020/DY

NXP Semiconductors

TELECOM CIRCUIT

3

260

RFFC5072A

Qorvo

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

RFFC5072ASR

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.95 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

SI4432-B1-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

SI4732-A10-GS

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

3

40

260

AD73311LARSZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0125 mA

3 V

3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Modems

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

2 mm

5.3 mm

Not Qualified

e3

260

7.2 mm

ATA3741P2-TGSY

Atmel

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.0086 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

7.4 mm

Not Qualified

e3

260

12.825 mm

BGM1032N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

BGM11S22F256GA-V2R

Silicon Labs

TELECOM CIRCUIT

NICKEL GOLD

3

e4

40

260

BQ500212ARGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

CY7B923-SXCT

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

.085 mA

5 V

5

SMALL OUTLINE

SOP28,.4

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

400 Mbps

R-PDSO-G28

3

2.67 mm

7.505 mm

Not Qualified

e4

30

260

17.905 mm

DNT24CA

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

30

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-T30

24.9 mm

38.1 mm

EFR32BG1V132F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

HMC1122LP4ME

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.95 mm

4 mm

4 mm

HMC625BLP5E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

3

1 mm

5 mm

e3

30

260

5 mm

LTC5596HDC#PBF

Analog Devices

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e3

2 mm

MAX3107ETG+TG3U

Analog Devices

1

30

260

MC33660BEFR2

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

e3

40

260

4.9 mm

MGM12P22F1024GA-V2

Silicon Labs

TELECOM CIRCUIT

MRF24WG0MB-I/RM10C

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N36

2.7 mm

21 mm

31 mm

NCV7428D13R2G

Onsemi

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

12 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

2

1.72 mm

3.937 mm

e3

30

260

4.927 mm

NEO-M8L-03A

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

NOT SPECIFIED

NOT SPECIFIED

NEO-M8L-04B

U-blox Ag

NOT SPECIFIED

NOT SPECIFIED

NEO-M8L-05B

U-blox Ag

TELECOM CIRCUIT

ODIN-W262-05B

U-blox Ag

4

245

PN5180A0HN/C3Y

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

SIM28ML

Simcom Wireless Solutions

TELECOM CIRCUIT

WGM110E1MV2R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

WT11U-A-AI4

Silicon Labs

TELECOM CIRCUIT

NO LEAD

28

DMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

3 Mbps

R-XDMA-N28

2.7 mm

14.5 mm

35.75 mm

XE1205I074TRLF

Semtech

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.075 mA

3.3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N48

.9 mm

8 mm

Not Qualified

e3

8 mm

XR2211ACD-F

Exar

TELECOM CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.009 mA

12 V

12

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G14

2

1.75 mm

3.9 mm

Not Qualified

e3

8.65 mm

ZGM130S037HGN2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

QCCN

SQUARE

YES

1.8 V

CHIP CARRIER

LCC64,.35SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N64

3

1.3 mm

9 mm

40

260

9 mm

450-0064R

Ls Research

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

52

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N52

4

1.9 mm

13 mm

18 mm

AD630KN/+

Analog Devices

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

-15 V

.005 mA

15 V

+-15

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

e0

AD73311ARZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e3

30

260

12.8 mm

AD73311ARZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e3

30

260

12.8 mm

AD73311LARS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0125 mA

3 V

3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Modems

.65 mm

105 Cel

-40 Cel

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1

2 mm

5.3 mm

Not Qualified

e0

30

240

7.2 mm

AD73311LARSZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0125 mA

3 V

3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Modems

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

2 mm

5.3 mm

Not Qualified

e3

260

7.2 mm

AD73311LARSZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0125 mA

3 V

3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Modems

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

2 mm

5.3 mm

Not Qualified

e3

40

260

7.2 mm

AD8015ARZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

26 mA

5 V

SMALL OUTLINE

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

Not Qualified

e3

ADRF6850BCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.44 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N56

3

1 mm

8 mm

Not Qualified

e3

8 mm

ADRV9003BBCZ-RL

Analog Devices

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

ATA5745-PXPW

Atmel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.01 mA

3 V

3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

1 mm

5 mm

Not Qualified

5 mm

ATA8401C-6AQY66

Atmel

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

11.6 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1.05 mm

3 mm

Not Qualified

3 mm

ATA8401C-6AQY-66

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.0116 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-55 Cel

MATTE TIN

DUAL

S-PDSO-G8

1.05 mm

3 mm

Not Qualified

e3

3 mm

AWL9966RS36P8

Ii-vi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

2

.6 mm

4 mm

Not Qualified

4 mm

BGM113A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

2.09 mm

9.15 mm

15.73 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.