Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
6.5 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.1 mm |
4.4 mm |
e4 |
30 |
260 |
7.8 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
3 mm |
3 mm |
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Pulse Electronics |
TELECOM CIRCUIT |
MILITARY |
GULL WING |
16 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
125 Cel |
-55 Cel |
DUAL |
R-PDMA-G16 |
3 |
Not Qualified |
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Wurth Elektronik |
TELECOM CIRCUIT |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
3 |
TLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY, THIN PROFILE |
1.22 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B3 |
1.08 mm |
2.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.35 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
1.25 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
2.3 mm |
12.05 mm |
18.1 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12 Mbps |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
e4 |
30 |
260 |
8 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
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|
Telit Communications Plc |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
2.6 mm |
11 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
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|
Telit Communications Plc |
TELECOM CIRCUIT |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
.45 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N72 |
1 |
1 mm |
10 mm |
30 |
260 |
10 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
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Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
1 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.01 mA |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
Not Qualified |
40 |
260 |
7.8 mm |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
Not Qualified |
7.8 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER |
75 Cel |
-10 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
2 |
e3 |
40 |
260 |
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|
Silicon Labs |
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Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
7.2 Mbps |
S-XQMA-N68 |
Operates with 3.4V TO 4.4V supply |
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|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Digi International |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
37 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N37 |
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Texas Instruments |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
.7 mm |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-N100 |
2 mm |
13.3 mm |
13.4 mm |
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Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3/5 |
SMALL OUTLINE |
SOP28,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
1.2 dB |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
YES |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N64 |
3 |
1 mm |
9 mm |
Not Qualified |
e3 |
260 |
9 mm |
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|
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
Not Qualified |
5 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBCC-N14 |
1 |
.65 mm |
2 mm |
2 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
10 |
BCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.85 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-XBCC-B10 |
1 |
.4 mm |
1.1 mm |
1.5 mm |
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Silicon Labs |
TELECOM CIRCUIT |
NO LEAD |
44 |
XMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
.5 mm |
105 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
S-XXMA-N44 |
1.28 mm |
6 mm |
6 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
30 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,30LEAD(UNSPEC) |
1.1 mm |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
UNSPECIFIED |
.0086 Mbps |
R-XXMA-N30 |
1.66 mm |
12 mm |
e4 |
15 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.25 mA |
5 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
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Microchip Technology |
TELECOM CIRCUIT |
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|
Melexis N V |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 mA |
3.3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G8 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
18 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N18 |
.4 mm |
2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
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|
Diodes Incorporated |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
42 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
R-XQCC-N42 |
.84 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
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Radiocrafts As |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
30 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N30 |
3.3 mm |
12.7 mm |
25.4 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
UNSPECIFIED |
UNSPECIFIED |
1 |
70 Cel |
-25 Cel |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
UNSPECIFIED |
UNSPECIFIED |
1 |
70 Cel |
-25 Cel |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Realtek Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G100 |
1.7 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.01 mA |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
Not Qualified |
40 |
260 |
7.8 mm |
|||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG |
75 Cel |
-10 Cel |
QUAD |
S-XQCC-N48 |
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|
Silicon Labs |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.