Other Function Telecom Interface ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SA606DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA639DH/01

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

1

1.1 mm

4.4 mm

e4

30

260

7.8 mm

SI4455-C2A-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

3 mm

3 mm

TM1062TXHUA

Pulse Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

16

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

DUAL

R-PDMA-G16

3

Not Qualified

2608011024010

Wurth Elektronik

TELECOM CIRCUIT

ADMP510ACEZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

TLGA

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, THIN PROFILE

1.22 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B3

1.08 mm

2.5 mm

NOT SPECIFIED

NOT SPECIFIED

3.35 mm

BLE112-E-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.3 mm

12.05 mm

18.1 mm

CC2430ZF128RTCG3

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N48

3

.9 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC2538NF53RTQR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

56

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

12 Mbps

S-PQCC-N56

3

1 mm

8 mm

e4

30

260

8 mm

HMC1023LP5ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

1 mm

5 mm

e3

30

260

5 mm

J-F2-B3E9-DY

Telit Communications Plc

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

S-XQCC-N32

2.6 mm

11 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

LE910-EU1

Telit Communications Plc

TELECOM CIRCUIT

LTC5587IDD#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

.45 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC5800IWR-WHMA#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N72

1

1 mm

10 mm

30

260

10 mm

RI-I03-114A-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-TRP-DR2B

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

1

Not Qualified

RI-TRP-R9UR

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

SA639DH,512

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.01 mA

3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

40

260

7.8 mm

SA639DH,518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

7.8 mm

SI2166-B20-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER

75 Cel

-10 Cel

MATTE TIN

QUAD

S-XQCC-N48

2

e3

40

260

SI3471A-A01-IMR

Silicon Labs

SIM5300EA

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

68

QMA

SQUARE

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

7.2 Mbps

S-XQMA-N68

Operates with 3.4V TO 4.4V supply

SPSGRFC-915

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

XB3-24Z8RS

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

XWL1831MODGAMOCT

Texas Instruments

TELECOM CIRCUIT

OTHER

NO LEAD

100

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY

.7 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-N100

2 mm

13.3 mm

13.4 mm

AD73322AR-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

SMALL OUTLINE

SOP28,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1.2 dB

TIN LEAD

DUAL

R-PDSO-G28

3

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

240

17.9 mm

YES

AD8314ARMZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

AD9866BCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

Modems

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

1 mm

9 mm

Not Qualified

e3

260

9 mm

ATA5746-PXQW

Atmel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

1 mm

5 mm

Not Qualified

5 mm

BGS16GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBCC-N14

1

.65 mm

2 mm

2 mm

BGSA11GN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

1.5 mm

BGX220S22HNA21R

Silicon Labs

TELECOM CIRCUIT

NO LEAD

44

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.5 mm

105 Cel

-40 Cel

UNSPECIFIED

2 Mbps

S-XXMA-N44

1.28 mm

6 mm

6 mm

BM70BLE01FC2-0B05BA

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3 V

MICROELECTRONIC ASSEMBLY

MODULE,30LEAD(UNSPEC)

1.1 mm

85 Cel

-40 Cel

Nickel/Gold (Ni/Au)

UNSPECIFIED

.0086 Mbps

R-XXMA-N30

1.66 mm

12 mm

e4

15 mm

CY7C924ADX-AXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.25 mA

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

LTC5551IUF#TRPBF

Analog Devices

TELECOM CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

MATTE TIN

QUAD

S-PQCC-N16

1

.8 mm

4 mm

e3

30

260

4 mm

MICRF005BM

Microchip Technology

TELECOM CIRCUIT

MLX90109EDC

Melexis N V

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2 mA

3.3/5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G8

Not Qualified

e3

PI3EQX1001XUAEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

18

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N18

.4 mm

2 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

PI3EQX1004ZHEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

42

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

R-XQCC-N42

.84 mm

3.5 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

RC1180-MBUS3

Radiocrafts As

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-N30

3.3 mm

12.7 mm

25.4 mm

RI-I02-112A-03

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RI-I02-112B-03

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RI-I11-112B-03

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I17-114A-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RTL8139DL-LF

Realtek Semiconductor

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

SA639DH

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.01 mA

3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

40

260

7.8 mm

SI2166-D60-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N48

SI3471A-A01-IM

Silicon Labs

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.