Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
MAX1472AKA+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0166 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.45 mm		1.625 mm	Not Qualified		e4	30	260	2.9 mm
MAX3120ESA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e0			4.9 mm
MAX3120ESA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX9152EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.07 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e0			5 mm
MAX9152EUE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e3	30	260	5 mm
MC100SX1230FN	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel		TIN LEAD	QUAD		S-PQCC-J28		4.57 mm		11.505 mm	Not Qualified		e0		235	11.505 mm
MD0100DK6-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16SQ,40		1 mm	125 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-N8		1 mm		4 mm			e3			4 mm
MDBT42Q-512K	Raytac	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	41		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N41		2.2 mm		10 mm						16 mm
MGM12P32F1024GE-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm						17.8 mm
MICRF230YQS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH	SSOP16,.25		.635 mm	105 Cel	-40 Cel		MATTE TIN	DUAL	.02 Mbps	R-PDSO-G16		1.75 mm		3.91 mm			e3			4.9 mm
MRF24WG0MBT-I/RM	Microchip Technology		INDUSTRIAL		36			PLASTIC/EPOXY						3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs		85 Cel	-40 Cel										Not Qualified
NEO-7P-0	U-blox Ag	TELECOM CIRCUIT
NINA-B302-00B-00	U-blox Ag	TELECOM CIRCUIT																									4
NINA-B416-01B	U-blox Ag	TELECOM CIRCUIT
NRF24LE1-F16Q32-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel			QUAD	2 Mbps	S-XQCC-N32		.9 mm		5 mm						5 mm
QN9021/DY	NXP Semiconductors	TELECOM CIRCUIT																									3								260
RF37S114HTFJB	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				70 Cel	-25 Cel			UNSPECIFIED		S-XXMA-X	1	.76 mm		4 mm		SEATED HT-CALCULATED			260	4 mm
RF430CL331HIRGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N16	2	1 mm		3 mm			e4	30	260	3 mm
RS9113-N00-S0W-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	101	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N101		2.3 mm		14 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				15 mm
SA616BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N20	1	1 mm		4 mm				30	260	4 mm
SE2436L-R	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	24	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						CHIP CARRIER								QUAD		R-PQCC-N24								NOT SPECIFIED	NOT SPECIFIED
SI4438-B1C-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm		4 mm			e3	40	260	4 mm
SI4744-C10-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm		4 mm			e3	40	260	4 mm
SI4777-A20-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N40		.9 mm		6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SN65DSI85ZQE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B64		1 mm		5 mm						5 mm
SN761633RTAR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	.8 mm		6 mm	Not Qualified		e4	30	260	6 mm
ST60-2230C-UU	Laird Technologies	TELECOM CIRCUIT
STS1TXQTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N20		1 mm		4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
TDA7116F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			DUAL		S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified				260	3 mm
TDA7116FXT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel			DUAL		S-PDSO-G10		1.1 mm		3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TESEO-VIC3DATR	STMicroelectronics	TELECOMM CIRCUIT
TFF11145HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N24	1	1 mm		4 mm					260	4 mm
TRF3722IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	2	1 mm		7 mm			e4	30	260	7 mm
TRF7970ATB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL							1				5 V						110 Cel	-40 Cel
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel			BOTTOM		S-PBGA-B196		1.4 mm		15 mm						15 mm
WP3160W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY								BOTTOM		S-PBGA-B672
WP3161W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY								BOTTOM		S-PBGA-B672
WT32I-E-AI61IAP	Silicon Labs
XB24CZ7PIT-004	Digi International	TELECOM CIRCUIT
090-02789-001	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	65 Cel	-10 Cel			DUAL		R-XDMA-P9		11.68 mm		35.3 mm						40.64 mm
090-02789-002	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	80 Cel	-40 Cel			DUAL		R-XDMA-P9		11.68 mm		35.3 mm						40.64 mm
090-02789-011	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	65 Cel	-10 Cel			DUAL		R-XDMA-P9		11.68 mm		35.3 mm						40.64 mm
410	Siltronics		COMMERCIAL								BIPOLAR		.55 mA		1.8/6		DIE OR CHIP	Other Telecom ICs		60 Cel	0 Cel										Not Qualified
451-00002C	Laird Technologies	TELECOM CIRCUIT		NO LEAD	71	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N71		2.35 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	15 mm
80HCPS1848CHMGI	Renesas Electronics	TELECOM CIRCUIT																					Tin/Silver/Copper (Sn/Ag/Cu)				4						e1	NOT SPECIFIED	250
88LX2720A0-NYC2C000	Maxlinear
AD73311AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2.65 mm	16-BIT	7.5 mm	Not Qualified		e0		240	12.8 mm	YES
AD73311LARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified		e0		240	7.2 mm

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.