Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
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U-blox Ag |
TELECOM CIRCUIT |
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New Japan Radio |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
DMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
MICROELECTRONIC ASSEMBLY |
.5 mm |
105 Cel |
-40 Cel |
DUAL |
S-XDMA-N10 |
.63 mm |
2.5 mm |
HEAT SINK AVAILABLE |
2.5 mm |
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New Japan Radio |
TELECOM CIRCUIT |
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Broadcom |
TELECOM CIRCUIT |
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Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
90 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
11300 Mbps |
S-PQCC-N20 |
3 |
1 mm |
4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4 mm |
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Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0011 mA |
5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
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Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
1 mm |
7 mm |
e3 |
260 |
7 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
1 mm |
7 mm |
e3 |
260 |
7 mm |
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Psemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N16 |
3 |
.9 mm |
3 mm |
3 mm |
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Psemi |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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NXP Semiconductors |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD |
3 |
e4 |
30 |
260 |
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NXP Semiconductors |
TELECOM CIRCUIT |
3 |
NOT SPECIFIED |
260 |
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NXP Semiconductors |
TELECOM CIRCUIT |
3 |
NOT SPECIFIED |
260 |
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Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
260 |
10 mm |
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Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER |
LCC20,.14SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.5 mm |
3.5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3.5 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
35 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,35LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
3 Mbps |
R-XXMA-N35 |
2.4 mm |
13.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
25.6 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
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Linx Technologies |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
6.5 mm |
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U-blox Ag |
TELECOM CIRCUIT |
4 |
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U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
96 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-B96 |
4 |
3 mm |
16 mm |
26 mm |
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Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.5 mm |
2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
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TDK |
TELECOM CIRCUIT |
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Silicon Labs |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
40 |
260 |
3 mm |
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Silicon Labs |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-20 Cel |
QUAD |
S-XQCC-N20 |
.6 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
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Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.8 V |
CHIP CARRIER |
90 Cel |
-40 Cel |
QUAD |
S-XQCC-N6 |
1 |
.5 mm |
1 mm |
260 |
1 mm |
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Skyworks Solutions |
TELECOM CIRCUIT |
3.3 |
Other Telecom ICs |
1 |
Not Qualified |
260 |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
.5 mm |
1 mm |
1.45 mm |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.6 |
CHIP CARRIER |
LCC8,.06SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N8 |
1 |
Not Qualified |
e4 |
30 |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
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STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
99 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B99 |
1.2 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
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STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Semtech |
TELECOM CIRCUIT |
MATTE TIN |
3 |
e3 |
260 |
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Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.6 mm |
3 mm |
e3 |
260 |
3 mm |
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Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N28 |
.6 mm |
4 mm |
Not Qualified |
e3 |
4 mm |
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Qorvo |
TELECOM CIRCUIT |
NO LEAD |
14 |
HQCCN |
SQUARE |
YES |
1 |
40 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC14,.2SQ,20 |
.5 mm |
Nickel/Gold (Ni/Au) |
QUAD |
S-XQCC-N14 |
3 |
1.64 mm |
4 mm |
SEATED HEIGHT NOMINAL |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
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U-blox Ag |
TELECOM CIRCUIT |
4 |
60 |
245 |
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Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0125 mA |
3 V |
2.2/5.5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.7 mm |
Not Qualified |
e3 |
260 |
4.9 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
10000 Mbps |
S-PBGA-B196 |
1.4 mm |
15 mm |
15 mm |
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Wi2wi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N24 |
1 |
2.3 mm |
11.2 mm |
260 |
12 mm |
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Silicon Labs |
TELECOM CIRCUIT |
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Silicon Labs |
TELECOM CIRCUIT |
3 |
40 |
260 |
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Silicon Labs |
TELECOM CIRCUIT |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.