Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TLK2501IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1		2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
EFR32FG25A111F1152IM56-B	Silicon Labs	TELECOM CIRCUIT
SKY66403-11	Skyworks Solutions	TELECOM CIRCUIT																					NICKEL PALLADIUM GOLD				3				e4		260
CYW20736A1KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-30 Cel	PURE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm					5 mm
ADL5506ACBZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.56 mm	.79 mm		e1	30	260	1.19 mm
PM5990B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B1932
CY7B933-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified	e4	20	260	17.905 mm
CYW43455XKUBGT	Infineon Technologies	TELECOM CIRCUIT		BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA140,11X13,16		.4 mm	85 Cel	-30 Cel		BOTTOM	433.3 Mbps	R-PBGA-B140	1	.6 mm	4.47 mm					5.27 mm
LT5554IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
SE5004L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY66405-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL																													NOT SPECIFIED	NOT SPECIFIED
MGM12P02F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
AD974BRSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	3	2 mm	5.3 mm	Not Qualified	e3		260	10.2 mm
RS9113-N00-D1F-X82	Silicon Labs	TELECOM CIRCUIT
SKY85716-11	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	16	QCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER							QUAD		S-XQCC-N16						NOT SPECIFIED	NOT SPECIFIED
AD9856ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
BP35C5	ROHM	TELECOM CIRCUIT																					COPPER NICKEL GOLD								e4	40	255
MGM210LA22JNF2	Silicon Labs	TELECOM CIRCUIT
SI3462-E01-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N11		1 mm	3 mm					3 mm
WIT2410M4G	Murata Manufacturing	TELECOM CIRCUIT	OTHER	UNSPECIFIED	16		RECTANGULAR	UNSPECIFIED	NO	1					5 V		MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X16				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
BGM1033N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N6		.77 mm	1.7 mm		e3			2.3 mm
BGM123N256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm			40	260	6.5 mm
CY7B923-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			95 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e0			11.5316 mm
CYBT-243053-02	Infineon Technologies	TELECOM CIRCUIT																									3
LBEE5ZZ1MD-011	Murata Manufacturing	TELECOM CIRCUIT
SE2438T-R	Skyworks Solutions	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4313-B1-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified	e3	40	260	4 mm
SI4362-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm					4 mm
ADN2880ACHIPS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	DIE	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		95 Cel	-40 Cel		UPPER		R-XUUC-N17				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
LXMS33HCNK-171	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N		.75 mm	3.2 mm					3.2 mm
MAX24188ETK2	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N68		.8 mm	8 mm		e3			8 mm
MGM12P22F1024GA-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
SKY16406-381LF	Skyworks Solutions	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel		DUAL		R-PDSO-N6		.8 mm	1.5 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
AD9081BBPZ-4D4AC	Analog Devices	TELECOM CIRCUIT
BGM210PA32JIA2	Silicon Labs
BGM210PA32JIA2R	Silicon Labs
CYBLE-014008-00	Infineon Technologies	TELECOM CIRCUIT																									3
CYBLE-202007-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30	3	2 mm	15 mm					23 mm
ENW89837A5KF	Panasonic	TELECOM CIRCUIT																														50	250
HMC6301BG46	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	75	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.35 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B75	1	.815 mm	4 mm			30	260	6 mm
HMC743LP6CETR	Hittite Microwave	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	6 mm					6 mm
SE2433T-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	QCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG	QUAD12,.09 X.07		.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N12	1	.6 mm	2 mm				260	2.5 mm
SI4431-B1-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY77643-21	Skyworks Solutions	TELECOM CIRCUIT			42		RECTANGULAR	UNSPECIFIED		1																						NOT SPECIFIED	NOT SPECIFIED
SKYA21043	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	24		RECTANGULAR		YES	1		AEC-Q100									105 Cel	-40 Cel		BOTTOM		R-XBGA-N24
WGM110A1MV2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.25 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N40		2.1 mm	14.4 mm					21 mm
88W8987-A2-NYEE/AZ	NXP Semiconductors	TELECOM CIRCUIT																									3					NOT SPECIFIED	260
AN7580	Panasonic	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	12	SIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR				12 V		IN-LINE				75 Cel	-25 Cel		SINGLE		R-PSIP-T12				Not Qualified

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.