Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MGM210P032JIA2	Silicon Labs	TELECOM CIRCUIT
MGM240SA22VNA2R	Silicon Labs	TELECOM CIRCUIT
NINA-B111-04B	U-blox Ag	TELECOM CIRCUIT																								4
NINA-B111-05B	U-blox Ag	TELECOM CIRCUIT
NINA-B311-00B	U-blox Ag	TELECOM CIRCUIT
NRF52832-CHAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.95 mm	6 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm
NRF9E5	Nordic Semiconductor Asa		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					3 V	3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32				Not Qualified
NXH3670UK/A1Z	NXP Semiconductors	TELECOM CIRCUIT																								1								260
ODIN-W262	U-blox Ag	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X
OPA381AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
PEF7072HLV16	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK							QUAD		R-PQFP-G64
PM5991B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B1932
PN5120A0ET/C2J	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified					260
RI-I03-112A-03	Texas Instruments	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
RI-I11-112A-03	Texas Instruments	TELECOM CIRCUIT	OTHER							1										70 Cel	-25 Cel								Not Qualified				NOT SPECIFIED	NOT SPECIFIED
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm				e4			19.5 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm				e4			22 mm
RS9113-NB0-D1C-X68	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm			ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-NB0-D1W	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm			ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm
SA606DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				40	260	6.5 mm
SA606DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				40	260	6.5 mm
SARA-G340-02S	U-blox Ag	TELECOM CIRCUIT																								4
SLRC61003HNE	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD SILVER				2						e4	30	260
STA5635A	STMicroelectronics	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
STA5635ATR	STMicroelectronics	TELECOM CIRCUIT
STID135	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		QCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N								NOT SPECIFIED	NOT SPECIFIED
TSC2200IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED		e4	30	260	9.7 mm
UCC2750DWTRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	17.9 mm
WFM200SS22XNA2	Silicon Labs	TELECOM CIRCUIT		NO LEAD	52	LGA	SQUARE	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY	LGA52(UNSPEC)		.5 mm	105 Cel	-40 Cel		BOTTOM	72.2 Mbps	S-XLGA-N52	3	1.4 mm	6.5 mm					40	260	6.5 mm
WL1801MODGBMOC	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel	-20 Cel		BOTTOM		R-PBGA-B130		2 mm	13.3 mm							13.4 mm
WT11I-E-AI5	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N28		2.86 mm	14.5 mm							35.75 mm
WYSBMVGXB	Taiyo Yuden	TELECOM CIRCUIT								1				3.3 V																			NOT SPECIFIED	NOT SPECIFIED
XB3-24AST	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMUS-011	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
ATA5749C-6DQY	Atmel	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm							3 mm
ATA5749C-6DQY-64	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.04 Mbps	S-PDSO-G10	2	1.1 mm	3 mm				e3	40	260	3 mm
ATSAMB11-XR2100A	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	49	HLGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.6 V		GRID ARRAY, HEAT SINK/SLUG				85 Cel	-40 Cel		BOTTOM		R-XBGA-N49		1.4 mm	4.5 mm							5.5 mm
CC2531F128RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified			e4	30	260	6 mm
CSR1012A05-IQQP-R	Qualcomm	TELECOM CIRCUIT
ETRX357HR-LRSCB	Silicon Labs	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
GP2015/IG/FP1Q	Zarlink Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified			e0		260	7 mm
ISL32275EIBZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm				e3	30	260	9.9 mm
ISM14585-L35-P8	Renesas Electronics																									3								245
ISM14585-L35-P8-W	Renesas Electronics																									3								245
MRF24J40T-I/ML	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	1 mm	6 mm	Not Qualified			e3	40	260	6 mm
SE2435L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4 V	4	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	1	.9 mm	4 mm	Not Qualified			e4		260	4 mm
XB3-24AST-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24Z8RM	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N34			13 mm							19 mm

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.