Other Function Telecom Interface ICs

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AX210.NGWG.NV

Intel

TELECOM CIRCUIT

NO LEAD

SMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

80 Cel

0 Cel

SINGLE

2400 Mbps

R-XSMA-N

BGM13S32F512GA-V2

Silicon Labs

TELECOM CIRCUIT

BGM210PB22JIA2

Silicon Labs

CYRF6936-40LTXC

Cypress Semiconductor

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N40

3

1 mm

6 mm

Not Qualified

e4

20

260

6 mm

EFR32BG1B132F256GM32-C0R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N32

2

.9 mm

5 mm

e3

NOT SPECIFIED

260

5 mm

HT2MOA2S20/E/3,118

NXP Semiconductors

TELECOM CIRCUIT

PLASTIC/EPOXY

HYBRID

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Telecom ICs

Not Qualified

MGM12P22F1024GA-V4

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

RX5500

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

1.02 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N20

9.65 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10.9 mm

SE2432L-R

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N24

1

.9 mm

3 mm

4 mm

SI4012-C1001GT

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0198 mA

3.3 V

2/3.3

SMALL OUTLINE

TSSOP10,.19,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

SI4355-B1A-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

QCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

2

e3

40

260

SKY65724-11

Skyworks Solutions

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

SKY66421-11

Skyworks Solutions

TELECOM CIRCUIT

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, VERY THIN PROFILE

LCC16,.12SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N16

.8 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

SKY85755-11

Skyworks Solutions

TELECOM CIRCUIT

NO LEAD

16

QMA

SQUARE

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

QUAD

S-XQMA-N16

3

BA4116FV-E2

ROHM

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

TIN/TIN COPPER

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

Not Qualified

e3/e2

10

260

5 mm

BCM16KB0CH0SX51RS

Broadcom

TELECOM CIRCUIT

BCM65500B1IFSBR

Broadcom

TELECOM CIRCUIT

BGM210PB22JIA2R

Silicon Labs

CY7B9334-270JXC

Cypress Semiconductor

TELECOM CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

5 V

CHIP CARRIER

1.27 mm

70 Cel

0 Cel

QUAD

S-PQCC-J28

4.572 mm

11.5316 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

11.5316 mm

EFR32BG13P532F512GM32-D

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

3

.9 mm

5 mm

40

260

5 mm

EFR32BG21A020F768IM32-B

Silicon Labs

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

.4 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

2 Mbps

S-XQCC-N32

2

.9 mm

4 mm

e3

40

260

4 mm

EFR32FG25A121F1152IM56-B

Silicon Labs

TELECOM CIRCUIT

ENW89852A1KF

Panasonic

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N24

2 mm

9 mm

9.5 mm

EYSHJNZWZ

Taiyo Yuden

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

HC1-55536-5

Intersil

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC

NO

CMOS

1.5 mA

5 V

5

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T14

Not Qualified

e0

LXMS31ACNA-012

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER

85 Cel

-40 Cel

BOTTOM

R-PBCC-N2

.7 mm

1.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3.2 mm

MGM13P12F512GE-V2

Silicon Labs

PI2EQX4402DNBE

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

BALL

84

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

3

1.46 mm

9 mm

Not Qualified

e1

9 mm

RS9113-NB0-S1C-X78

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

SI4732-A10-GSR

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

3

40

260

SII3726CBHU

Lattice Semiconductor

SKY53728-11

Skyworks Solutions

NOT SPECIFIED

NOT SPECIFIED

SKY65725-11

Skyworks Solutions

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

SKY66114-11

Skyworks Solutions

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

260

SKY85717-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

NO LEAD

16

QCCN

SQUARE

YES

1

CHIP CARRIER

QUAD16(UNSPEC)

QUAD

S-XQCC-N16

NOT SPECIFIED

NOT SPECIFIED

SKY85717-21

Skyworks Solutions

TELECOM CIRCUIT

NO LEAD

16

QCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER

QUAD

S-XQCC-N16

NOT SPECIFIED

NOT SPECIFIED

SKY85806-11

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N28

.9 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

SR040HN/B02BY

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.23SQ,20

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2A

1 mm

6 mm

260

6 mm

T5761-TGS

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

105 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

2.6 mm

7.4 mm

Not Qualified

e0

12.825 mm

TC9560XBG

Toshiba

TELECOM CIRCUIT

WFM200S022XNN3

Silicon Labs

TELECOM CIRCUIT

3

40

260

WFM200SS22XNN3

Silicon Labs

TELECOM CIRCUIT

3

40

260

ACPL-C799-000E

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G8

1

3.607 mm

5.85 mm

e3

260

6.807 mm

ACPL-C799-500E

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G8

1

3.607 mm

5.85 mm

e3

260

6.807 mm

BC63B239A04-IQD-E4

Qualcomm

TELECOM CIRCUIT

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

1

1.5 V

CHIP CARRIER

QUAD

S-XQCC-N40

BGM11S12F256GA-V2

Silicon Labs

TELECOM CIRCUIT

BGX13S22GA-V31

Silicon Labs

TELECOM CIRCUIT

3

40

260

CY7B923-JC

Cypress Semiconductor

TELECOM CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

85 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-J28

3

4.57 mm

11.53 mm

Not Qualified

e0

11.53 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.