Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
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Intel |
TELECOM CIRCUIT |
NO LEAD |
SMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
80 Cel |
0 Cel |
SINGLE |
2400 Mbps |
R-XSMA-N |
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|
Silicon Labs |
TELECOM CIRCUIT |
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Silicon Labs |
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|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
20 |
260 |
6 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e3 |
NOT SPECIFIED |
260 |
5 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
PLASTIC/EPOXY |
HYBRID |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
Other Telecom ICs |
Not Qualified |
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|
Silicon Labs |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
12.9 mm |
17.8 mm |
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|
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER |
1.02 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N20 |
9.65 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10.9 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N24 |
1 |
.9 mm |
3 mm |
4 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0198 mA |
3.3 V |
2/3.3 |
SMALL OUTLINE |
TSSOP10,.19,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G10 |
1.1 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
2 |
e3 |
40 |
260 |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NO LEAD |
16 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N16 |
.8 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NO LEAD |
16 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
QUAD |
S-XQMA-N16 |
3 |
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|
ROHM |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-30 Cel |
TIN/TIN COPPER |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
Not Qualified |
e3/e2 |
10 |
260 |
5 mm |
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|
Broadcom |
TELECOM CIRCUIT |
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Broadcom |
TELECOM CIRCUIT |
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Silicon Labs |
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|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.572 mm |
11.5316 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
11.5316 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
40 |
260 |
5 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2 Mbps |
S-XQCC-N32 |
2 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
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Silicon Labs |
TELECOM CIRCUIT |
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Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N24 |
2 mm |
9 mm |
9.5 mm |
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Taiyo Yuden |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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Intersil |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
1.5 mA |
5 V |
5 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T14 |
Not Qualified |
e0 |
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|
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
2 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
BOTTOM |
R-PBCC-N2 |
.7 mm |
1.6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3.2 mm |
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|
Silicon Labs |
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Diodes Incorporated |
TELECOM CIRCUIT |
COMMERCIAL |
BALL |
84 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B84 |
3 |
1.46 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
MATTE TIN |
3 |
40 |
260 |
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Lattice Semiconductor |
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|
Skyworks Solutions |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD |
3 |
e4 |
260 |
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|
Skyworks Solutions |
RF AND BASEBAND CIRCUIT |
NO LEAD |
16 |
QCCN |
SQUARE |
YES |
1 |
CHIP CARRIER |
QUAD16(UNSPEC) |
QUAD |
S-XQCC-N16 |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NO LEAD |
16 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER |
QUAD |
S-XQCC-N16 |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N28 |
.9 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.23SQ,20 |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
2A |
1 mm |
6 mm |
260 |
6 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
2.6 mm |
7.4 mm |
Not Qualified |
e0 |
12.825 mm |
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Toshiba |
TELECOM CIRCUIT |
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|
Silicon Labs |
TELECOM CIRCUIT |
3 |
40 |
260 |
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Silicon Labs |
TELECOM CIRCUIT |
3 |
40 |
260 |
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|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
1 |
3.607 mm |
5.85 mm |
e3 |
260 |
6.807 mm |
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|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
1 |
3.607 mm |
5.85 mm |
e3 |
260 |
6.807 mm |
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|
Qualcomm |
TELECOM CIRCUIT |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER |
QUAD |
S-XQCC-N40 |
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|
Silicon Labs |
TELECOM CIRCUIT |
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|
Silicon Labs |
TELECOM CIRCUIT |
3 |
40 |
260 |
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Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
85 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
3 |
4.57 mm |
11.53 mm |
Not Qualified |
e0 |
11.53 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.