Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
WL1801GYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	130	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1								GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA130,11X12,16		.4 mm	105 Cel		-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B130		1	.575 mm		4.64 mm				e1	30	260	4.93 mm
XB24CASIT-001	Digi International	TELECOM CIRCUIT		THROUGH-HOLE	20	XMA	UNSPECIFIED	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel		-40 Cel			UNSPECIFIED	1 Mbps	X-XXMA-T20					24.38 mm							27.61 mm
XB24CZ7UIS-004	Digi International	TELECOM CIRCUIT
XB3-24ACM	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1								SPECIAL SHAPE				85 Cel		-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMRS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
XE1203FI063TRLF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.075 mA	3.3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		Matte Tin (Sn)	QUAD		S-PQCC-N48			.9 mm		7 mm	Not Qualified			e3			7 mm
XR-2211ACD	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR		9 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14		1	1.75 mm		3.9 mm	Not Qualified			e0	30	215	8.65 mm
XR2211ACP-F	Exar	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			BIPOLAR		.009 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel		MATTE TIN	DUAL		R-PDIP-T14			5.33 mm		7.62 mm	Not Qualified			e3			19.305 mm
XWL1831MODGAMOCR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V		GRID ARRAY				70 Cel		-20 Cel			BOTTOM		R-PBGA-B130			2 mm		13.3 mm							13.4 mm
ZOE-M8G-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	XMA	SQUARE	UNSPECIFIED	YES	1				AEC-Q100		1.8 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel		-40 Cel			BOTTOM		S-XXMA-B51		3	1.165 mm		4.5 mm							4.5 mm
2608011024000	Wurth Elektronik	TELECOM CIRCUIT
ABBTM-NVC-MDCS42A	Abracon	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel		-40 Cel			UNSPECIFIED		R-XXMA-N32		3	2.2 mm		13.4 mm							25.8 mm
AD73322LARUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		.031 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Codecs	.65 mm	85 Cel		-40 Cel	.75 dB	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28		1	1.2 mm	16-BIT	4.4 mm	Not Qualified			e3	40	260	9.7 mm	YES
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G28		3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
ADN2892ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel		-40 Cel		MATTE TIN	QUAD		S-XQCC-N16		3	.9 mm		3 mm	Not Qualified			e3		260	3 mm
ADN2892ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel		-40 Cel		MATTE TIN	QUAD		S-XQCC-N16		3	.9 mm		3 mm	Not Qualified			e3	30	260	3 mm
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2			.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm		12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
ATA5577M3330C-DDB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	2	DIE	RECTANGULAR	UNSPECIFIED		1								UNCASED CHIP	DIE OR CHIP		.524 mm	85 Cel		-40 Cel			UPPER		R-XUUC-N2			.162 mm		1 mm							1.35 mm
BGM210P032JIA2	Silicon Labs	TELECOM CIRCUIT
BGM210PB32JIA2	Silicon Labs
BGS110MN20E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	BCC	SQUARE	UNSPECIFIED	YES	1						3.5 V		CHIP CARRIER			.4 mm	85 Cel		-30 Cel			BOTTOM		S-XBCC-B20		1	.77 mm		2.3 mm							2.3 mm
BLUENRG-345VC	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel			BOTTOM	2 Mbps	S-XBGA-B49			.42 mm		3.14 mm							3.14 mm
BMD-341-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N68		3	1.9 mm		10.2 mm						250	15 mm
BT860-ST	Laird Technologies	TELECOM CIRCUIT																																					NOT SPECIFIED	NOT SPECIFIED
CC1201RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32		3	1 mm		5 mm	Not Qualified			e4	NOT SPECIFIED	260	5 mm
CC2541F256TRHARQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel		NICKEL PALLADIUM GOLD	QUAD	2 Mbps	S-PQCC-N40		3	1 mm		6 mm				e4	30	260	6 mm
CY7B9234-270JXCT	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		MATTE TIN	QUAD		S-PQCC-J28		3	4.572 mm		11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
CYBT-483056-02	Infineon Technologies	TELECOM CIRCUIT																													3								30	260
D52MD2M8IA-TRAY	Garmin Canada	TELECOM CIRCUIT	INDUSTRIAL	BALL	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel		-40 Cel			UNSPECIFIED	.06 Mbps	R-XXMA-B35			2.11 mm		9.8 mm							14 mm
DP1203C4333LF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	21		RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		MATTE TIN	UNSPECIFIED		R-XXMA-X21						Not Qualified			e3
DS2174Q	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm		16.585 mm	Not Qualified			e0			16.585 mm
DS2174Q+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm		16.585 mm	Not Qualified			e3		245	16.585 mm
EFR32BG12P432F1024GM48-C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel		-40 Cel			QUAD	2 Mbps	S-XQCC-N48			.9 mm		7 mm							7 mm
EFR32BG1B232F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel			BOTTOM		R-PBGA-B43			.54 mm		3.143 mm							3.295 mm
ESP32-S0WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.35 mm	125 Cel		-40 Cel			QUAD		S-XQCC-N48			.9 mm		5 mm							5 mm
ETRX2HR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel		-40 Cel			UNSPECIFIED		R-XXMA-N38					20.5 mm							37.5 mm
GS2971-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel		-20 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B100		1	1.7 mm		11 mm				e1		260	11 mm
HMC560LM3	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1								CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel		-55 Cel		GOLD OVER NICKEL	QUAD		S-PQCC-N6		1	1.14 mm		5.08 mm	Not Qualified			e4		250	5.08 mm
HMC572LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1						3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel		-55 Cel			QUAD		S-XQCC-N32			1.12 mm		5 mm					NOT SPECIFIED	NOT SPECIFIED	5 mm
HTSH4801ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel		-25 Cel			DUAL		R-PDSO-N2		1				Not Qualified				30	260
LT5575EUF	Analog Devices		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES						155 mA	5 V	5	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.635 mm	85 Cel		-40 Cel		Tin/Lead (Sn/Pb)	QUAD		S-PQCC-N16						Not Qualified			e0
LTC4400-1ES6#TRMPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G6		1	1 mm		1.6 mm	Not Qualified			e3			2.9 mm
LTC5800IWR-IPRB#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		SILVER	QUAD		S-PQCC-N72			1 mm		10 mm				e4			10 mm
MAX5980AGTJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel		Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32		1	.8 mm		5 mm				e3	30	260	5 mm
MC33660EF	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS			5 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel			DUAL		R-PDSO-N8			1.75 mm		3.9 mm							4.9 mm
MGM111A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel		-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N31			2.1 mm		12.9 mm							15 mm
MGM12P32F1024GE-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		SPECIAL SHAPE				85 Cel		-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X					12.9 mm							17.8 mm
MGM210P022JIA2	Silicon Labs	TELECOM CIRCUIT

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.