Heat Sink Heat Sinks 291

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

258

Wakefield Thermal Solutions

Heat Sink

U

Aluminium

0.339 in (8.6 mm)

0.252 in (6.4 mm)

Anodized

Black

820 mg

0.5 in (12.7 mm)

HS201DR

Crydom

Heat Sink

Screw

Aluminium Alloy

Relay

Longitudinal

2 Ω

3.15 in (80 mm)

1.772 in (45 mm)

353 g

3.189 in (81 mm)

573300D00010G

Boyd

Heat Sink

U

Extruded

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Tin/Nickel

Gray

Tape and Reel, 13 in

1.03 in (26.16 mm)

DA-T263-101E-TR

Ohmite Manufacturing

Heat Sink

Aluminium

Transistor

Extruded

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Anodized

Black

Tape and Reel, 13 in

3.8 g

1.02 in (25.91 mm)

FK24413D2PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Bulk

3.6 g

1.024 in (26 mm)

576802B04000G

Boyd

Heat Sink

U

Aluminium

Transistor

Clip

27.3 Ω

0.75 in (19.05 mm)

0.5 in (12.7 mm)

Anodized

Black

0.57 in (14.48 mm)

FK220SA220

Fischer Elektronik & Kg

Heat Sink

Aluminium Alloy

Transistor

Transverse

25 Ω

0.807 in (20.5 mm)

0.276 in (7 mm)

Anodized

Black

0.984 in (25 mm)

HS202DR

Crydom

Heat Sink

ICKBGA35X35

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

FK24413D2PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.6 g

1.024 in (26 mm)

507302B00000G

Boyd

Heat Sink

Screw

Aluminium

Transistor

Fin

Transverse

24 Ω

0.38 in (9.65 mm)

0.75 in (19.05 mm)

Anodized

Black

Low Profile

0.75 in (19.05 mm)

576802B00000G

Boyd

Heat Sink

U

Aluminium

Clip

Transverse

27.3 Ω

0.75 in (19.05 mm)

0.5 in (12.7 mm)

Anodized

Black

0.57 in (14.48 mm)

FK24408D2PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2.2 g

1.024 in (26 mm)

WA-T247-101E

Ohmite Manufacturing

Heat Sink

Clip

Aluminium Alloy

Transistor

Extruded

Longitudinal

11 Ω

1.201 in (30.5 mm)

0.63 in (16 mm)

Anodized

Black

Bulk

12 g

0.909 in (23.1 mm)

FK24413D3PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

1.22 in (31 mm)

Tin Lead

3.9 g

0.512 in (13 mm)

FK224MI2201

Fischer Elektronik & Kg

Heat Sink

Aluminium

Transistor

18 Ω

0.327 in (8.3 mm)

0.984 in (25 mm)

1.157 in (29.4 mm)

FK237SA220V

Fischer Elektronik & Kg

Heat Sink

Aluminium

Transistor

0.5 in (12.7 mm)

0.571 in (14.5 mm)

Anodized

Black

0.75 in (19.05 mm)

7109DG/TR

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.45 in (11.43 mm)

0.763 in (19.38 mm)

Tin

Tape and Reel

1 in (25.4 mm)

7109DG

Boyd

Heat Sink

Copper

IC

Folded Back

11 Ω

0.763 in (19.38 mm)

0.45 in (11.43 mm)

Tin

1 in (25.4 mm)

581002B02500G

Boyd

Heat Sink

Aluminium

IC

Extruded

Longitudinal

17.4 Ω

1 in (25.4 mm)

0.64 in (16.26 mm)

Anodized

Black

0.64 in (16.26 mm)

FK237SA220H

Fischer Elektronik & Kg

Heat Sink

Aluminium

Transistor

Fin

0.5 in (12.7 mm)

0.571 in (14.5 mm)

Anodized

Black

0.75 in (19.05 mm)

RA-T2X-51E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

2 in (50.8 mm)

0.984 in (25 mm)

Anodized

Black

51 g

1.654 in (42 mm)

FK24413DPAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.3 g

0.906 in (23 mm)

WF210000

Celduc Relais

Heat Sink

ICKPGA6X6X14

Fischer Elektronik & Kg

Heat Sink

Adhesive

IC

Omnidirectional

20 Ω

0.551 in (14 mm)

0.551 in (14 mm)

Anodized

Black

0.551 in (14 mm)

576802B03100G

Boyd

Heat Sink

Aluminium

Clip

27.3 Ω

0.5 in (12.7 mm)

0.57 in (14.48 mm)

Anodized

Black

0.75 in (19.05 mm)

WF151200

Celduc Relais

Heat Sink

HS151DR

Crydom

Heat Sink

RA-T2X-25E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1 in (25.4 mm)

0.984 in (25 mm)

Anodized

Black

25 g

1.654 in (42 mm)

680-5A

Wakefield-vette

Heat Sink

Aluminium

Omnidirectional

0.5 in (12.7 mm)

1.811 in (46 mm)

Anodized

Black

31.75 g

1.811 in (46 mm)

7106DG/TR

Boyd

Heat Sink

Solder

Copper

IC

15 Ω

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

Tape and Reel

1.02 in (25.91 mm)

530613B00000G

Boyd

Heat Sink

U

Aluminium

Fin

Transverse

16.7 Ω

1.18 in (29.97 mm)

0.5 in (12.7 mm)

Anodized

Black

1 in (25.4 mm)

274-1AB

Ohmite Manufacturing

Heat Sink

Aluminium

0.374 in (9.5 mm)

0.52 in (13.2 mm)

Anodized

Black

0.752 in (19.1 mm)

WA-T220-101E

Ohmite Manufacturing

Heat Sink

531002B00000G

Boyd

Heat Sink

Aluminium

Extruded

Radial

13.4 Ω

1 in (25.4 mm)

0.5 in (12.7 mm)

Anodized

Black

1.374 in (34.9 mm)

1542618-2

TE Connectivity

Heat Sink

Clip

Cold-Forged Aluminium, Aluminium

Transceiver

Pin Fin

CSA; UL

0.256 in (6.5 mm)

0.709 in (18 mm)

Nickel

2.254 in (57.25 mm)

15 W

574502B03300G

Boyd

Heat Sink

Aluminium

Slide On

Folded Back

21.2 Ω

0.75 in (19.05 mm)

0.39 in (9.9 mm)

Anodized

Black

0.81 in (20.57 mm)

423K

Wakefield-vette

Heat Sink

Extruded

2.626 in (66.7 mm)

4.752 in (120.7 mm)

530.71 g

5.52 in (140.2 mm)

637-15ABEP

Ohmite Manufacturing

Heat Sink

Aluminium

Flared

Radial

1.5 in (38.1 mm)

0.5 in (12.7 mm)

Anodized

Black

15.88 g

1.374 in (34.9 mm)

RA-T2X-38E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1.5 in (38.1 mm)

0.984 in (25 mm)

Anodized

Black

38 g

1.654 in (42 mm)

374324B00035G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.394 in (10 mm)

1.063 in (27 mm)

Anodized

Black

1.063 in (27 mm)

908-35-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

10.03 Ω

0.472 in (12 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

7G0011A

TDK

Heat Sink

Converter

Fin Pin

Omnidirectional

8.24 Ω

0.224 in (5.7 mm)

1.472 in (37.4 mm)

14.6 g

1.969 in (50 mm)

7106DG

Boyd

Heat Sink

Copper

Transistor

15 Ω

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

1.02 in (25.91 mm)

647-10ABEP

Wakefield-vette

Heat Sink

Extruded

1 in (25.4 mm)

1 in (25.4 mm)

24.95 g

1.65 in (41.9 mm)

FK24408D3PAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2.5 g

1.22 in (31 mm)

V5618C

Assmann Wsw Components

Heat Sink

C247-025-1VE

Ohmite Manufacturing

Heat Sink

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.