Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Wakefield Thermal Solutions |
Heat Sink |
U |
Aluminium |
0.339 in (8.6 mm) |
0.252 in (6.4 mm) |
Anodized |
Black |
820 mg |
0.5 in (12.7 mm) |
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|
Crydom |
Heat Sink |
Screw |
Aluminium Alloy |
Relay |
Longitudinal |
2 Ω |
3.15 in (80 mm) |
1.772 in (45 mm) |
353 g |
3.189 in (81 mm) |
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|
Boyd |
Heat Sink |
U |
Extruded |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Tin/Nickel |
Gray |
Tape and Reel, 13 in |
1.03 in (26.16 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Transistor |
Extruded |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
Tape and Reel, 13 in |
3.8 g |
1.02 in (25.91 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Bulk |
3.6 g |
1.024 in (26 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Transistor |
Clip |
27.3 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.57 in (14.48 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium Alloy |
Transistor |
Transverse |
25 Ω |
0.807 in (20.5 mm) |
0.276 in (7 mm) |
Anodized |
Black |
0.984 in (25 mm) |
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|
Crydom |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Tape and Reel |
3.6 g |
1.024 in (26 mm) |
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|
Boyd |
Heat Sink |
Screw |
Aluminium |
Transistor |
Fin |
Transverse |
24 Ω |
0.38 in (9.65 mm) |
0.75 in (19.05 mm) |
Anodized |
Black |
Low Profile |
0.75 in (19.05 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Clip |
Transverse |
27.3 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.57 in (14.48 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Bulk |
2.2 g |
1.024 in (26 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Clip |
Aluminium Alloy |
Transistor |
Extruded |
Longitudinal |
11 Ω |
1.201 in (30.5 mm) |
0.63 in (16 mm) |
Anodized |
Black |
Bulk |
12 g |
0.909 in (23.1 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
1.22 in (31 mm) |
Tin Lead |
3.9 g |
0.512 in (13 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
Transistor |
18 Ω |
0.327 in (8.3 mm) |
0.984 in (25 mm) |
1.157 in (29.4 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
Transistor |
0.5 in (12.7 mm) |
0.571 in (14.5 mm) |
Anodized |
Black |
0.75 in (19.05 mm) |
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|
Boyd |
Heat Sink |
Copper |
IC |
Folded Back |
11 Ω |
0.45 in (11.43 mm) |
0.763 in (19.38 mm) |
Tin |
Tape and Reel |
1 in (25.4 mm) |
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|
Boyd |
Heat Sink |
Copper |
IC |
Folded Back |
11 Ω |
0.763 in (19.38 mm) |
0.45 in (11.43 mm) |
Tin |
1 in (25.4 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
IC |
Extruded |
Longitudinal |
17.4 Ω |
1 in (25.4 mm) |
0.64 in (16.26 mm) |
Anodized |
Black |
0.64 in (16.26 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
Transistor |
Fin |
0.5 in (12.7 mm) |
0.571 in (14.5 mm) |
Anodized |
Black |
0.75 in (19.05 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2 in (50.8 mm) |
0.984 in (25 mm) |
Anodized |
Black |
51 g |
1.654 in (42 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Tape and Reel |
3.3 g |
0.906 in (23 mm) |
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Celduc Relais |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
IC |
Omnidirectional |
20 Ω |
0.551 in (14 mm) |
0.551 in (14 mm) |
Anodized |
Black |
0.551 in (14 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Clip |
27.3 Ω |
0.5 in (12.7 mm) |
0.57 in (14.48 mm) |
Anodized |
Black |
0.75 in (19.05 mm) |
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Celduc Relais |
Heat Sink |
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|
Crydom |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
25 g |
1.654 in (42 mm) |
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|
Wakefield-vette |
Heat Sink |
Aluminium |
Omnidirectional |
0.5 in (12.7 mm) |
1.811 in (46 mm) |
Anodized |
Black |
31.75 g |
1.811 in (46 mm) |
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|
Boyd |
Heat Sink |
Solder |
Copper |
IC |
15 Ω |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin |
Tape and Reel |
1.02 in (25.91 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
16.7 Ω |
1.18 in (29.97 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1 in (25.4 mm) |
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Ohmite Manufacturing |
Heat Sink |
Aluminium |
0.374 in (9.5 mm) |
0.52 in (13.2 mm) |
Anodized |
Black |
0.752 in (19.1 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
13.4 Ω |
1 in (25.4 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.374 in (34.9 mm) |
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|
TE Connectivity |
Heat Sink |
Clip |
Cold-Forged Aluminium, Aluminium |
Transceiver |
Pin Fin |
CSA; UL |
0.256 in (6.5 mm) |
0.709 in (18 mm) |
Nickel |
2.254 in (57.25 mm) |
15 W |
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|
Boyd |
Heat Sink |
Aluminium |
Slide On |
Folded Back |
21.2 Ω |
0.75 in (19.05 mm) |
0.39 in (9.9 mm) |
Anodized |
Black |
0.81 in (20.57 mm) |
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|
Wakefield-vette |
Heat Sink |
Extruded |
2.626 in (66.7 mm) |
4.752 in (120.7 mm) |
530.71 g |
5.52 in (140.2 mm) |
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Ohmite Manufacturing |
Heat Sink |
Aluminium |
Flared |
Radial |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
15.88 g |
1.374 in (34.9 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
38 g |
1.654 in (42 mm) |
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|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.394 in (10 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
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|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
10.03 Ω |
0.472 in (12 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
8.24 Ω |
0.224 in (5.7 mm) |
1.472 in (37.4 mm) |
14.6 g |
1.969 in (50 mm) |
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|
Boyd |
Heat Sink |
Copper |
Transistor |
15 Ω |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin |
1.02 in (25.91 mm) |
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|
Wakefield-vette |
Heat Sink |
Extruded |
1 in (25.4 mm) |
1 in (25.4 mm) |
24.95 g |
1.65 in (41.9 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Bulk |
2.5 g |
1.22 in (31 mm) |
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|
Assmann Wsw Components |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.