Heat Sink Heat Sinks 291

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

SK48100SA

Fischer Elektronik & Kg

Heat Sink

Transistor

Extruded

Longitudinal

3.5 Ω

0.787 in (20 mm)

2.559 in (65 mm)

Anodized

Black

3.937 in (100 mm)

SK52515

Fischer Elektronik & Kg

Heat Sink

Transistor

Extruded

Longitudinal

13.3 Ω

1.102 in (28 mm)

0.764 in (19.4 mm)

0.591 in (15 mm)

527-24AB-MS4

Wakefield-vette

Heat Sink

Aluminium

Extruded

0.24 in (6.1 mm)

2.28 in (57.9 mm)

Anodized

Black

2.402 in (61 mm)

593002B03400G

Boyd

Heat Sink

U

Aluminium

Fin

13.4 Ω

1.18 in (29.97 mm)

0.5 in (12.7 mm)

Anodized

Black

0.942 in (23.93 mm)

APF40-40-13CB/A01

Cts

Heat Sink

Adhesive

Aluminium Alloy

IC

9.9 Ω

0.5 in (12.7 mm)

1.575 in (40 mm)

Anodized

Black

1.575 in (40 mm)

ATS-1146-C1-R0

Advanced Thermal Solutions

Heat Sink

Chromate

Extruded

Longitudinal

0.902 in (22.9 mm)

2.323 in (59 mm)

Gold Anodized

Maxiflow, Device Used On: Half Brick DC-DC Converter

2.402 in (61 mm)

EA-T220-51E

Ohmite Manufacturing

Heat Sink

658-35AB

Ohmite Manufacturing

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.35 in (8.9 mm)

1.098 in (27.9 mm)

Anodized

Black

6.7 g

1.098 in (27.9 mm)

658-35AB-T4

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.35 in (8.89 mm)

1.21 in (30.73 mm)

Anodized

Black

1.21 in (30.73 mm)

ATS-54350W-C1-R0

Advanced Thermal Solutions

Heat Sink

ATS-54375W-C1-R0

Advanced Thermal Solutions

Heat Sink

EV-T220-38E

Ohmite Manufacturing

Heat Sink

Aluminium Alloy

Transistor

Longitudinal

11.4 Ω

1.5 in (38.1 mm)

0.5 in (12.7 mm)

Bulk

18 g

1.378 in (35 mm)

EV-T220-51E

Ohmite Manufacturing

Heat Sink

EV-T220-64E

Ohmite Manufacturing

Heat Sink

MA-302-55E

Ohmite Manufacturing

Heat Sink

V8511Z

Assmann Wsw Components

Heat Sink

625-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.984 in (25 mm)

Anodized

Black

5.45 g

0.984 in (25 mm)

658-60AB

Ohmite Manufacturing

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.598 in (15.2 mm)

1.098 in (27.9 mm)

Anodized

Black

14.17 g

1.098 in (27.9 mm)

HS202

Crydom

Heat Sink

HSS26-B20-P38

CUI Devices

Heat Sink

658-60AB-T3

Wakefield-vette

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.598 in (15.2 mm)

1.098 in (27.9 mm)

Anodized

Black

14.17 g

1.098 in (27.9 mm)

904-27-1-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Elliptical Fin

12.93 Ω

0.906 in (23 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

ATS-1144-C1-R0

Advanced Thermal Solutions

Heat Sink

C220-050-2AE

Ohmite Manufacturing

Heat Sink

WA400-11P

Schaffner Holding Ag

Heat Sink

Transistor

U

18 Ω

0.984 in (25 mm)

0.433 in (11 mm)

0.63 in (16 mm)

273-AB

Ohmite Manufacturing

Heat Sink

512-9M

Wakefield-vette

Heat Sink

Fin

Longitudinal

2.35 in (59.7 mm)

7.2 in (182.88 mm)

9 in (228.6 mm)

518-95AB

Ohmite Manufacturing

Heat Sink

Aluminium

Extruded

0.949 in (24.1 mm)

2.28 in (57.9 mm)

Anodized

Black

2.402 in (61 mm)

531102B00000G

Boyd

Heat Sink

Aluminium

Extruded

Radial

10.4 Ω

1.5 in (38.1 mm)

0.5 in (12.7 mm)

Anodized

Black

1.375 in (34.92 mm)

630-45AB

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.449 in (11.4 mm)

1.378 in (35 mm)

Anodized

Black

6.81 g

1.378 in (35 mm)

ATS-1138-C1-R0

Advanced Thermal Solutions

Heat Sink

ATS-1178-C1-R0

Advanced Thermal Solutions

Heat Sink

ATS-CPX030030010-169-C2-R0

Advanced Thermal Solutions

Heat Sink

ATSEU-077B-C1-R0

Advanced Thermal Solutions

Heat Sink

C247-050-2AE

Ohmite Manufacturing

Heat Sink

PSD1-2CB

Cts

Heat Sink

Screw

Transistor

U

Transverse

14.4 Ω

2.18 in (55.37 mm)

0.5 in (12.7 mm)

Black

1.38 in (35.05 mm)

SK434100SA

Fischer Elektronik & Kg

Heat Sink

Extruded

Longitudinal

3.6 Ω

1.575 in (40 mm)

1.969 in (50 mm)

Anodized

Black

3.937 in (100 mm)

281-2AB

Ohmite Manufacturing

Heat Sink

Aluminium

0.5 in (12.7 mm)

0.52 in (13.2 mm)

Anodized

Black

0.752 in (19.1 mm)

374724B60024G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.709 in (18 mm)

1.378 in (35 mm)

Anodized

Black

1.378 in (35 mm)

ATS-1143-C1-R0

Advanced Thermal Solutions

Heat Sink

ATS-51230R-C1-R0

Advanced Thermal Solutions

Heat Sink

ATS-61300W-C1-R0

Advanced Thermal Solutions

Heat Sink

ATS-X53400B-C1-R0

Advanced Thermal Solutions

Heat Sink

ATSEU-077C-C1-R0

Advanced Thermal Solutions

Heat Sink

ATSEU-077C-C3-R0

Advanced Thermal Solutions

Heat Sink

ATSEU-077C-C4-R0

Advanced Thermal Solutions

Heat Sink

ATSEU-077D-C1-R0

Advanced Thermal Solutions

Heat Sink

ATSEU-077D-C3-R0

Advanced Thermal Solutions

Heat Sink

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.