Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
3.5 Ω |
0.787 in (20 mm) |
2.559 in (65 mm) |
Anodized |
Black |
3.937 in (100 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
13.3 Ω |
1.102 in (28 mm) |
0.764 in (19.4 mm) |
0.591 in (15 mm) |
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|
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
0.24 in (6.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
13.4 Ω |
1.18 in (29.97 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.942 in (23.93 mm) |
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Cts |
Heat Sink |
Adhesive |
Aluminium Alloy |
IC |
9.9 Ω |
0.5 in (12.7 mm) |
1.575 in (40 mm) |
Anodized |
Black |
1.575 in (40 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
Chromate |
Extruded |
Longitudinal |
0.902 in (22.9 mm) |
2.323 in (59 mm) |
Gold Anodized |
Maxiflow, Device Used On: Half Brick DC-DC Converter |
2.402 in (61 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
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Ohmite Manufacturing |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.35 in (8.9 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
6.7 g |
1.098 in (27.9 mm) |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.35 in (8.89 mm) |
1.21 in (30.73 mm) |
Anodized |
Black |
1.21 in (30.73 mm) |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium Alloy |
Transistor |
Longitudinal |
11.4 Ω |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Bulk |
18 g |
1.378 in (35 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
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|
Assmann Wsw Components |
Heat Sink |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
5.45 g |
0.984 in (25 mm) |
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Ohmite Manufacturing |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.598 in (15.2 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
14.17 g |
1.098 in (27.9 mm) |
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|
Crydom |
Heat Sink |
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|
CUI Devices |
Heat Sink |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.598 in (15.2 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
14.17 g |
1.098 in (27.9 mm) |
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|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
12.93 Ω |
0.906 in (23 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
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Advanced Thermal Solutions |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
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Schaffner Holding Ag |
Heat Sink |
Transistor |
U |
18 Ω |
0.984 in (25 mm) |
0.433 in (11 mm) |
0.63 in (16 mm) |
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Ohmite Manufacturing |
Heat Sink |
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Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.35 in (59.7 mm) |
7.2 in (182.88 mm) |
9 in (228.6 mm) |
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Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.949 in (24.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
10.4 Ω |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.375 in (34.92 mm) |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.449 in (11.4 mm) |
1.378 in (35 mm) |
Anodized |
Black |
6.81 g |
1.378 in (35 mm) |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
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Cts |
Heat Sink |
Screw |
Transistor |
U |
Transverse |
14.4 Ω |
2.18 in (55.37 mm) |
0.5 in (12.7 mm) |
Black |
1.38 in (35.05 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
3.937 in (100 mm) |
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Ohmite Manufacturing |
Heat Sink |
Aluminium |
0.5 in (12.7 mm) |
0.52 in (13.2 mm) |
Anodized |
Black |
0.752 in (19.1 mm) |
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|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.709 in (18 mm) |
1.378 in (35 mm) |
Anodized |
Black |
1.378 in (35 mm) |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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|
Advanced Thermal Solutions |
Heat Sink |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.