Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions |
Heat Sink |
||||||||||||||||||
TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
3.5 Ω |
1.5 in (38.1 mm) |
2.402 in (61 mm) |
158 g |
4 in (101.6 mm) |
|||||||||||
|
CUI Devices |
Heat Sink |
||||||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.394 in (10 mm) |
Black Anodized |
0.394 in (10 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.866 in (22 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
||||||||||||
|
Cincon Electronics |
Heat Sink |
Screw |
Aluminium Alloy |
Fin |
Longitudinal |
1 in (25.4 mm) |
2.433 in (61.8 mm) |
Black Anodized |
Black |
4.598 in (116.8 mm) |
|||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium Alloy |
Longitudinal |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
1.772 in (45 mm) |
|||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
1.969 in (50 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.6 Ω |
1.575 in (40 mm) |
1.969 in (50 mm) |
Anodized |
Black |
2.953 in (75 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
||||||||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Wakefield-vette |
Heat Sink |
U |
Aluminium |
Fin |
Folded Back |
0.402 in (10.2 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.031 in (26.2 mm) |
|||||||||
|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Adhesive |
Omnidirectional |
0.394 in (10 mm) |
0.906 in (23 mm) |
Anodized |
Black |
0.906 in (23 mm) |
|||||||||
|
Wakefield-vette |
Heat Sink |
Extruded |
2.626 in (66.7 mm) |
4.752 in (120.7 mm) |
285.77 g |
3 in (76.2 mm) |
|||||||||||||
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
0.949 in (24.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.449 in (11.4 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
|
Boyd |
Heat Sink |
5.4 Ω |
1.25 in (31.75 mm) |
1.81 in (45.97 mm) |
Anodized |
Black |
1.81 in (45.97 mm) |
||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Slide On |
Folded Back |
16 Ω |
1.375 in (34.93 mm) |
0.355 in (9.02 mm) |
Anodized |
Black |
0.86 in (21.84 mm) |
|||||||||
Boyd |
Heat Sink |
|||||||||||||||||||
|
Boyd |
Heat Sink |
U |
Copper |
Transverse |
20.8 Ω |
0.7 in (17.78 mm) |
0.375 in (9.52 mm) |
Tin |
0.52 in (13.2 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.906 in (23 mm) |
Black Anodized |
0.906 in (23 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.85 Ω |
1.299 in (33 mm) |
1.811 in (46 mm) |
Anodized |
Black |
2.953 in (75 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
3.094 in (78.6 mm) |
3.15 in (80 mm) |
Anodized |
Black |
3.937 in (100 mm) |
||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
1.969 in (50 mm) |
0.492 in (12.5 mm) |
Anodized |
Black |
1.358 in (34.5 mm) |
||||||||||
|
Traco Electronic Ag |
Heat Sink |
||||||||||||||||||
|
Assmann Wsw Components |
Heat Sink |
||||||||||||||||||
|
Wakefield-vette |
Heat Sink |
Aluminium |
Fin |
Staggered |
1.283 in (32.6 mm) |
0.252 in (6.4 mm) |
Anodized |
Black |
0.874 in (22.2 mm) |
||||||||||
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
1.5 in (38.1 mm) |
2 in (50.8 mm) |
Anodized |
Black |
60.33 g |
2 in (50.8 mm) |
|||||||||||
Ohmite Manufacturing |
Heat Sink |
Extruded |
1.252 in (31.8 mm) |
4.752 in (120.7 mm) |
68.04 g |
1.5 in (38.1 mm) |
||||||||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.449 in (11.4 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
Boyd |
Heat Sink |
Aluminium |
Transistor |
Folded Back |
0.027 in (0.69 mm) |
0.016 in (0.395 mm) |
Black Anodized |
Black |
0.034 in (0.86 mm) |
|||||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Transistor |
Fin |
Transverse |
13.2 Ω |
1 in (25.4 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.48 in (37.59 mm) |
|||||||
|
Wakefield-vette |
Heat Sink |
Aluminium |
Omnidirectional |
1.252 in (31.8 mm) |
1.811 in (46 mm) |
Anodized |
Black |
49.9 g |
1.811 in (46 mm) |
||||||||||
|
Wakefield-vette |
Heat Sink |
||||||||||||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
9.95 Ω |
0.906 in (23 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
9.18 Ω |
0.472 in (12 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
Artesyn Embedded Technologies |
Heat Sink |
Pin Fin Array |
Fin |
Longitudinal |
0.591 in (15 mm) |
2.264 in (57.5 mm) |
2.323 in (59 mm) |
|||||||||||||
Artesyn Embedded Technologies |
Heat Sink |
Pin Fin Array |
Fin |
Longitudinal |
0.902 in (22.9 mm) |
2.264 in (57.5 mm) |
2.323 in (59 mm) |
|||||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Flared |
Omnidirectional |
0.591 in (15 mm) |
1.614 in (41 mm) |
Anodized |
Green |
2.52 in (64 mm) |
|||||||||||
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Flared |
Omnidirectional |
0.591 in (15 mm) |
1.614 in (41 mm) |
Anodized |
Green |
2.52 in (64 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.