Heat Sink Heat Sinks 291

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

ATSEU-077D-C4-R0

Advanced Thermal Solutions

Heat Sink

HS00110

TDK

Heat Sink

Converter

Fin Pin

Omnidirectional

3.5 Ω

1.5 in (38.1 mm)

2.402 in (61 mm)

158 g

4 in (101.6 mm)

HSB11-252518

CUI Devices

Heat Sink

ICKBGA10X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.236 in (6 mm)

0.394 in (10 mm)

Black Anodized

0.394 in (10 mm)

ICKBGA27X27X22

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.866 in (22 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

M-B012

Cincon Electronics

Heat Sink

Screw

Aluminium Alloy

Fin

Longitudinal

1 in (25.4 mm)

2.433 in (61.8 mm)

Black Anodized

Black

4.598 in (116.8 mm)

SA-LED-125E

Ohmite Manufacturing

Heat Sink

SK40938.1STS

Fischer Elektronik & Kg

Heat Sink

Aluminium Alloy

Longitudinal

1.5 in (38.1 mm)

0.5 in (12.7 mm)

1.772 in (45 mm)

SK43450SA

Fischer Elektronik & Kg

Heat Sink

Extruded

Longitudinal

3.6 Ω

1.575 in (40 mm)

1.969 in (50 mm)

Anodized

Black

1.969 in (50 mm)

SK43475SA

Fischer Elektronik & Kg

Heat Sink

Extruded

Longitudinal

3.6 Ω

1.575 in (40 mm)

1.969 in (50 mm)

Anodized

Black

2.953 in (75 mm)

SK5850SA

Fischer Elektronik & Kg

Heat Sink

WV-T220-101E

Ohmite Manufacturing

Heat Sink

218-40CTE5

Wakefield-vette

Heat Sink

U

Aluminium

Fin

Folded Back

0.402 in (10.2 mm)

0.5 in (12.7 mm)

Anodized

Black

1.031 in (26.2 mm)

374024B00035G

Boyd

Heat Sink

Pin Fin Array

Aluminium

Adhesive

Omnidirectional

0.394 in (10 mm)

0.906 in (23 mm)

Anodized

Black

0.906 in (23 mm)

421K

Wakefield-vette

Heat Sink

Extruded

2.626 in (66.7 mm)

4.752 in (120.7 mm)

285.77 g

3 in (76.2 mm)

517-95AB-MS4

Wakefield-vette

Heat Sink

Aluminium

Extruded

0.949 in (24.1 mm)

2.28 in (57.9 mm)

Anodized

Black

2.402 in (61 mm)

528-45AB

Ohmite Manufacturing

Heat Sink

Aluminium

Extruded

0.449 in (11.4 mm)

2.28 in (57.9 mm)

Anodized

Black

2.402 in (61 mm)

568303B00000G

Boyd

Heat Sink

5.4 Ω

1.25 in (31.75 mm)

1.81 in (45.97 mm)

Anodized

Black

1.81 in (45.97 mm)

574902B03300G

Boyd

Heat Sink

Aluminium

Slide On

Folded Back

16 Ω

1.375 in (34.93 mm)

0.355 in (9.02 mm)

Anodized

Black

0.86 in (21.84 mm)

61085

Boyd

Heat Sink

7140DG

Boyd

Heat Sink

U

Copper

Transverse

20.8 Ω

0.7 in (17.78 mm)

0.375 in (9.52 mm)

Tin

0.52 in (13.2 mm)

DV-T263-301E-TR

Ohmite Manufacturing

Heat Sink

ICKBGA23X23X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.906 in (23 mm)

Black Anodized

0.906 in (23 mm)

SK6875SA

Fischer Elektronik & Kg

Heat Sink

Screw

Transistor

Extruded

Longitudinal

5.85 Ω

1.299 in (33 mm)

1.811 in (46 mm)

Anodized

Black

2.953 in (75 mm)

SK89100SA

Fischer Elektronik & Kg

Heat Sink

Extruded

3.094 in (78.6 mm)

3.15 in (80 mm)

Anodized

Black

3.937 in (100 mm)

SV-LED-113E

Ohmite Manufacturing

Heat Sink

SV-LED-125E

Ohmite Manufacturing

Heat Sink

SV-LED-151E

Ohmite Manufacturing

Heat Sink

SV-LED-176E

Ohmite Manufacturing

Heat Sink

SW50-4G

Boyd

Heat Sink

Aluminium

Extruded

Radial

1.969 in (50 mm)

0.492 in (12.5 mm)

Anodized

Black

1.358 in (34.5 mm)

TEN-HS4

Traco Electronic Ag

Heat Sink

V7237C

Assmann Wsw Components

Heat Sink

242-125ABE-22

Wakefield-vette

Heat Sink

Aluminium

Fin

Staggered

1.283 in (32.6 mm)

0.252 in (6.4 mm)

Anodized

Black

0.874 in (22.2 mm)

302NN

Wakefield-vette

Heat Sink

Aluminium

Extruded

1.5 in (38.1 mm)

2 in (50.8 mm)

Anodized

Black

60.33 g

2 in (50.8 mm)

401K

Ohmite Manufacturing

Heat Sink

Extruded

1.252 in (31.8 mm)

4.752 in (120.7 mm)

68.04 g

1.5 in (38.1 mm)

527-45AB

Ohmite Manufacturing

Heat Sink

Aluminium

Extruded

0.449 in (11.4 mm)

2.28 in (57.9 mm)

Anodized

Black

2.402 in (61 mm)

574602B03300

Boyd

Heat Sink

Aluminium

Transistor

Folded Back

0.027 in (0.69 mm)

0.016 in (0.395 mm)

Black Anodized

Black

0.034 in (0.86 mm)

578622B03200G

Boyd

Heat Sink

U

Aluminium

Transistor

Fin

Transverse

13.2 Ω

1 in (25.4 mm)

0.5 in (12.7 mm)

Anodized

Black

1.48 in (37.59 mm)

680-125220

Wakefield-vette

Heat Sink

Aluminium

Omnidirectional

1.252 in (31.8 mm)

1.811 in (46 mm)

Anodized

Black

49.9 g

1.811 in (46 mm)

902-21-1-12-2-B-0

Wakefield-vette

Heat Sink

910-40-1-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Elliptical Fin

9.95 Ω

0.906 in (23 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

910-40-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

9.18 Ω

0.472 in (12 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

APA501-60-001

Artesyn Embedded Technologies

Heat Sink

Pin Fin Array

Fin

Longitudinal

0.591 in (15 mm)

2.264 in (57.5 mm)

2.323 in (59 mm)

APA501-60-003

Artesyn Embedded Technologies

Heat Sink

Pin Fin Array

Fin

Longitudinal

0.902 in (22.9 mm)

2.264 in (57.5 mm)

2.323 in (59 mm)

ATS-1039-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ATS-1039-C2-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ATS-1042-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Flared

Omnidirectional

0.591 in (15 mm)

1.614 in (41 mm)

Anodized

Green

2.52 in (64 mm)

ATS-1042-C2-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Flared

Omnidirectional

0.591 in (15 mm)

1.614 in (41 mm)

Anodized

Green

2.52 in (64 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.