Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
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Crydom |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.551 in (14 mm) |
Black Anodized |
0.551 in (14 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
0.189 in (4.8 mm) |
0.248 in (6.3 mm) |
Anodized |
Black |
0.512 in (13 mm) |
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Boyd |
Heat Sink |
Clip |
Aluminium |
Transistor |
Transverse |
0.768 in (19.5 mm) |
0.512 in (13 mm) |
Anodized |
Black |
0.5 in (12.7 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Longitudinal |
3.1 Ω |
0.591 in (15 mm) |
6.26 in (159 mm) |
Anodized |
Natural |
39.37 in (1000 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
3.5 Ω |
0.787 in (20 mm) |
2.559 in (65 mm) |
Anodized |
Black |
39.37 in (1000 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.85 Ω |
1.299 in (33 mm) |
1.811 in (46 mm) |
Anodized |
Black |
39.37 in (1000 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.85 Ω |
1.299 in (33 mm) |
1.811 in (46 mm) |
Anodized |
Black |
3.937 in (100 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
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Assmann Wsw Components |
Heat Sink |
Aluminium Alloy |
Transistor |
Folded Back |
21 Ω |
0.252 in (6.4 mm) |
0.878 in (22.3 mm) |
Anodized |
Black |
1.409 in (35.8 mm) |
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Ohmite Manufacturing |
Heat Sink |
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Boyd |
Heat Sink |
Radial |
35.2 Ω |
0.5 in (12.7 mm) |
Anodized |
Black |
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Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.409 in (61.2 mm) |
7.2 in (182.88 mm) |
3 in (76.2 mm) |
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Boyd |
Heat Sink |
Aluminium |
Fin |
8.7 Ω |
0.72 in (18.29 mm) |
1.78 in (45.2 mm) |
Anodized |
Black |
1.78 in (45.2 mm) |
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Boyd |
Heat Sink |
U |
Aluminium |
Clip |
Transverse |
27.3 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.5 in (12.7 mm) |
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Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
32 Ω |
0.75 in (19.05 mm) |
0.25 in (6.35 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
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Wakefield-vette |
Heat Sink |
Adhesive |
0.35 in (8.9 mm) |
1.378 in (35 mm) |
12.26 g |
1.378 in (35 mm) |
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Boyd |
Heat Sink |
Copper Alloy |
IC |
U |
Folded Back |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin Lead |
Low Profile |
Bag |
1.02 in (25.91 mm) |
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Boyd |
Heat Sink |
Copper Alloy |
IC |
U |
Folded Back |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin Lead |
Low Profile |
Tape and Reel, 13 in |
1.02 in (25.91 mm) |
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Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.827 in (21 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.295 in (7.5 mm) |
1.575 in (40 mm) |
Anodized |
Blue |
1.575 in (40 mm) |
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Advanced Thermal Solutions |
Heat Sink |
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Ohmite Manufacturing |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Transverse |
16 Ω |
1.102 in (28 mm) |
0.591 in (15 mm) |
0.728 in (18.5 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
Clip |
Copper |
Transistor |
U |
Transverse |
20.5 Ω |
0.354 in (9 mm) |
0.787 in (20 mm) |
1.063 in (27 mm) |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
2.2 Ω |
1 in (25.4 mm) |
2.402 in (61 mm) |
150 g |
4.598 in (116.8 mm) |
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CUI Devices |
Heat Sink |
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CUI Devices |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
0.728 in (18.5 mm) |
0.984 in (25 mm) |
7 g |
0.984 in (25 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
Screw |
Transistor |
Extruded |
Longitudinal |
5.3 Ω |
0.984 in (25 mm) |
1.654 in (42 mm) |
Anodized |
Black |
2 in (50.8 mm) |
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Fischer Elektronik & Kg |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
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Fischer Elektronik & Kg |
Heat Sink |
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Ohmite Manufacturing |
Heat Sink |
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TE Connectivity |
Heat Sink |
Clip |
Aluminium, Cold-Forged Aluminium |
Transceiver |
Pin Fin |
15 W |
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TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
0.357 in (9.06 mm) |
1.375 in (34.92 mm) |
15 W |
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Omron |
Heat Sink |
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Omron |
Heat Sink |
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Omron |
Heat Sink |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.