Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE Connectivity |
Heat Sink |
Clip/Screw |
Aluminium Alloy |
Fin |
Longitudinal |
0.404 in (10.27 mm) |
3.37 in (85.6 mm) |
Anodized |
4.39 in (111.5 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
27 g |
1.638 in (41.6 mm) |
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Celduc Relais |
Heat Sink |
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|
Boyd |
Heat Sink |
Aluminium |
Fin |
Transverse |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
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Celduc Relais |
Heat Sink |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
3.7 Ω |
1.5 in (38.1 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Extruded |
Staggered |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.374 in (34.9 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
27.2 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
2 in (50.8 mm) |
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Ohmite Manufacturing |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
0.374 in (9.5 mm) |
0.531 in (13.5 mm) |
0.748 in (19 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
10 Ω |
0.22 in (5.6 mm) |
0.953 in (24.2 mm) |
9.49 g |
1.961 in (49.8 mm) |
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|
Traco Electronic Ag |
Heat Sink |
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|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.827 in (21 mm) |
Anodized |
Black |
4.09 g |
0.827 in (21 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
Aluminium |
Pin Fin |
4.2 Ω |
0.394 in (10 mm) |
0.551 in (14 mm) |
0.551 in (14 mm) |
|||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
17.5 g |
1.638 in (41.6 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Transistor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
0.189 in (4.8 mm) |
0.748 in (19 mm) |
Anodized |
Black |
0.394 in (10 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Tape and Reel |
2.2 g |
1.024 in (26 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Fin |
Folded Back |
4.4 Ω |
1.75 in (44.45 mm) |
0.95 in (24.13 mm) |
Anodized |
Black |
1.9 in (48.26 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Transistor |
Extruded |
Radial |
3.3 Ω |
2 in (50.8 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
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Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.949 in (24.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
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|
Schaffner Holding Ag |
Heat Sink |
Transistor |
18 Ω |
0.984 in (25 mm) |
0.433 in (11 mm) |
0.63 in (16 mm) |
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|
Boyd |
Heat Sink |
U |
Copper |
Fin |
Longitudinal |
15 Ω |
0.4 in (10.16 mm) |
0.315 in (8 mm) |
Tin |
Gray |
Tape and Reel, 13 in |
0.9 in (22.86 mm) |
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|
Boyd |
Heat Sink |
U |
Copper |
20.3 Ω |
0.866 in (22 mm) |
0.433 in (11 mm) |
Tin |
0.866 in (22 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Clip |
Aluminium Alloy |
Extruded |
4.2 Ω |
1.969 in (50 mm) |
1.063 in (27 mm) |
Anodized |
Black |
85 g |
2.953 in (75 mm) |
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Advanced Thermal Solutions |
Heat Sink |
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|
Traco Electronic Ag |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium Alloy |
Semiconductor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Bulk |
2 g |
0.906 in (23 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
||||||||||||||||||
|
Advanced Thermal Solutions |
Heat Sink |
||||||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Bulk |
3.3 g |
0.906 in (23 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
32 Ω |
0.75 in (19.05 mm) |
0.25 in (6.35 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.512 in (13 mm) |
Tape and Reel |
3.9 g |
1.22 in (31 mm) |
|||||||||||
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
15 W |
||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2.5 in (63.5 mm) |
0.984 in (25 mm) |
Anodized |
Black |
46 g |
1.638 in (41.6 mm) |
||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
||||||||||||
|
Boyd |
Heat Sink |
Solder |
Copper |
IC |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin |
Tape and Reel, 13 in |
1.02 in (25.91 mm) |
||||||||||
|
Advanced Thermal Solutions |
Heat Sink |
||||||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Copper |
IC |
0.394 in (10 mm) |
0.315 in (8 mm) |
Tape and Reel |
2 g |
0.906 in (23 mm) |
|||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
13 Ω |
0.984 in (25 mm) |
0.492 in (12.5 mm) |
Anodized |
Black |
1.358 in (34.5 mm) |
|||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
15.6 Ω |
0.7 in (17.78 mm) |
0.375 in (9.52 mm) |
Anodized |
Black |
1.75 in (44.45 mm) |
||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.551 in (14 mm) |
Black Anodized |
0.551 in (14 mm) |
||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
13.1 Ω |
1.1 in (27.94 mm) |
0.106 in (2.7 mm) |
Anodized |
Black |
0.787 in (20 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.