Heat Sink Heat Sinks 291

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

1963856-1

TE Connectivity

Heat Sink

Clip/Screw

Aluminium Alloy

Fin

Longitudinal

0.404 in (10.27 mm)

3.37 in (85.6 mm)

Anodized

4.39 in (111.5 mm)

FA-T220-38E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1.5 in (38.1 mm)

0.984 in (25 mm)

Anodized

Black

27 g

1.638 in (41.6 mm)

WF115100

Celduc Relais

Heat Sink

577202B00000G

Boyd

Heat Sink

Aluminium

Fin

Transverse

0.75 in (19.05 mm)

0.5 in (12.7 mm)

Anodized

Black

0.52 in (13.21 mm)

WF070000

Celduc Relais

Heat Sink

529802B02500G

Boyd

Heat Sink

Aluminium

Extruded

Radial

3.7 Ω

1.5 in (38.1 mm)

1 in (25.4 mm)

Anodized

Black

1.65 in (41.91 mm)

SK10438,1STS

Fischer Elektronik & Kg

Heat Sink

Extruded

Staggered

1.5 in (38.1 mm)

0.5 in (12.7 mm)

Anodized

Black

1.374 in (34.9 mm)

508700B00000G

Boyd

Heat Sink

Aluminium

Extruded

Longitudinal

27.2 Ω

0.19 in (4.83 mm)

0.53 in (13.46 mm)

Anodized

Black

2 in (50.8 mm)

274-2AB

Ohmite Manufacturing

Heat Sink

FK231SA220

Fischer Elektronik & Kg

Heat Sink

Aluminium

0.374 in (9.5 mm)

0.531 in (13.5 mm)

0.748 in (19 mm)

WV-T247-101E

Ohmite Manufacturing

Heat Sink

7G0020A

TDK

Heat Sink

Converter

Fin Pin

Omnidirectional

10 Ω

0.22 in (5.6 mm)

0.953 in (24.2 mm)

9.49 g

1.961 in (49.8 mm)

TEN-HS1

Traco Electronic Ag

Heat Sink

624-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.827 in (21 mm)

Anodized

Black

4.09 g

0.827 in (21 mm)

ICKS14X14X10

Fischer Elektronik & Kg

Heat Sink

Adhesive

Aluminium

Pin Fin

4.2 Ω

0.394 in (10 mm)

0.551 in (14 mm)

0.551 in (14 mm)

FA-T220-25E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1 in (25.4 mm)

0.984 in (25 mm)

Anodized

Black

17.5 g

1.638 in (41.6 mm)

DA-T263-101E

Ohmite Manufacturing

Heat Sink

Aluminium

Transistor

Extruded

Fin Pin

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Anodized

Black

Bulk

3.8 g

1.02 in (25.91 mm)

ICKSMDB10SA

Fischer Elektronik & Kg

Heat Sink

0.189 in (4.8 mm)

0.748 in (19 mm)

Anodized

Black

0.394 in (10 mm)

FK24408D2PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Tape and Reel

2.2 g

1.024 in (26 mm)

7023BG

Boyd

Heat Sink

Aluminium

Fin

Folded Back

4.4 Ω

1.75 in (44.45 mm)

0.95 in (24.13 mm)

Anodized

Black

1.9 in (48.26 mm)

6399BG

Boyd

Heat Sink

Aluminium

Transistor

Extruded

Radial

3.3 Ω

2 in (50.8 mm)

1 in (25.4 mm)

Anodized

Black

1.65 in (41.91 mm)

SKK510

Fischer Elektronik & Kg

Heat Sink

517-95AB

Ohmite Manufacturing

Heat Sink

Aluminium

Extruded

0.949 in (24.1 mm)

2.28 in (57.9 mm)

Anodized

Black

2.402 in (61 mm)

WA400-8P

Schaffner Holding Ag

Heat Sink

Transistor

18 Ω

0.984 in (25 mm)

0.433 in (11 mm)

0.63 in (16 mm)

573100D00010G

Boyd

Heat Sink

U

Copper

Fin

Longitudinal

15 Ω

0.4 in (10.16 mm)

0.315 in (8 mm)

Tin

Gray

Tape and Reel, 13 in

0.9 in (22.86 mm)

PF750G

Boyd

Heat Sink

U

Copper

20.3 Ω

0.866 in (22 mm)

0.433 in (11 mm)

Tin

0.866 in (22 mm)

CR101-75AE

Ohmite Manufacturing

Heat Sink

Clip

Aluminium Alloy

Extruded

4.2 Ω

1.969 in (50 mm)

1.063 in (27 mm)

Anodized

Black

85 g

2.953 in (75 mm)

ATS-56010-C4-R0

Advanced Thermal Solutions

Heat Sink

THN-HS1

Traco Electronic Ag

Heat Sink

DV-T263-101E

Ohmite Manufacturing

Heat Sink

Aluminium Alloy

Semiconductor

Extruded

Fin Pin

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Bulk

3.8 g

1.02 in (25.91 mm)

FK24408DPAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Bulk

2 g

0.906 in (23 mm)

ICKS10X10X6.5

Fischer Elektronik & Kg

Heat Sink

ATSEU-077D-C2-R0

Advanced Thermal Solutions

Heat Sink

FK24413DPAK

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Bulk

3.3 g

0.906 in (23 mm)

577002B00000G

Boyd

Heat Sink

U

Aluminium

Fin

Longitudinal

32 Ω

0.75 in (19.05 mm)

0.25 in (6.35 mm)

Anodized

Black

0.52 in (13.21 mm)

FK24413D3PAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.512 in (13 mm)

Tape and Reel

3.9 g

1.22 in (31 mm)

1-1542002-0

TE Connectivity

Heat Sink

Clip

Aluminium

IC

Radial

UL

15 W

FA-T220-64E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

2.5 in (63.5 mm)

0.984 in (25 mm)

Anodized

Black

46 g

1.638 in (41.6 mm)

ICKBGA31X31X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

1.22 in (31 mm)

Black Anodized

1.22 in (31 mm)

7106D/TRG

Boyd

Heat Sink

Solder

Copper

IC

0.375 in (9.52 mm)

0.59 in (14.99 mm)

Tin

Tape and Reel, 13 in

1.02 in (25.91 mm)

ATSEU-077C-C2-R0

Advanced Thermal Solutions

Heat Sink

FK24408DPAKTR

Fischer Elektronik & Kg

Heat Sink

Copper

IC

0.394 in (10 mm)

0.315 in (8 mm)

Tape and Reel

2 g

0.906 in (23 mm)

SW25-2G

Boyd

Heat Sink

Aluminium

Extruded

Radial

13 Ω

0.984 in (25 mm)

0.492 in (12.5 mm)

Anodized

Black

1.358 in (34.5 mm)

507002B00000G

Boyd

Heat Sink

U

Aluminium

Fin

Longitudinal

15.6 Ω

0.7 in (17.78 mm)

0.375 in (9.52 mm)

Anodized

Black

1.75 in (44.45 mm)

C247-075-3VE

Ohmite Manufacturing

Heat Sink

ICKBGA14X14X10

Fischer Elektronik & Kg

Heat Sink

IC

Fin

0.394 in (10 mm)

0.551 in (14 mm)

Black Anodized

0.551 in (14 mm)

C247-075-3AE

Ohmite Manufacturing

Heat Sink

HF20G

Boyd

Heat Sink

Aluminium

Extruded

13.1 Ω

1.1 in (27.94 mm)

0.106 in (2.7 mm)

Anodized

Black

0.787 in (20 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.