Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Ohmite Manufacturing |
Heat Sink |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
24.4 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
Aluminium |
Omnidirectional |
3.2 Ω |
0.787 in (20 mm) |
1.433 in (36.4 mm) |
Thermal Resistance Min: 0.95 |
24 g |
1.433 in (36.4 mm) |
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|
Boyd |
Heat Sink |
Radial |
99.99 Ω |
0.235 in (5.97 mm) |
Anodized |
Black |
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|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.906 in (23 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
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|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.709 in (18 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
25.9 Ω |
0.75 in (19.05 mm) |
0.375 in (9.52 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
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Vicor |
Heat Sink |
Aluminium Alloy |
Extruded |
0.909 in (23.1 mm) |
2.22 in (56.4 mm) |
2.28 in (57.9 mm) |
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|
Assmann Wsw Components |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
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|
Crydom |
Heat Sink |
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|
Boyd |
Heat Sink |
U |
Copper |
Fin |
18 Ω |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Tin |
1.03 in (26.16 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
9.5 Ω |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Black Anodized |
Black |
Bulk |
18 g |
1.378 in (35 mm) |
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Boyd |
Heat Sink |
Aluminium |
8.9 Ω |
0.748 in (19 mm) |
Anodized |
Black |
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|
Fischer Elektronik & Kg |
Heat Sink |
Transistor |
Extruded |
Longitudinal |
7.8 Ω |
1.102 in (28 mm) |
0.764 in (19.4 mm) |
1.181 in (30 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
0.394 in (10 mm) |
Black Anodized |
0.394 in (10 mm) |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
970 mΩ |
1.378 in (35 mm) |
2.752 in (69.9 mm) |
280 g |
4.803 in (122 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Clip |
11.5 Ω |
1.22 in (30.99 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1 in (25.4 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
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Advanced Thermal Solutions |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
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|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
15 W |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
32 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
1.45 in (36.83 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
4.8 Ω |
2 in (50.8 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Fin |
16.7 Ω |
1.25 in (31.75 mm) |
0.25 in (6.35 mm) |
Anodized |
Black |
0.875 in (22.23 mm) |
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|
Boyd |
Heat Sink |
Copper |
Staggered |
8.3 Ω |
2 in (50.8 mm) |
Tin |
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|
Ohmite Manufacturing |
Heat Sink |
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Crydom |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
7.4 Ω |
0.984 in (25 mm) |
Anodized |
Black |
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|
Fischer Elektronik & Kg |
Heat Sink |
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Ohmite Manufacturing |
Heat Sink |
Aluminium |
0.374 in (9.5 mm) |
0.52 in (13.2 mm) |
Anodized |
Black |
0.752 in (19.1 mm) |
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|
Boyd |
Heat Sink |
U |
Copper |
Clip |
Transverse |
19.7 Ω |
0.848 in (21.54 mm) |
0.515 in (13.08 mm) |
Tin |
0.52 in (13.21 mm) |
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TDK |
Heat Sink |
Converter |
Fin Pin |
Omnidirectional |
1.5 Ω |
1.5 in (38.1 mm) |
2.402 in (61 mm) |
250 g |
4.598 in (116.8 mm) |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.394 in (10 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
0.25 in (6.35 mm) |
Anodized |
0.305 in (7.75 mm) |
Black |
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|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
56 Ω |
0.25 in (6.35 mm) |
Anodized |
Black |
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|
Boyd |
Heat Sink |
U |
Aluminium |
Slide On |
Folded Back |
21.6 Ω |
0.69 in (17.53 mm) |
0.355 in (9.02 mm) |
Anodized |
Black |
0.86 in (21.84 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
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|
Fischer Elektronik & Kg |
Heat Sink |
IC |
Fin |
0.236 in (6 mm) |
0.906 in (23 mm) |
Black Anodized |
0.906 in (23 mm) |
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|
Assmann Wsw Components |
Heat Sink |
Aluminium |
Longitudinal |
12 Ω |
0.472 in (12 mm) |
0.787 in (20 mm) |
Black Anodized |
Black |
1.142 in (29 mm) |
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|
Boyd |
Heat Sink |
Copper |
15 Ω |
0.4 in (10.16 mm) |
0.315 in (8 mm) |
Tin |
0.9 in (22.86 mm) |
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Boyd |
Heat Sink |
Copper |
15 Ω |
0.375 in (9.52 mm) |
0.59 in (14.99 mm) |
Tin |
Tape and Reel |
1.02 in (25.91 mm) |
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|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2 in (50.8 mm) |
0.984 in (25 mm) |
Anodized |
Black |
37 g |
1.638 in (41.6 mm) |
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|
Mean Well Enterprises |
Heat Sink |
Fin |
Transverse |
3 Ω |
CUL; UL |
1 in (25.4 mm) |
2.283 in (58 mm) |
Approvals: CE; EAC |
25 g |
2.402 in (61 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.