Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
60 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX16 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1.95 V |
105 MHz |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
4096 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
52 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
64 |
UNCASED CHIP |
WAFER |
DRAMs |
90 Cel |
3-STATE |
2MX64 |
2M |
-25 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.95 V |
104 MHz |
Not Qualified |
134217728 bit |
1.65 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
150 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
MIL-M-38510 Class B |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
150 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
130 mA |
16777216 words |
2,4,8,16 |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX16 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1.9 V |
133 MHz |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
2,4,8,16 |
6 ns |
|||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
DIE |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
140 mA |
33554432 words |
2,4,8,16 |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
105 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
R-XUUC-N |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
2,4,8,16 |
6 ns |
|||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
16384 words |
5 |
1 |
IN-LINE |
110 Cel |
16KX1 |
16K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
250 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
8192 |
CMOS |
85 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
DIE OR CHIP |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-20 Cel |
133 MHz |
Not Qualified |
536870912 bit |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
8192 |
CMOS |
90 mA |
33554432 words |
2,4,8,16 |
COMMON |
1.8 |
1.8 |
16 |
WAFER |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
133 MHz |
Not Qualified |
536870912 bit |
.00001 Amp |
2,4,8,16 |
6 ns |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
150 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
150 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
95 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX32 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
85 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
90 mA |
33554432 words |
2,4,8,16 |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
2,4,8,16 |
6 ns |
||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
DIE |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
UNCASED CHIP |
85 Cel |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
R-XUUC-N |
1.9 V |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
DIE |
4096 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
80 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
3-STATE |
8MX16 |
8M |
UPPER |
1 |
X-XUUC-N |
1 |
1.95 V |
133 MHz |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
200 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
200 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER DRAM |
MILITARY |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
MIL-M-38510 Class B |
THROUGH-HOLE |
ASYNCHRONOUS |
90 mA |
262144 words |
COMMON |
5 |
1 |
IN-LINE |
DIP16,.3 |
110 Cel |
256KX1 |
256K |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
.01 Amp |
150 ns |
||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
80 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX16 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.95 V |
133 MHz |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
DIE |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
UNCASED CHIP |
105 Cel |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1.9 V |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
150 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
110 Cel |
3-STATE |
256KX1 |
256K |
-55 Cel |
Tin/Lead (Sn/Pb) - hot dipped |
DUAL |
R-XDIP-T16 |
Not Qualified |
262144 bit |
e0 |
150 ns |
|||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
8192 |
CMOS |
90 mA |
16777216 words |
2,4,8,16 |
COMMON |
1.8 |
1.8 |
16 |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX16 |
16M |
-30 Cel |
133 MHz |
Not Qualified |
268435456 bit |
.0006 Amp |
2,4,8,16 |
6 ns |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
120 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
85 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
DIE OR CHIP |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
200 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
150 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
110 Cel |
3-STATE |
256KX1 |
256K |
-55 Cel |
Tin/Lead (Sn/Pb) - hot dipped |
DUAL |
R-XDIP-T16 |
Not Qualified |
262144 bit |
e0 |
150 ns |
|||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
150 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
180 mA |
33554432 words |
2,4,8,16 |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
105 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.9 V |
166 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
2,4,8,16 |
5 ns |
||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
Not Qualified |
65536 bit |
e0 |
100 ns |
||||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
8192 |
PLASTIC/EPOXY |
CMOS |
180 mA |
33554432 words |
2,4,8,16 |
COMMON |
1.8 |
1.8 |
16 |
WAFER |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
166 MHz |
Not Qualified |
536870912 bit |
.00001 Amp |
2,4,8,16 |
5 ns |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
200 ns |
|||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER DRAM |
MILITARY |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
MIL-M-38510 Class B |
THROUGH-HOLE |
ASYNCHRONOUS |
90 mA |
262144 words |
COMMON |
5 |
1 |
IN-LINE |
DIP16,.3 |
110 Cel |
256KX1 |
256K |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
.01 Amp |
150 ns |
||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
PAGE |
NO |
1 |
NMOS |
MIL-M-38510 Class B |
THROUGH-HOLE |
ASYNCHRONOUS |
16384 words |
5 |
1 |
IN-LINE |
110 Cel |
16KX1 |
16K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
250 ns |
|||||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
OTHER |
DIE |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
UNCASED CHIP |
85 Cel |
32MX16 |
32M |
-25 Cel |
UPPER |
1 |
X-XUUC-N |
1.9 V |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
MIL-M-38510 Class B |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
200 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
COMMERCIAL EXTENDED |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
90 mA |
16777216 words |
2,4,8,16 |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX16 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1.9 V |
133 MHz |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
.0006 Amp |
2,4,8,16 |
6 ns |
|||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
200 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
150 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
PAGE |
NO |
1 |
NMOS |
MIL-M-38510 Class B |
THROUGH-HOLE |
ASYNCHRONOUS |
16384 words |
5 |
1 |
IN-LINE |
110 Cel |
16KX1 |
16K |
-55 Cel |
DUAL |
1 |
R-XDIP-T16 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
200 ns |
|||||||||||||||||||||||||||||
STMicroelectronics |
DDR1 DRAM |
COMMERCIAL EXTENDED |
149 |
BGA |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
16 |
GRID ARRAY |
85 Cel |
16MX16 |
16M |
-30 Cel |
BOTTOM |
1 |
X-XBGA-B149 |
1.9 V |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
6 ns |
|||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
8192 |
CMOS |
85 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
WAFER |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
133 MHz |
Not Qualified |
536870912 bit |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
110 Cel |
64KX1 |
64K |
-55 Cel |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
65536 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
150 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.