Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
EDO DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
7.7 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
17.14 mm |
50 ns |
||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
6129 mA |
134217728 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
43.05 mm |
133 MHz |
6.35 mm |
Not Qualified |
9663676416 bit |
3 V |
AUTO/SELF REFRESH |
.067 Amp |
133.35 mm |
5.4 ns |
||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
8.89 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.15 mm |
100 ns |
||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
24 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
16777216 words |
5 |
1 |
IN-LINE |
1.27 mm |
16MX1 |
16M |
ZIG-ZAG |
1 |
R-PZIP-T24 |
5.5 V |
12.07 mm |
Not Qualified |
16777216 bit |
4.5 V |
30.88 mm |
60 ns |
||||||||||||||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
640 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
32 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.47 V |
25.4 mm |
Not Qualified |
268435456 bit |
3.13 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.002 Amp |
40 ns |
||||||||||||||||||
Toshiba |
OTHER DRAM |
40 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
262144 words |
3.3 |
16 |
SMALL OUTLINE |
1.27 mm |
256KX16 |
256K |
DUAL |
1 |
R-PDSO-J40 |
3.6 V |
3.7 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
26.04 mm |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
2097152 words |
5 |
9 |
SMALL OUTLINE |
1.27 mm |
2MX9 |
2M |
DUAL |
1 |
R-PDSO-J32 |
5.5 V |
3.6 mm |
10.2 mm |
Not Qualified |
18874368 bit |
4.5 V |
21 mm |
60 ns |
|||||||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
26 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
4194304 words |
3.3 |
4 |
SMALL OUTLINE |
4MX4 |
4M |
DUAL |
1 |
R-PDSO-J26 |
3.6 V |
Not Qualified |
16777216 bit |
3 V |
60 ns |
|||||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
40 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J40 |
5.5 V |
3.7 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
26.04 mm |
80 ns |
|||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
150 mA |
33554432 words |
2,4 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
2,4 |
22.22 mm |
1 ns |
|||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
44 |
TSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
155 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
70 ns |
|||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
1048576 words |
3.3 |
4 |
SMALL OUTLINE |
1.27 mm |
1MX4 |
1M |
DUAL |
1 |
R-PDSO-J20 |
3.6 V |
3.75 mm |
7.7 mm |
Not Qualified |
4194304 bit |
3 V |
17.15 mm |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
4194304 words |
9 |
4MX9 |
4M |
1 |
Not Qualified |
37748736 bit |
60 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1520 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
133 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
5.4 ns |
|||||||||||||||||||
Toshiba |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
143 MHz |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
28 |
ZIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
75 mA |
524288 words |
NO |
COMMON |
5 |
5 |
9 |
IN-LINE |
ZIP28,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX9 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T28 |
Not Qualified |
4718592 bit |
e0 |
.0003 Amp |
100 ns |
|||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
304 mA |
2097152 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
0 Cel |
SINGLE |
R-PSMA-N72 |
17.78 mm |
Not Qualified |
75497472 bit |
.004 Amp |
70 ns |
|||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
8.89 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.15 mm |
100 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
170 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
24 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
95 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ24/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J24 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
70 ns |
|||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3429 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
143 MHz |
Not Qualified |
2415919104 bit |
3 V |
AUTO/SELF REFRESH |
.049 Amp |
5.4 ns |
|||||||||||||||||||
Toshiba |
OTHER DRAM |
40 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
262144 words |
5 |
18 |
SMALL OUTLINE |
1.27 mm |
256KX18 |
256K |
TIN LEAD |
DUAL |
1 |
R-PDSO-J40 |
5.5 V |
3.7 mm |
10.16 mm |
Not Qualified |
4718592 bit |
4.5 V |
e0 |
26.04 mm |
80 ns |
|||||||||||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
776 mA |
8388608 words |
NO |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
SINGLE |
R-PSMA-N72 |
25.4 mm |
Not Qualified |
268435456 bit |
.016 Amp |
70 ns |
||||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
INDUSTRIAL |
60 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
16777216 words |
2,4 |
COMMON |
1.8,2.5 |
18 |
GRID ARRAY |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B60 |
200 MHz |
Not Qualified |
301989888 bit |
e0 |
2,4 |
.6 ns |
|||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
DUAL BANK PAGE BURST |
1 |
CMOS |
SYNCHRONOUS |
4194304 words |
YES |
3.3 |
4 |
70 Cel |
4MX4 |
4M |
0 Cel |
1 |
3.6 V |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
60 ns |
||||||||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
24.6 mm |
100 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
NO LEAD |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.45 V |
Not Qualified |
536870912 bit |
3.15 V |
AUTO/SELF REFRESH |
8.5 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1MX36 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
37748736 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
80 ns |
||||||||||||||||||||||||||||||
|
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
2,4 |
YES |
COMMON |
2.5 |
1.8,2.5 |
18 |
GRID ARRAY, THIN PROFILE |
BGA60,6X15,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
16MX18 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
200 MHz |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4 |
16.5 mm |
.65 ns |
||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
262144 words |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
256KX9 |
256K |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
Not Qualified |
2359296 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
70 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
50 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J20 |
Not Qualified |
1048576 bit |
e0 |
.0003 Amp |
120 ns |
||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1MX9 |
1M |
0 Cel |
TIN LEAD |
SINGLE |
1 |
R-XSMA-T30 |
5.5 V |
Not Qualified |
9437184 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
100 ns |
|||||||||||||||||||||||||||||
Toshiba |
DRAM MODULE |
72 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
1048576 words |
36 |
SMALL OUTLINE |
1MX36 |
1M |
DUAL |
1 |
R-PDSO-G72 |
Not Qualified |
37748736 bit |
80 ns |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
150 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Toshiba |
DDR1 DRAM |
INDUSTRIAL |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
2.5 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX18 |
16M |
-40 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO REFRESH |
e0 |
16.5 mm |
.65 ns |
||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
MOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
5 |
40 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3-STATE |
2MX40 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
83886080 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
100 ns |
|||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
40 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
55 mA |
262144 words |
NO |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE |
SOJ40,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J40 |
Not Qualified |
4194304 bit |
e0 |
.001 Amp |
100 ns |
|||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
40 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
262144 words |
5 |
18 |
IN-LINE |
1.27 mm |
256KX18 |
256K |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZIP-T40 |
5.5 V |
12.07 mm |
Not Qualified |
4718592 bit |
4.5 V |
e0 |
51.2 mm |
80 ns |
||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
85 mA |
262144 words |
NO |
COMMON |
5 |
5 |
18 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
4718592 bit |
e0 |
.001 Amp |
100 ns |
|||||||||||||||||||||||||
Toshiba |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
128 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
65536 bit |
e0 |
150 ns |
||||||||||||||||||||||||||||
Toshiba |
NIBBLE MODE DRAM |
COMMERCIAL |
20 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
60 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
ZIP20,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T20 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
100 ns |
||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G28 |
Not Qualified |
16777216 bit |
e0 |
.0002 Amp |
60 ns |
|||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
16777216 words |
5 |
1 |
SMALL OUTLINE |
16MX1 |
16M |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
Not Qualified |
16777216 bit |
4.5 V |
50 ns |
|||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
140 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
18 |
70 Cel |
2MX36 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
75497472 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
80 ns |
|||||||||||||||||||||||||||||
Toshiba |
VIDEO DRAM |
COMMERCIAL |
28 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
1.27 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
TIN LEAD |
ZIG-ZAG |
2 |
R-PZIP-T28 |
5.5 V |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
36.2 mm |
80 ns |
|||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
60 ns |
|||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
7.7 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.15 mm |
80 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.