Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
68719476736 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
2.7 |
|||||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
NO |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
3000 Write/Erase Cycles |
200 MHz |
11.5 mm |
137438953472 bit |
2.7 V |
TLC NAND TYPE |
13 mm |
3.3 |
NO |
|||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
17179869184 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
3000 Write/Erase Cycles |
11 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13.5 mm |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
1 |
.5 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3 |
3.6 V |
.8 mm |
3000 Write/Erase Cycles |
200 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
||||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
NO |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
200 MHz |
11.5 mm |
274877906944 bit |
2.7 V |
TLC NAND TYPE |
13 mm |
3.3 |
NO |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
128GX8 |
128G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
1099511627776 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
137438953472 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
105 Cel |
64GX8 |
64G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
549755813888 bit |
2.7 V |
30 |
260 |
13 mm |
2.7 |
|||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
1.95 V |
.8 mm |
200 MHz |
11.5 mm |
274877906944 bit |
1.7 V |
ALSO OPERATES @ 3V SUP NOM |
MLC NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
3000 Write/Erase Cycles |
11 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13.5 mm |
|||||||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
NO |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
200 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
NO |
||||||||||||||||||||||||||||||||
|
Sandisk |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
2GX8 |
2G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3 |
3.6 V |
1 mm |
11.5 mm |
17179869184 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
17179869184 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
15 |
.5 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
11.5 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
INDUSTRIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
17179869184 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
137438953472 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Alliance Memory |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
NO |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
200 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
NO |
||||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
85.7 mA |
4294967296 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
200 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
MLC NAND TYPE |
.00013 Amp |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
1.95 V |
.9 mm |
200 MHz |
11.5 mm |
274877906944 bit |
1.7 V |
NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||
Toshiba |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
4294967296 words |
8 |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
34359738368 bit |
2.7 V |
NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Delkin Devices |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
NO |
BOTTOM |
HARDWARE |
R-PBGA-B156 |
1 mm |
11.5 mm |
274877906944 bit |
TLC NAND TYPE |
13 mm |
3.3 |
NO |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
1 |
.5 mm |
95 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.9 mm |
11.5 mm |
549755813888 bit |
2.7 V |
NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||||||
Kioxia Holdings |
FLASH CARD |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
34359738368 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
274877906944 bit |
2.7 V |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Delkin Devices |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
34359738368 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
Embedded MMC |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
70 mA |
2147483648 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
OPEN-DRAIN |
2GX8 |
2G |
-25 Cel |
BOTTOM |
HARDWARE |
R-PBGA-B153 |
1.95 V |
.8 mm |
52 MHz |
11.5 mm |
17179869184 bit |
1.65 V |
NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||
Toshiba |
FLASH CARD |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
34359738368 words |
8 |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
274877906944 bit |
NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
2147483648 words |
3.3 |
8 |
85 Cel |
2GX8 |
2G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
17179869184 bit |
SLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
4294967296 words |
3.3 |
8 |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
34359738368 bit |
MLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
68719476736 words |
3.3 |
8 |
85 Cel |
64GX8 |
64G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
549755813888 bit |
MLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
NO |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
52 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
NO |
||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
15 |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER NICKEL GERMANIUM |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
15 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
Alliance Memory |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
NO |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
200 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
NO |
||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
INDUSTRIAL |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
4294967296 words |
3.3 |
8 |
85 Cel |
4GX8 |
4G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
34359738368 bit |
MLC NAND TYPE |
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|
Panasonic |
FLASH CARD |
INDUSTRIAL |
153 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
ASYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3 |
3.6 V |
1.4 mm |
11.5 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
2.7 |
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Kioxia Holdings |
FLASH CARD |
INDUSTRIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
34359738368 words |
8 |
GRID ARRAY |
BGA153,14X14,20 |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
11 mm |
274877906944 bit |
2.7 V |
13 mm |
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|
Kingston Technology Company |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
BOTTOM |
R-PBGA-B153 |
1 mm |
11.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
13 mm |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
INDUSTRIAL |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
2147483648 words |
3.3 |
8 |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
17179869184 bit |
SLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
17179869184 words |
3.3 |
8 |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
137438953472 bit |
MLC NAND TYPE |
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|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
3-STATE |
128GX8 |
128G |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.1 mm |
200 MHz |
11.5 mm |
1099511627776 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
2.7 |
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|
Western Digital |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
3000 Write/Erase Cycles |
11 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13.5 mm |
|||||||||||||||||||||||||||||||||||
|
Swissbit Ag |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
8589934592 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
68719476736 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
13 mm |
3.3 |
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|
Silicon Motion Technology |
FLASH CARD |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
34359738368 words |
8 |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
274877906944 bit |
MLC NAND TYPE |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
Embedded MMC |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
80 mA |
4294967296 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
OPEN-DRAIN |
4GX8 |
4G |
-25 Cel |
BOTTOM |
HARDWARE |
R-PBGA-B153 |
1.95 V |
.8 mm |
52 MHz |
11.5 mm |
34359738368 bit |
1.65 V |
NAND TYPE |
13 mm |
1.8 |
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|
Delkin Devices |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
17179869184 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
|
Delkin Devices |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
34359738368 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
3.3 |
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|
Western Digital |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
1 |
.5 mm |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
3000 Write/Erase Cycles |
200 MHz |
11.5 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
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|
Integrated Silicon Solution |
FLASH |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
55 mA |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
105 Cel |
3-STATE |
32GX8 |
32G |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B153 |
3.6 V |
1 mm |
200 MHz |
11.5 mm |
274877906944 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
TLC NAND TYPE |
.00003 Amp |
13 mm |
3.3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.