OTHER Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

K9K1216Q0C-GCB0T

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K

20 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

0 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

536870912 bit

256

.00005 Amp

55 ns

NO

K8S1315EZC-SE1D0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

K8S2815ETC-DE7D

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

TOP

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

K8C5415EBM-FE1F

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16777216 words

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

NOR TYPE

14 mm

100 ns

1.8

KFG1G16D2M-DEB60

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

2.65

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX16

64M

-30 Cel

BOTTOM

R-PBGA-B63

2.9 V

1 mm

10 mm

Not Qualified

1073741824 bit

2.4 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

13 mm

76 ns

2.7

K8S6815ETD-FE7E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

K8P5516UZB-EE4E0

Samsung

FLASH

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

55 mA

16777216 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

16MX16

16M

-25 Cel

256

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

11 mm

Not Qualified

BOTTOM/TOP

268435456 bit

2.7 V

8/16

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00004 Amp

13 mm

YES

80 ns

3

YES

K8C1115EBM-DE1FT

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

536870912 bit

NOR TYPE

.00002 Amp

YES

110 ns

YES

K8C1015ETM-DE1E0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

TOP

536870912 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

14 mm

110 ns

1.8

K8S5715ETC-SE1E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

TOP

268435456 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8A6415ETC-DE7ET

Samsung

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

TOP

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S1315EBC-DE1C0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

BOTTOM

536870912 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

K8A2815EBB-EE7B

Samsung

FLASH

OTHER

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY

85 Cel

8MX16

8M

-25 Cel

TIN LEAD

BOTTOM

R-PBGA-B

1.95 V

Not Qualified

134217728 bit

1.7 V

e0

90 ns

1.8

K8S1015EZC-SE1F0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

KFN2G16Q2M-DEB50

Samsung

FLASH

OTHER

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

40 mA

134217728 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX16

128M

-30 Cel

2K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

2

1.95 V

1.2 mm

11 mm

Not Qualified

2147483648 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

1K

e1

SLC NAND TYPE

.00005 Amp

13 mm

76 ns

1.8

NO

K9K1216Q0C-JCB0

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K

20 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

0 Cel

4K

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

536870912 bit

256

e3

.00005 Amp

55 ns

NO

K8S2815EBC-FE7B0

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

K8C1215EBM-FE1F0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-25 Cel

TIN LEAD

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e0

NOR TYPE

14 mm

110 ns

1.8

K8P3315UQB-DE4B0

Samsung

FLASH

OTHER

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

2097152 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

.8 mm

85 Cel

2MX16

2M

-25 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM/TOP

33554432 bit

8

NOR TYPE

.00003 Amp

YES

60 ns

YES

K8F1215EBM-SE1E0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

2

1.95 V

1 mm

9 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e1

NOR TYPE

11 mm

110 ns

1.8

K8A6415ETC-DE7C0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

8,127

YES

BOTTOM

R-PBGA-B88

3

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8

260

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

1.8

YES

K8C5515EBM-DE1F0

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8C1015EBM-FE1D

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

BOTTOM

536870912 bit

240

NOR TYPE

.00002 Amp

YES

110 ns

YES

K8S3215ETF-FE7E

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

TOP

33554432 bit

1.7 V

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K8F5715EBM-FE1E0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e0

NOR TYPE

.00002 Amp

11 mm

YES

100 ns

1.8

YES

K8P6415UQB-PE4B0

Samsung

FLASH

OTHER

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K,32K

55 mA

4194304 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM/TOP

67108864 bit

2.7 V

8

260

NOR TYPE

.00003 Amp

18.4 mm

YES

60 ns

2.7

YES

KFG1216Q2A-FED60

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-30 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9.5 mm

Not Qualified

536870912 bit

1.7 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

e0

12 mm

76 ns

1.8

KFG1G16Q2M-DEB60

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

40 mA

67108864 words

1.8

NO

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX16

64M

-30 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3

1.95 V

1 mm

10 mm

Not Qualified

1073741824 bit

1.7 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

1K

e1

260

SLC NAND TYPE

.00005 Amp

13 mm

76 ns

1.8

NO

K8C1015EBM-DE1E0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

14 mm

110 ns

1.8

K8S5715EBC-FE1E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8F5715ETM-FE1C

Samsung

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B88

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8C5515EBM-DE1ET

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

KFG1216U2A-DEB50

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-30 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

2

3.6 V

1 mm

9.5 mm

Not Qualified

536870912 bit

2.7 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

e1

12 mm

76 ns

2.7

K8S1015EZC-FE1E0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

Not Qualified

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

K8C1315EBM-FE1FT

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

BOTTOM

536870912 bit

240

NOR TYPE

.00002 Amp

YES

110 ns

YES

K8P2815UQC-QE4B0

Samsung

FLASH

OTHER

56

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K,32K

55 mA

8388608 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP56,.8,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

16,254

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

BOTTOM BOOT BLOCK, TOP BOOT BLOCK

8

260

NOR TYPE

.00003 Amp

18.4 mm

YES

65 ns

3

YES

K8S3215ETE-DE7B0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

2MX16

2M

-25 Cel

8,63

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B44

2

1.95 V

1 mm

5 mm

Not Qualified

TOP

33554432 bit

1.7 V

SYNCHRONOUS BURST OPERATION ALSO POSSIBLE

e1

NOR TYPE

.00005 Amp

7.5 mm

YES

90 ns

1.8

YES

KFW8G16Q2M-DEB6S

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

536870912 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX16

512M

-30 Cel

8K

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

8589934592 bit

1K

e3

SLC NAND TYPE

76 ns

NO

K8P6415UQB-EE4CT

Samsung

FLASH

OTHER

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

4194304 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

BOTTOM

S-PBGA-B64

3

Not Qualified

BOTTOM/TOP

67108864 bit

8

260

NOR TYPE

.00003 Amp

YES

65 ns

YES

KFG2816D1M-PEB00

Samsung

FLASH

OTHER

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

8388608 words

2.65

16

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

8MX16

8M

-30 Cel

DUAL

R-PDSO-G48

2.9 V

1.2 mm

12 mm

Not Qualified

134217728 bit

2.4 V

18.4 mm

76 ns

2.7

K8C5715EBM-FE1C

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8S2815EBC-FE7C

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

KFW8G16Q2M-DEB8T

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

536870912 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX16

512M

-30 Cel

8K

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

8589934592 bit

1K

e3

SLC NAND TYPE

76 ns

NO

K8S5615EZC-SE1D0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8S5715EZC-DE1D0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8S5615EBA-DE7B0

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

16MX16

16M

-25 Cel

8, 511

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00007 Amp

YES

88.5 ns

YES

K8F5615EBM-SE1C

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8F5615EBM-SE1FT

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.