Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
65536 words |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
64KX1 |
64K |
-40 Cel |
END |
O-MEDB-N2 |
6 V |
Not Qualified |
65536 bit |
2.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
15000 ns |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8192 words |
3/5 |
8 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
8KX8 |
8K |
-40 Cel |
END |
O-MEDB-N2 |
6 V |
Not Qualified |
65536 bit |
2.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1024 words |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
1KX1 |
1K |
-40 Cel |
END |
O-MEDB-N2 |
6 V |
Not Qualified |
1024 bit |
2.8 V |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
15000 ns |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1024 words |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
1KX1 |
1K |
-40 Cel |
Matte Tin (Sn) - annealed |
END |
O-MEDB-N2 |
1 |
6 V |
Not Qualified |
1024 bit |
2.8 V |
e3 |
15000 ns |
||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MEMORY CIRCUIT |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
4294967296 words |
8 |
GRID ARRAY |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
34359738368 bit |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4096 words |
3 |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
4KX1 |
4K |
-40 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
1 |
6 V |
Not Qualified |
4096 bit |
2.8 V |
e0 |
15000 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4096 words |
3 |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
4KX1 |
4K |
-40 Cel |
MATTE TIN |
END |
O-MEDB-N2 |
1 |
6 V |
Not Qualified |
4096 bit |
2.8 V |
e3 |
15000 ns |
|||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4096 words |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
4KX1 |
4K |
-40 Cel |
END |
O-MEDB-N2 |
6 V |
Not Qualified |
4096 bit |
2.8 V |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
15000 ns |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4096 words |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
70 Cel |
4KX1 |
4K |
-40 Cel |
Matte Tin (Sn) - annealed |
END |
O-MEDB-N2 |
6 V |
Not Qualified |
4096 bit |
2.8 V |
e3 |
15000 ns |
|||||||||||||||||||||||||||||||||||||||||||
Atp Electronics |
MEMORY CIRCUIT |
OTHER |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
8589934592 words |
8 |
UNCASED CHIP |
85 Cel |
8GX8 |
8G |
-25 Cel |
UPPER |
X-XUUC-N |
68719476736 bit |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Panasonic |
MEMORY CIRCUIT |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4294967296 words |
8 |
UNCASED CHIP |
85 Cel |
4GX8 |
4G |
-25 Cel |
UPPER |
R-XUUC-N |
34359738368 bit |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
137 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX32 |
64M |
-25 Cel |
BOTTOM |
R-PBGA-B137 |
1.95 V |
1.1 mm |
10.5 mm |
2147483648 bit |
1.7 V |
ALSO ORGANISED AS 128M X 16 |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
168 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
FLASH+SDRAM |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA168,23X23,20 |
Other Memory ICs |
.5 mm |
85 Cel |
256MX16 |
256M |
-25 Cel |
BOTTOM |
S-PBGA-B168 |
1.95 V |
.9 mm |
12 mm |
Not Qualified |
4294967296 bit |
1.7 V |
MOBILE LPDDR DEVICE ALSO AVAILABLE |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
25 ns |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
896 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4294967296 words |
1.2 |
4 |
GRID ARRAY |
1 mm |
105 Cel |
4GX4 |
4G |
0 Cel |
BOTTOM |
S-PBGA-B896 |
1.26 V |
4.2 mm |
31 mm |
17179869184 bit |
1.14 V |
IT ALSO OPERATES AT LOGIC OPERATING TEMPERATURE 0 TO 110 DEG CENTIGRADE |
NOT SPECIFIED |
NOT SPECIFIED |
31 mm |
|||||||||||||||||||||||||||||||||||||||||
Sk Hynix |
MEMORY CIRCUIT |
OTHER |
137 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX32 |
64M |
-30 Cel |
BOTTOM |
R-PBGA-B137 |
1.95 V |
1.2 mm |
10.5 mm |
2147483648 bit |
1.7 V |
ITS ALSO CONTAINS 4GBIT (256MBIT X16) NAND FLASH |
13 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
OTHER |
169 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA169,14X28,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
R-PBGA-B169 |
Not Qualified |
137438953472 bit |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
17179869184 bit |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
MEMORY CIRCUIT |
OTHER |
78 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
1.5 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
32MX8 |
32M |
0 Cel |
BOTTOM |
R-PBGA-B78 |
1.575 V |
1.2 mm |
10 mm |
268435456 bit |
1.425 V |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
137438953472 bit |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
274877906944 bit |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MEMORY CIRCUIT |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
8589934592 words |
8 |
GRID ARRAY |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
68719476736 bit |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Spansion |
MEMORY CIRCUIT |
OTHER |
64 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
8388608 words |
3 |
FLASH+PSRAM |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA64,10X12, 32 |
Other Memory ICs |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B64 |
1.2 mm |
8 mm |
Not Qualified |
134217728 bit |
PSRAM ORGANISED AS 32M X 1 |
40 |
260 |
11.6 mm |
70 ns |
|||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
OTHER |
162 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
134217728 words |
3.3 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
128MX32 |
128M |
-30 Cel |
BOTTOM |
R-PBGA-B162 |
3.6 V |
1 mm |
11.5 mm |
4294967296 bit |
2.7 V |
ALSO ORGANISED AS 256M X 16 |
13 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
168 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
256MX16 |
256M |
-25 Cel |
BOTTOM |
S-PBGA-B168 |
1.95 V |
.75 mm |
12 mm |
4294967296 bit |
1.7 V |
MOBILE LPDDR DEVICE ALSO AVAILABLE |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
1.8/3.3,3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
8589934592 bit |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MEMORY CIRCUIT |
OTHER |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
137438953472 words |
8 |
85 Cel |
128GX8 |
128G |
0 Cel |
DUAL |
R-XDMA-N |
1099511627776 bit |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
OTHER |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
OTHER |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
24 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
1024 words |
SEPARATE |
2 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
OPEN-DRAIN |
1KX2 |
1K |
-25 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
2048 bit |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
24 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
1024 words |
SEPARATE |
2 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
OPEN-DRAIN |
1KX2 |
1K |
-25 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
2048 bit |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
24 |
DIP |
32 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
1024 words |
COMMON |
1 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
1KX1 |
1K |
-25 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
1024 bit |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
OTHER |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
65536 words |
5 |
5 |
4 |
IN-LINE |
DIP24,.4 |
Other Memory ICs |
2.54 mm |
110 Cel |
64KX4 |
64K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
262144 bit |
150 ns |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
OTHER |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
OTHER |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
OTHER |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
DISK BUTTON |
100 Cel |
-55 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MEMORY CIRCUIT |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
DISK BUTTON |
100 Cel |
-55 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MEMORY CIRCUIT |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
64 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64X1 |
64 |
-25 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
2.13 mm |
5.285 mm |
Not Qualified |
64 bit |
2.7 V |
e0 |
5.31 mm |
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STMicroelectronics |
MEMORY CIRCUIT |
OTHER |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
64 words |
1 |
UNCASED CHIP |
85 Cel |
64X1 |
64 |
-20 Cel |
UPPER |
X-XUUC-N |
3 V |
64 bit |
1.5 V |
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|
STMicroelectronics |
MEMORY CIRCUIT |
OTHER |
137 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
1.8 |
FLASH+SDRAM |
1.8 |
GRID ARRAY, FINE PITCH |
BGA137,10X15,32 |
Other Memory ICs |
.8 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B137 |
Not Qualified |
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|
STMicroelectronics |
MEMORY CIRCUIT |
OTHER |
149 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
1.8 |
FLASH+SDRAM |
1.8 |
GRID ARRAY, FINE PITCH |
BGA149,12X16,32 |
Other Memory ICs |
.8 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B149 |
Not Qualified |
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|
STMicroelectronics |
MEMORY CIRCUIT |
OTHER |
107 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
1.8 |
FLASH+SDRAM |
1.8 |
GRID ARRAY, FINE PITCH |
BGA107,10X14,32 |
Other Memory ICs |
.8 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B107 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
OTHER |
149 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
1.8 |
FLASH+SDRAM |
1.8 |
GRID ARRAY, FINE PITCH |
BGA149,12X16,32 |
Other Memory ICs |
.8 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B149 |
Not Qualified |
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|
STMicroelectronics |
MEMORY CIRCUIT |
OTHER |
48 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
100 mA |
1048576 words |
FLASH+SRAM |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA48,6X8,40 |
Other Memory ICs |
1 mm |
85 Cel |
1MX8 |
1M |
-20 Cel |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.35 mm |
9.8 mm |
Not Qualified |
8388608 bit |
2.7 V |
ALSO CONTAINS 128K X 8 SRAM |
e1 |
.00002 Amp |
11.8 mm |
120 ns |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.