OTHER Other Function Memory ICs 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

DS1996L-F5

Maxim Integrated

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

65536 words

3/5

1

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

64KX1

64K

-40 Cel

END

O-MEDB-N2

6 V

Not Qualified

65536 bit

2.8 V

NOT SPECIFIED

NOT SPECIFIED

15000 ns

DS1996L-F5+

Analog Devices

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

8192 words

3/5

8

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

8KX8

8K

-40 Cel

END

O-MEDB-N2

6 V

Not Qualified

65536 bit

2.8 V

NOT SPECIFIED

NOT SPECIFIED

DS1992L-F5

Maxim Integrated

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1024 words

3/5

1

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

1KX1

1K

-40 Cel

END

O-MEDB-N2

6 V

Not Qualified

1024 bit

2.8 V

e0

NOT SPECIFIED

NOT SPECIFIED

15000 ns

DS1992L-F5+

Analog Devices

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1024 words

3/5

1

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

1KX1

1K

-40 Cel

Matte Tin (Sn) - annealed

END

O-MEDB-N2

1

6 V

Not Qualified

1024 bit

2.8 V

e3

15000 ns

THGBMDG5D1LBAIT

Toshiba

MEMORY CIRCUIT

OTHER

153

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

4294967296 words

8

GRID ARRAY

85 Cel

4GX8

4G

-25 Cel

BOTTOM

R-PBGA-B153

34359738368 bit

DS1994L-F5

Maxim Integrated

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

4096 words

3

3/5

1

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

4KX1

4K

-40 Cel

TIN LEAD

END

O-MEDB-N2

1

6 V

Not Qualified

4096 bit

2.8 V

e0

15000 ns

DS1994L-F5+

Maxim Integrated

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

4096 words

3

3/5

1

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

4KX1

4K

-40 Cel

MATTE TIN

END

O-MEDB-N2

1

6 V

Not Qualified

4096 bit

2.8 V

e3

15000 ns

DS1993L-F5

Maxim Integrated

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

4096 words

3/5

1

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

4KX1

4K

-40 Cel

END

O-MEDB-N2

6 V

Not Qualified

4096 bit

2.8 V

e0

NOT SPECIFIED

NOT SPECIFIED

15000 ns

DS1993L-F5+

Analog Devices

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

4096 words

3/5

1

DISK BUTTON

BUTTON,.68IN

SRAMs

70 Cel

4KX1

4K

-40 Cel

Matte Tin (Sn) - annealed

END

O-MEDB-N2

6 V

Not Qualified

4096 bit

2.8 V

e3

15000 ns

AF8GUD3-OEM

Atp Electronics

MEMORY CIRCUIT

OTHER

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

NO LEAD

8589934592 words

8

UNCASED CHIP

85 Cel

8GX8

8G

-25 Cel

UPPER

X-XUUC-N

68719476736 bit

RP-SMLE04DA1

Panasonic

MEMORY CIRCUIT

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

4294967296 words

8

UNCASED CHIP

85 Cel

4GX8

4G

-25 Cel

UPPER

R-XUUC-N

34359738368 bit

NOT SPECIFIED

NOT SPECIFIED

MT29C8G96MAZBADKD-5WT

Micron Technology

MEMORY CIRCUIT

OTHER

137

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

1.8

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX32

64M

-25 Cel

BOTTOM

R-PBGA-B137

1.95 V

1.1 mm

10.5 mm

2147483648 bit

1.7 V

ALSO ORGANISED AS 128M X 16

NOT SPECIFIED

NOT SPECIFIED

13 mm

MT29C4G96MAZBACJG-5WT

Micron Technology

MEMORY CIRCUIT

OTHER

168

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

1.8

FLASH+SDRAM

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA168,23X23,20

Other Memory ICs

.5 mm

85 Cel

256MX16

256M

-25 Cel

BOTTOM

S-PBGA-B168

1.95 V

.9 mm

12 mm

Not Qualified

4294967296 bit

1.7 V

MOBILE LPDDR DEVICE ALSO AVAILABLE

NOT SPECIFIED

NOT SPECIFIED

12 mm

25 ns

MT43A4G40200NFA-S15:A

Micron Technology

MEMORY CIRCUIT

OTHER

896

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

4294967296 words

1.2

4

GRID ARRAY

1 mm

105 Cel

4GX4

4G

0 Cel

BOTTOM

S-PBGA-B896

1.26 V

4.2 mm

31 mm

17179869184 bit

1.14 V

IT ALSO OPERATES AT LOGIC OPERATING TEMPERATURE 0 TO 110 DEG CENTIGRADE

NOT SPECIFIED

NOT SPECIFIED

31 mm

H8BCS0UN0MCR-4EM

Sk Hynix

MEMORY CIRCUIT

OTHER

137

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

1.8

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX32

64M

-30 Cel

BOTTOM

R-PBGA-B137

1.95 V

1.2 mm

10.5 mm

2147483648 bit

1.7 V

ITS ALSO CONTAINS 4GBIT (256MBIT X16) NAND FLASH

13 mm

MTFC16GLTDV-WT

Micron Technology

OTHER

169

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8/3.3,3/3.3

GRID ARRAY, FINE PITCH

BGA169,14X28,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B169

Not Qualified

137438953472 bit

MTFC2GMTEA-WT

Micron Technology

OTHER

153

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8/3.3,3/3.3

GRID ARRAY, FINE PITCH

BGA153,14X14,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B153

Not Qualified

17179869184 bit

EMD3D256M08G1-150CBS1R

Everspin Technologies

MEMORY CIRCUIT

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

1.5

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX8

32M

0 Cel

BOTTOM

R-PBGA-B78

1.575 V

1.2 mm

10 mm

268435456 bit

1.425 V

NOT SPECIFIED

NOT SPECIFIED

13 mm

MTFC16GLTAM-WT

Micron Technology

OTHER

153

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8/3.3,3/3.3

GRID ARRAY, FINE PITCH

BGA153,14X14,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B153

Not Qualified

137438953472 bit

MTFC32GLTDM-WT

Micron Technology

OTHER

153

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8/3.3,3/3.3

GRID ARRAY, FINE PITCH

BGA153,14X14,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B153

Not Qualified

274877906944 bit

THGBMHG6C1LBAIL

Toshiba

MEMORY CIRCUIT

OTHER

153

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

8589934592 words

8

GRID ARRAY

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B153

68719476736 bit

S71PL127NB0HHW4U0

Spansion

MEMORY CIRCUIT

OTHER

64

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

3

FLASH+PSRAM

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA64,10X12, 32

Other Memory ICs

.8 mm

85 Cel

8MX16

8M

-25 Cel

BOTTOM

R-PBGA-B64

1.2 mm

8 mm

Not Qualified

134217728 bit

PSRAM ORGANISED AS 32M X 1

40

260

11.6 mm

70 ns

MT29PZZZ8D5BKFTF-18W.95L

Micron Technology

MEMORY CIRCUIT

OTHER

162

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

128MX32

128M

-30 Cel

BOTTOM

R-PBGA-B162

3.6 V

1 mm

11.5 mm

4294967296 bit

2.7 V

ALSO ORGANISED AS 256M X 16

13 mm

MT29C4G48MAZBAAKQ-5WT

Micron Technology

MEMORY CIRCUIT

OTHER

168

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

256MX16

256M

-25 Cel

BOTTOM

S-PBGA-B168

1.95 V

.75 mm

12 mm

4294967296 bit

1.7 V

MOBILE LPDDR DEVICE ALSO AVAILABLE

NOT SPECIFIED

NOT SPECIFIED

12 mm

NAND08GAH0FZC5E

Micron Technology

OTHER

153

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

1.8/3.3,3.3

GRID ARRAY, FINE PITCH

BGA153,14X14,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B153

Not Qualified

8589934592 bit

NMB1XXD128GPSU4

Intel

MEMORY CIRCUIT

OTHER

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

137438953472 words

8

85 Cel

128GX8

128G

0 Cel

DUAL

R-XDMA-N

1099511627776 bit

TMS2400JC

Texas Instruments

OTHER

28

DIP

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

IN-LINE

DIP28,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-XDIP-T28

Not Qualified

TMS2501NC

Texas Instruments

MEMORY CIRCUIT

OTHER

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

IN-LINE

DIP24,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-PDIP-T24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TMS2501JC

Texas Instruments

MEMORY CIRCUIT

OTHER

24

DIP

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

IN-LINE

DIP24,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-XDIP-T24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TMS2400NC

Texas Instruments

OTHER

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

IN-LINE

DIP28,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-PDIP-T28

Not Qualified

TMS4025NC

Texas Instruments

OTHER

24

DIP

1024

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

1024 words

SEPARATE

2

IN-LINE

DIP24,.6

Other Memory ICs

2.54 mm

70 Cel

OPEN-DRAIN

1KX2

1K

-25 Cel

DUAL

R-PDIP-T24

Not Qualified

2048 bit

TMS4020NC

Texas Instruments

OTHER

24

DIP

1024

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

1024 words

SEPARATE

2

IN-LINE

DIP24,.6

Other Memory ICs

2.54 mm

70 Cel

OPEN-DRAIN

1KX2

1K

-25 Cel

DUAL

R-PDIP-T24

Not Qualified

2048 bit

TMS4023NC

Texas Instruments

OTHER

24

DIP

32

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

1024 words

COMMON

1

IN-LINE

DIP24,.6

Other Memory ICs

2.54 mm

70 Cel

3-STATE

1KX1

1K

-25 Cel

DUAL

R-PDIP-T24

Not Qualified

1024 bit

SM4461-15JDS

Texas Instruments

VIDEO DRAM

OTHER

24

DIP

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

65536 words

5

5

4

IN-LINE

DIP24,.4

Other Memory ICs

2.54 mm

110 Cel

64KX4

64K

-55 Cel

DUAL

R-XDIP-T24

Not Qualified

262144 bit

150 ns

TMS4103NC

Texas Instruments

MEMORY CIRCUIT

OTHER

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

IN-LINE

DIP28,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-PDIP-T28

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TMS4100JC

Texas Instruments

OTHER

28

DIP

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

IN-LINE

DIP28,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-XDIP-T28

Not Qualified

5962-01-218-1995

Texas Instruments

MEMORY CIRCUIT

OTHER

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

IN-LINE

DIP24,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-PDIP-T24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TMS4103JC

Texas Instruments

MEMORY CIRCUIT

OTHER

28

DIP

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

IN-LINE

DIP28,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-XDIP-T28

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TMS4100NC

Texas Instruments

OTHER

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

IN-LINE

DIP28,.6

Other Memory ICs

2.54 mm

85 Cel

-25 Cel

DUAL

R-PDIP-T28

Not Qualified

DC1920-F3

Analog Devices

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

DISK BUTTON

100 Cel

-55 Cel

TIN LEAD

END

O-MEDB-N2

Not Qualified

e0

DC1920-F5

Analog Devices

MEMORY CIRCUIT

OTHER

2

ROUND

METAL

YES

1

CMOS

NO LEAD

DISK BUTTON

100 Cel

-55 Cel

TIN LEAD

END

O-MEDB-N2

Not Qualified

e0

DS1652SB

Analog Devices

MEMORY CIRCUIT

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

ASYNCHRONOUS

64 words

5

1

SMALL OUTLINE

1.27 mm

85 Cel

64X1

64

-25 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

5.5 V

2.13 mm

5.285 mm

Not Qualified

64 bit

2.7 V

e0

5.31 mm

LRI64-SBN18/3GE

STMicroelectronics

MEMORY CIRCUIT

OTHER

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

64 words

1

UNCASED CHIP

85 Cel

64X1

64

-20 Cel

UPPER

X-XUUC-N

3 V

64 bit

1.5 V

NAND256R4M2CZC5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NAND01GR3M3BZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

NAND256R3M0AZC5F

STMicroelectronics

MEMORY CIRCUIT

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA107,10X14,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B107

Not Qualified

NAND01GR4M3CZC5E

STMicroelectronics

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

M36W108AB120ZM5

STMicroelectronics

MEMORY CIRCUIT

OTHER

48

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

100 mA

1048576 words

FLASH+SRAM

3/3.3

8

GRID ARRAY, LOW PROFILE

BGA48,6X8,40

Other Memory ICs

1 mm

85 Cel

1MX8

1M

-20 Cel

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B48

3.6 V

1.35 mm

9.8 mm

Not Qualified

8388608 bit

2.7 V

ALSO CONTAINS 128K X 8 SRAM

e1

.00002 Amp

11.8 mm

120 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.