Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Defense Logistics Agency |
SRAM MODULE |
MILITARY |
QFP |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
32 |
FLATPACK |
1.27 mm |
125 Cel |
512KX32 |
512K |
-55 Cel |
TIN LEAD |
QUAD |
5.5 V |
5.08 mm |
22.352 mm |
Qualified |
16777216 bit |
4.5 V |
e0 |
22.352 mm |
17 ns |
|||||||||||||||||||||||||||
Cypress Semiconductor |
SRAM MODULE |
COMMERCIAL |
48 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1800 mA |
1048576 words |
COMMON |
5 |
5 |
4 |
MICROELECTRONIC ASSEMBLY |
DIP48,.9 |
8 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-XDMA-T48 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
CONFIGURABLE AS 256K X 16 |
e0 |
NO |
.32 Amp |
35 ns |
|||||||||||||||
Cypress Semiconductor |
SRAM MODULE |
COMMERCIAL |
72 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
1048576 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
ZIP72/76,.1,.1 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
4.5 V |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZMA-T72 |
5.5 V |
Not Qualified |
33554432 bit |
4.5 V |
CONFIGURABLE AS 1M X 32 |
e0 |
YES |
.08 Amp |
20 ns |
||||||||||||||||
Analog Devices |
SRAM MODULE |
COMMERCIAL |
80 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
524288 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
SSIM80 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
2 V |
0 Cel |
TIN LEAD |
SINGLE |
R-XSMA-N80 |
5.5 V |
18.7706 mm |
Not Qualified |
8388608 bit |
4.5 V |
BATTERY BACKUP OPERATION |
e0 |
.000008 Amp |
85 ns |
|||||||||||||||||
NXP Semiconductors |
SRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BICMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512KX36 |
512K |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
18874368 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
10 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
SRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BICMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
MICROELECTRONIC ASSEMBLY |
.8 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
ZIG-ZAG |
R-XZMA-N144 |
3.6 V |
25.55 mm |
3.8 mm |
9437184 bit |
3.135 V |
WD-MAX |
67.6 mm |
10 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
SRAM MODULE |
168 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
3580 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
SRAMs |
1.27 mm |
3-STATE |
1MX72 |
1M |
3.14 V |
DUAL |
R-PDMA-N168 |
100 MHz |
Not Qualified |
75497472 bit |
8 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
SRAM MODULE |
168 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
3580 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
SRAMs |
1.27 mm |
3-STATE |
1MX72 |
1M |
3.14 V |
DUAL |
R-PDMA-N168 |
90 MHz |
Not Qualified |
75497472 bit |
9 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
SRAM MODULE |
COMMERCIAL |
64 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
720 mA |
65536 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
ZIP64/68,.1,.1 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX32 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T64 |
Not Qualified |
2097152 bit |
e0 |
.032 Amp |
35 ns |
||||||||||||||||||||||
Infineon Technologies |
SRAM MODULE |
COMMERCIAL |
64 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
720 mA |
65536 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
ZIP64/68,.1,.1 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX32 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T64 |
Not Qualified |
2097152 bit |
e0 |
.032 Amp |
25 ns |
||||||||||||||||||||||
Infineon Technologies |
SRAM MODULE |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
325 mA |
65536 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
262144 bit |
e0 |
.2 Amp |
20 ns |
|||||||||||||||||||||||
Infineon Technologies |
SRAM MODULE |
COMMERCIAL |
64 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
720 mA |
65536 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
ZIP64/68,.1,.1 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX32 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T64 |
Not Qualified |
2097152 bit |
e0 |
.032 Amp |
45 ns |
||||||||||||||||||||||
Maxim Integrated |
SRAM MODULE |
COMMERCIAL |
80 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
60 mA |
524288 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
SSIM80 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
R-XSMA-N80 |
5.5 V |
18.1356 mm |
Not Qualified |
8388608 bit |
4.5 V |
e0 |
.06 Amp |
100 ns |
||||||||||||||||||
Maxim Integrated |
SRAM MODULE |
COMMERCIAL |
80 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
60 mA |
524288 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
SSIM80 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
R-XSMA-N80 |
5.5 V |
18.1356 mm |
Not Qualified |
8388608 bit |
4.5 V |
e0 |
.06 Amp |
120 ns |
||||||||||||||||||
Maxim Integrated |
SRAM MODULE |
COMMERCIAL |
80 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
524288 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
SSIM80 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
2 V |
0 Cel |
TIN LEAD |
SINGLE |
R-XSMA-N80 |
5.5 V |
18.7706 mm |
Not Qualified |
8388608 bit |
4.5 V |
e0 |
.000008 Amp |
85 ns |
||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
MILITARY |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1600 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256KX32 |
256K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
20 ns |
||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
72 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
800 mA |
32768 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX36 |
32K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
R-PSMA-N72 |
Not Qualified |
1179648 bit |
e0 |
.8 Amp |
40 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
.08 Amp |
55 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
PARALLEL |
ASYNCHRONOUS |
200 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
1048576 bit |
e0 |
.06 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
262144 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM64 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
R-PSMA-N64 |
16.002 mm |
Not Qualified |
8388608 bit |
e0 |
.08 Amp |
45 ns |
|||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
PARALLEL |
ASYNCHRONOUS |
200 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
1048576 bit |
e0 |
.06 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
360 mA |
16384 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-CDMA-T40 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.06 Amp |
85 ns |
|||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
320 mA |
8192 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
8KX16 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T40 |
Not Qualified |
131072 bit |
e0 |
.03 Amp |
40 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
360 mA |
16384 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-CDMA-T40 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.06 Amp |
70 ns |
|||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1600 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
17 ns |
|||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
320 mA |
8192 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
8KX16 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T40 |
Not Qualified |
131072 bit |
e0 |
.03 Amp |
85 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
380 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.06 Amp |
85 ns |
|||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
380 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.06 Amp |
60 ns |
|||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
320 mA |
8192 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
8KX16 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T40 |
Not Qualified |
131072 bit |
e0 |
.03 Amp |
70 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
360 mA |
16384 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T40 |
Not Qualified |
262144 bit |
e0 |
.06 Amp |
70 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512KX8 |
512K |
0 Cel |
DUAL |
R-XDMA-T32 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
100 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
PARALLEL |
ASYNCHRONOUS |
200 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
1048576 bit |
e0 |
.06 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
115 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
65536 bit |
e0 |
.000125 Amp |
100 ns |
|||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
.08 Amp |
25 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
SIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
262144 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM64 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
SINGLE |
R-PSMA-N64 |
16.002 mm |
Not Qualified |
8388608 bit |
e0 |
.08 Amp |
30 ns |
|||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1600 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
20 ns |
|||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
360 mA |
16384 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-CDMA-T40 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.06 Amp |
40 ns |
|||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
160 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
780 mA |
262144 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM160 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX72 |
256K |
3.14 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDMA-N160 |
66 MHz |
Not Qualified |
18874368 bit |
e0 |
.1 Amp |
|||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
380 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.06 Amp |
70 ns |
|||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
32 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512KX8 |
512K |
0 Cel |
DUAL |
R-XDMA-T32 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
85 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
.08 Amp |
35 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
360 mA |
16384 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T40 |
Not Qualified |
262144 bit |
e0 |
.06 Amp |
85 ns |
||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
98 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
65536 bit |
e0 |
.0004 Amp |
150 ns |
|||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
MILITARY |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1600 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256KX32 |
256K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
17 ns |
||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
60 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
2.54 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
ZIG-ZAG |
R-XZMA-T60 |
5.5 V |
13.34 mm |
Not Qualified |
2097152 bit |
4.5 V |
87.63 mm |
35 ns |
||||||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1600 mA |
262144 words |
COMMON |
5 |
5 |
32 |
IN-LINE |
DIP64,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T64 |
Not Qualified |
8388608 bit |
e0 |
15 ns |
|||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
e0 |
55 ns |
|||||||||||||||||||||||||
Renesas Electronics |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
330 mA |
16384 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP40,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T40 |
Not Qualified |
262144 bit |
e0 |
.06 Amp |
50 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.