Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
8 |
GRID ARRAY |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
3.6 V |
8.72 mm |
27 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
27 mm |
100 ns |
||||||||||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
GRID ARRAY |
BGA256,20X20,50 |
SRAMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
5.25 V |
8.72 mm |
27 mm |
Not Qualified |
262144 bit |
4.75 V |
e1 |
.005 Amp |
27 mm |
100 ns |
||||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
8 |
GRID ARRAY |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
3.6 V |
8.72 mm |
27 mm |
Not Qualified |
1048576 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
100 ns |
|||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
GRID ARRAY |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
5.5 V |
8.72 mm |
27 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
27 mm |
70 ns |
||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
GRID ARRAY |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
5.25 V |
8.72 mm |
27 mm |
Not Qualified |
262144 bit |
4.75 V |
e0 |
27 mm |
70 ns |
||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
GRID ARRAY |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
3.6 V |
8.72 mm |
27 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
27 mm |
100 ns |
||||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
8 |
GRID ARRAY |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
3.6 V |
8.72 mm |
27 mm |
Not Qualified |
8388608 bit |
3 V |
e0 |
27 mm |
100 ns |
||||||||||||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B153 |
2.625 V |
2.26 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
22 mm |
.4 ns |
||||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
850 mA |
524288 words |
COMMON |
1.5,1.8 |
36 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.71 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B153 |
Not Qualified |
18874368 bit |
e0 |
.02 Amp |
2.3 ns |
|||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
209 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
COMMON |
1.8 |
1.8 |
36 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B209 |
1.95 V |
2.65 mm |
333 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.7 V |
e0 |
22 mm |
1.6 ns |
|||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
209 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-CBGA-B209 |
1.95 V |
2.65 mm |
333 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.7 V |
e0 |
22 mm |
1.6 ns |
|||||||||||||||||
Toshiba |
DDR SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B153 |
1.89 V |
2.75 mm |
14 mm |
Not Qualified |
18874368 bit |
1.71 V |
e0 |
22 mm |
.2 ns |
||||||||||||||||||||||||
Toshiba |
DDR SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
1.8 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B153 |
1.89 V |
2.75 mm |
14 mm |
Not Qualified |
18874368 bit |
1.71 V |
e0 |
22 mm |
.3 ns |
||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
850 mA |
524288 words |
COMMON |
1.5,1.8 |
36 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.71 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B153 |
Not Qualified |
18874368 bit |
e0 |
.02 Amp |
2.5 ns |
|||||||||||||||||||||||
Toshiba |
DDR SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
1.8 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B153 |
1.89 V |
2.75 mm |
14 mm |
Not Qualified |
18874368 bit |
1.71 V |
e0 |
22 mm |
.2 ns |
||||||||||||||||||||||||
Toshiba |
DDR SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B153 |
1.89 V |
2.75 mm |
14 mm |
Not Qualified |
18874368 bit |
1.71 V |
e0 |
22 mm |
.3 ns |
||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
209 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
COMMON |
1.8 |
1.8 |
72 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
256KX72 |
256K |
1.7 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-CBGA-B209 |
1.95 V |
2.65 mm |
250 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.7 V |
e0 |
22 mm |
2.1 ns |
|||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
850 mA |
524288 words |
COMMON |
1.5,1.8 |
36 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.71 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B153 |
Not Qualified |
18874368 bit |
e0 |
.02 Amp |
2 ns |
|||||||||||||||||||||||
Toshiba |
DDR SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
1.8 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B153 |
1.89 V |
2.75 mm |
14 mm |
Not Qualified |
18874368 bit |
1.71 V |
e0 |
22 mm |
.2 ns |
||||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
760 mA |
1048576 words |
COMMON |
1.5,1.8 |
18 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.71 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B153 |
Not Qualified |
18874368 bit |
e0 |
.02 Amp |
2 ns |
|||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
209 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
COMMON |
1.8 |
1.8 |
72 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
256KX72 |
256K |
1.7 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-CBGA-B209 |
1.95 V |
2.65 mm |
333 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.7 V |
e0 |
22 mm |
1.6 ns |
|||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
760 mA |
1048576 words |
COMMON |
1.5,1.8 |
18 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.71 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B153 |
Not Qualified |
18874368 bit |
e0 |
.02 Amp |
2.3 ns |
|||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
209 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-CBGA-B209 |
1.95 V |
2.65 mm |
250 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.7 V |
e0 |
22 mm |
2.1 ns |
|||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
760 mA |
1048576 words |
COMMON |
1.5,1.8 |
18 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.71 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B153 |
Not Qualified |
18874368 bit |
e0 |
.02 Amp |
2.5 ns |
|||||||||||||||||||||||
Toshiba |
STANDARD SRAM |
COMMERCIAL |
209 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
COMMON |
1.8 |
1.8 |
36 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B209 |
1.95 V |
2.65 mm |
250 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.7 V |
e0 |
22 mm |
2.1 ns |
|||||||||||||||||
Toshiba |
DDR SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-B153 |
1.89 V |
2.75 mm |
14 mm |
Not Qualified |
18874368 bit |
1.71 V |
e0 |
22 mm |
.2 ns |
||||||||||||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B153 |
2.625 V |
2.26 mm |
14 mm |
Not Qualified |
9437184 bit |
2.375 V |
22 mm |
.4 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
1.5/1.8,1.8 |
8 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
3-STATE |
2MX8 |
2M |
1.7 V |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
300 MHz |
Not Qualified |
16777216 bit |
e0 |
.45 ns |
||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
GRID ARRAY |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B256 |
3.45 V |
9437184 bit |
3.15 V |
PIPELINED OR FLOW THROUGH ARCHITECTURE |
4.2 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
48 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
60 mA |
4194304 words |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY |
BGA48,6X8,30 |
8 |
SRAMs |
.75 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
2.7 V |
0 Cel |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
Not Qualified |
67108864 bit |
2.7 V |
.000024 Amp |
55 ns |
||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
550 mA |
2097152 words |
SEPARATE |
1.5/1.8,1.8 |
18 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
BOTTOM |
R-PBGA-B165 |
167 MHz |
Not Qualified |
37748736 bit |
.33 Amp |
.5 ns |
||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
72 |
GRID ARRAY |
70 Cel |
256KX72 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
2.6 V |
18874368 bit |
2.4 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE |
e1 |
15 ns |
||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
208 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
2.5 |
18 |
GRID ARRAY |
70 Cel |
512KX18 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B208 |
3 |
2.6 V |
Not Qualified |
9437184 bit |
2.4 V |
e1 |
12 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1220 mA |
1048576 words |
SEPARATE |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
500 MHz |
Not Qualified |
37748736 bit |
.87 Amp |
.45 ns |
||||||||||||||||||||||||
Renesas Electronics |
DUAL-PORT SRAM |
COMMERCIAL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
310 mA |
32768 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA208,17X17,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
32KX18 |
32K |
3.15 V |
0 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B208 |
3 |
3.45 V |
83 MHz |
Not Qualified |
589824 bit |
3.15 V |
PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE |
e0 |
20 |
225 |
.015 Amp |
6 ns |
|||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
GRID ARRAY |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B256 |
3.45 V |
9437184 bit |
3.15 V |
PIPELINED OR FLOW THROUGH ARCHITECTURE |
3.6 ns |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
APPLICATION SPECIFIC SRAM |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
740 mA |
524288 words |
COMMON |
2.5,2.5/3.3 |
36 |
GRID ARRAY |
BGA256,16X16,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
2.4 V |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
133 MHz |
Not Qualified |
18874368 bit |
e1 |
30 |
260 |
.02 Amp |
15 ns |
|||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
900 mA |
524288 words |
COMMON |
2.5 |
2.5,2.5/3.3 |
36 |
GRID ARRAY |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.4 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
2.6 V |
133 MHz |
Not Qualified |
18874368 bit |
2.4 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.025 Amp |
15 ns |
||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
445 mA |
262144 words |
COMMON |
2.5 |
2.5,2.5/3.3 |
18 |
GRID ARRAY |
BGA208,17X17,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX18 |
256K |
2.4 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B208 |
3 |
2.6 V |
Not Qualified |
4718592 bit |
2.4 V |
e1 |
30 |
260 |
.02 Amp |
10 ns |
||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1130 mA |
2097152 words |
SEPARATE |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3 |
450 MHz |
Not Qualified |
75497472 bit |
.81 Amp |
.45 ns |
|||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
310 mA |
32768 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA256,16X16,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
32KX18 |
32K |
3.15 V |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
3.45 V |
1.7 mm |
83 MHz |
17 mm |
Not Qualified |
589824 bit |
3.15 V |
PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE |
e1 |
30 |
260 |
.015 Amp |
17 mm |
6 ns |
|||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
48 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
60 mA |
4194304 words |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY |
BGA48,6X8,30 |
8 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
2.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
Not Qualified |
67108864 bit |
2.7 V |
.000024 Amp |
70 ns |
|||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
760 mA |
2097152 words |
COMMON |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3 |
300 MHz |
Not Qualified |
75497472 bit |
.45 ns |
||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
680 mA |
2097152 words |
COMMON |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3 |
250 MHz |
Not Qualified |
75497472 bit |
.45 ns |
|||||||||||||||||||||||
Renesas Electronics |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
2.625 V |
2.35 mm |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
e1 |
22 mm |
3 ns |
|||||||||||||||||||||||
Renesas Electronics |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
100 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
60 mA |
8192 words |
COMMON |
1.8 |
1.8/3 |
16 |
GRID ARRAY |
BGA100,10X10,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
8KX16 |
8K |
-40 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B100 |
1.9 V |
Not Qualified |
131072 bit |
1.7 V |
IT ALSO OPERATES AT SUPPLY VOLTAGE 2.5 V AND 3 V NOMINAL |
e0 |
.006 Amp |
90 ns |
||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B256 |
3.45 V |
4718592 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
4.2 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
2.5 |
72 |
GRID ARRAY |
85 Cel |
256KX72 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
2.6 V |
18874368 bit |
2.4 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE |
e1 |
15 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.