Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
22 mm |
3.8 ns |
|||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
22 mm |
5.5 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
22 mm |
7 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW-THROUGH OR PIPELINED ARCHTECTURE |
22 mm |
15 ns |
|||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
375 mA |
131072 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
.045 Amp |
22 mm |
4 ns |
|||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
22 mm |
8.5 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
22 mm |
4 ns |
|||||||||||||||||||||||
NXP Semiconductors |
STANDARD SRAM |
COMMERCIAL |
86 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
230 mA |
524288 words |
SEPARATE |
5 |
5 |
9 |
GRID ARRAY |
BGA86,9X10 |
SRAMs |
1.524 mm |
70 Cel |
3-STATE |
512KX9 |
512K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B86 |
5.25 V |
2.44 mm |
100 MHz |
16.26 mm |
Not Qualified |
4718592 bit |
4.75 V |
e0 |
17.78 mm |
5 ns |
|||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
2.5 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.77 mm |
14 mm |
4718592 bit |
2.375 V |
22 mm |
2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
22 mm |
7.5 ns |
||||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
790 mA |
131072 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
128KX72 |
128K |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
200 MHz |
23 mm |
Not Qualified |
9437184 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.2 Amp |
23 mm |
9 ns |
|||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
180 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
-40 Cel |
BOTTOM |
R-PBGA-B119 |
166 MHz |
Not Qualified |
9437184 bit |
.03 Amp |
3.5 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
1.8 |
32 |
GRID ARRAY |
1.27 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B119 |
2.2 V |
2.02 mm |
14 mm |
16777216 bit |
1.65 V |
IT ALSO OPERATES AT 3V NOMINAL SUPPLY |
22 mm |
10 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
1.5 |
72 |
GRID ARRAY |
1 mm |
70 Cel |
256KX72 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
18874368 bit |
1.42 V |
e1 |
23 mm |
4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
1.5 |
72 |
GRID ARRAY |
1 mm |
70 Cel |
256KX72 |
256K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
18874368 bit |
1.42 V |
e1 |
23 mm |
3.3 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1160 mA |
2097152 words |
COMMON |
1.5 |
1.5/1.8 |
18 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.59 Amp |
27 mm |
13 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
580 mA |
262144 words |
COMMON |
3.3 |
3.3 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
256KX72 |
256K |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
3.465 V |
1.9 mm |
133 MHz |
23 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE OR FLOW-THROUGH ARCHITECTURE |
e1 |
20 |
260 |
.075 Amp |
23 mm |
5 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.5 |
36 |
GRID ARRAY |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
37748736 bit |
1.42 V |
e1 |
23 mm |
4 ns |
||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
270 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B119 |
100 MHz |
Not Qualified |
9437184 bit |
e0 |
.01 Amp |
9 ns |
||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
275 mA |
1048576 words |
COMMON |
2.5 |
2.5 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
167 MHz |
Not Qualified |
18874368 bit |
e1 |
20 |
260 |
.07 Amp |
3.4 ns |
|||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
262144 words |
COMMON |
3.3 |
3.3 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
256KX72 |
256K |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
3.465 V |
1.9 mm |
100 MHz |
23 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE OR FLOW-THROUGH ARCHITECTURE |
e1 |
20 |
260 |
.075 Amp |
23 mm |
5.2 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
1.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
256KX72 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
18874368 bit |
1.42 V |
e1 |
23 mm |
3.3 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1430 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX72 |
512K |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.59 Amp |
27 mm |
13 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
262144 words |
COMMON |
3.3 |
3.3 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
256KX72 |
256K |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
3.465 V |
1.9 mm |
100 MHz |
23 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE OR FLOW-THROUGH ARCHITECTURE |
e1 |
20 |
260 |
.075 Amp |
23 mm |
5.2 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
700 mA |
131072 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
128KX72 |
128K |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
167 MHz |
23 mm |
Not Qualified |
9437184 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
.2 Amp |
23 mm |
11 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
1.8 |
32 |
GRID ARRAY |
1.27 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B119 |
2.2 V |
2.02 mm |
14 mm |
16777216 bit |
1.65 V |
IT ALSO OPERATES AT 3V NOMINAL SUPPLY |
22 mm |
15 ns |
|||||||||||||||||||||||||
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
175 mA |
1048576 words |
COMMON |
2.5 |
2.5 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
2.38 V |
-40 Cel |
BOTTOM |
R-PBGA-B119 |
100 MHz |
Not Qualified |
18874368 bit |
.11 Amp |
8.5 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.5 |
36 |
GRID ARRAY |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
37748736 bit |
1.42 V |
e1 |
23 mm |
4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
980 mA |
262144 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
256KX72 |
256K |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
200 MHz |
23 mm |
Not Qualified |
18874368 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.3 Amp |
23 mm |
9 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1280 mA |
2097152 words |
COMMON |
1.5 |
1.5/1.8 |
18 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX18 |
2M |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.7 Amp |
27 mm |
13 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1220 mA |
1048576 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.4 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.59 Amp |
27 mm |
13 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
1.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
128KX72 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
9437184 bit |
1.42 V |
e1 |
40 |
260 |
23 mm |
3.3 ns |
||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
1.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
256KX72 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
18874368 bit |
1.42 V |
e1 |
40 |
260 |
23 mm |
4 ns |
||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
1.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
128KX72 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
9437184 bit |
1.42 V |
e1 |
23 mm |
4 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1730 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX72 |
512K |
1.4 V |
-40 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
167 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e0 |
.7 Amp |
27 mm |
4 ns |
||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1550 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX72 |
512K |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.7 Amp |
27 mm |
13 ns |
|||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.5 |
36 |
GRID ARRAY |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
37748736 bit |
1.42 V |
e1 |
23 mm |
3.3 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1330 mA |
1048576 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.7 Amp |
27 mm |
13 ns |
|||||||||
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
180 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3 |
3.6 V |
2.4 mm |
166 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.04 Amp |
22 mm |
3.5 ns |
|||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1100 mA |
65536 words |
COMMON |
1.8 |
1.8 |
20 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX20 |
64K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
133 MHz |
Not Qualified |
1310720 bit |
.01 Amp |
4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
36 |
GRID ARRAY |
85 Cel |
4MX36 |
4M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
1.9 V |
Not Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
32 |
GRID ARRAY |
1.27 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
3.6 V |
2.4 mm |
14 mm |
16777216 bit |
2.2 V |
e1 |
260 |
22 mm |
10 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1100 mA |
32768 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
32KX40 |
32K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
133 MHz |
Not Qualified |
1310720 bit |
.00001 Amp |
4 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
131072 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
128KX40 |
128K |
1.71 V |
-40 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
5242880 bit |
.01 Amp |
3.5 ns |
||||||||||||||||||||||
Infineon Technologies |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
220 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3 |
3.6 V |
2.4 mm |
200 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
.04 Amp |
22 mm |
3 ns |
||||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
36 |
GRID ARRAY |
85 Cel |
4MX36 |
4M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
1.9 V |
Not Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
95 mA |
1048576 words |
3/3.3 |
16 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
Not Qualified |
16777216 bit |
e1 |
260 |
.00075 Amp |
45 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.