Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
STANDARD SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
Not Qualified |
294912 bit |
e0 |
.03 Amp |
12 ns |
|||||||||||||||||||||||
STMicroelectronics |
STANDARD SRAM |
MILITARY |
20 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
1 |
CHIP CARRIER |
125 Cel |
16KX1 |
16K |
-55 Cel |
QUAD |
S-XQCC-N20 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
35 ns |
|||||||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
YES |
16.5862 mm |
12 ns |
||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
11 ns |
|||||||||||||||||||||||||
|
STMicroelectronics |
STANDARD SRAM |
INDUSTRIAL |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
4 words |
5 |
2/6 |
4 |
CHIP CARRIER |
LDCC20,.4SQ |
Other Memory ICs |
1.27 mm |
85 Cel |
3-STATE |
4X4 |
4 |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-CQCC-N20 |
6 V |
1.86 mm |
8.89 mm |
Not Qualified |
16 bit |
2 V |
e3 |
NO |
8.89 mm |
46 ns |
|||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
12 ns |
|||||||||||||||||||||||||
STMicroelectronics |
STANDARD SRAM |
MILITARY |
20 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
1 |
CHIP CARRIER |
125 Cel |
16KX1 |
16K |
-55 Cel |
QUAD |
S-XQCC-N20 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
45 ns |
|||||||||||||||||||||||||||||
STMicroelectronics |
STANDARD SRAM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
4 |
CHIP CARRIER |
125 Cel |
4KX4 |
4K |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-N20 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
70 ns |
||||||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
8 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
e0 |
YES |
.03 Amp |
16.5862 mm |
24 ns |
||||||||||||||
NXP Semiconductors |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
256X8 |
256 |
-55 Cel |
QUAD |
S-XQCC-N28 |
5.25 V |
Not Qualified |
2048 bit |
4.75 V |
||||||||||||||||||||||||||||||
NXP Semiconductors |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
256 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
256X8 |
256 |
-55 Cel |
QUAD |
S-XQCC-N28 |
5.25 V |
Not Qualified |
2048 bit |
4.75 V |
||||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
265 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
e0 |
YES |
.095 Amp |
19.1262 mm |
10 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
32KX36 |
32K |
0 Cel |
QUAD |
S-PQFP-G176 |
3.465 V |
1.6 mm |
24 mm |
1179648 bit |
3.135 V |
24 mm |
5 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
QUAD |
S-PQFP-G176 |
3.465 V |
1.6 mm |
24 mm |
4718592 bit |
3.135 V |
24 mm |
4 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
280 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
BYTE WRITE |
e0 |
YES |
.02 Amp |
19.1262 mm |
12 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
265 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
BYTE WRITE |
e0 |
YES |
.02 Amp |
19.1262 mm |
15 ns |
|||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.5 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
3 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.5 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
QUAD |
S-PQFP-G176 |
3.465 V |
1.6 mm |
24 mm |
4718592 bit |
3.135 V |
24 mm |
6 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
QUAD |
S-PQFP-G176 |
3.465 V |
1.6 mm |
24 mm |
4718592 bit |
3.135 V |
24 mm |
6 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
3 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
32768 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
32KX36 |
32K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2 |
S-PQFP-G176 |
3.465 V |
1.6 mm |
66 MHz |
24 mm |
Not Qualified |
1179648 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.1 Amp |
24 mm |
8 ns |
|||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
QUAD |
S-PQFP-G176 |
3.465 V |
1.6 mm |
24 mm |
4718592 bit |
3.135 V |
24 mm |
5 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE TAG SRAM |
COMMERCIAL |
241 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
72 |
GRID ARRAY |
1.27 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
BOTTOM |
S-PBGA-B241 |
3.465 V |
2.05 mm |
25 mm |
2359296 bit |
3.135 V |
8KX18TAG ARRAY AVAILABLE |
25 mm |
8.5 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
350 mA |
131072 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK |
QFP176,1.0SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
0 Cel |
QUAD |
2 |
S-PQFP-G176 |
Not Qualified |
4718592 bit |
.1 Amp |
5 ns |
|||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
e0 |
YES |
.095 Amp |
19.1262 mm |
12 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
9 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
3 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
32768 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
32KX36 |
32K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2 |
S-PQFP-G176 |
3.465 V |
1.6 mm |
83 MHz |
24 mm |
Not Qualified |
1179648 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.1 Amp |
24 mm |
6 ns |
|||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.5 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
9 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
19.1262 mm |
1179648 bit |
4.75 V |
19.1262 mm |
10 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
32KX36 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G176 |
3.465 V |
1.6 mm |
24 mm |
Not Qualified |
1179648 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
24 mm |
8 ns |
|||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
19.1262 mm |
1179648 bit |
4.75 V |
19.1262 mm |
9 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
3 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.5 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
BOTTOM |
S-PBGA-B119 |
3.465 V |
2.4 mm |
14 mm |
4718592 bit |
3.135 V |
22 mm |
2.2 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
9 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
MULTI-PORT SRAM |
COMMERCIAL |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
32768 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
32KX36 |
32K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2 |
S-PQFP-G176 |
3.465 V |
1.6 mm |
83 MHz |
24 mm |
Not Qualified |
1179648 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.1 Amp |
24 mm |
6 ns |
|||||||||||||
NXP Semiconductors |
CACHE TAG SRAM |
COMMERCIAL |
241 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
72 |
GRID ARRAY |
1.27 mm |
70 Cel |
32KX72 |
32K |
0 Cel |
BOTTOM |
S-PBGA-B241 |
3.465 V |
2.05 mm |
25 mm |
2359296 bit |
3.135 V |
8KX18TAG ARRAY AVAILABLE |
25 mm |
8 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.