Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
1.5 |
72 |
GRID ARRAY |
1 mm |
85 Cel |
128KX72 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
9437184 bit |
1.42 V |
e1 |
23 mm |
4 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1730 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX72 |
512K |
1.4 V |
-40 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
167 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e0 |
.7 Amp |
27 mm |
4 ns |
||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1550 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
72 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX72 |
512K |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.7 Amp |
27 mm |
13 ns |
|||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
504X8 |
504 |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
186 ns |
|||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
110 Cel |
3-STATE |
504X8 |
504 |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
166 ns |
|||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
504X8 |
504 |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
166 ns |
|||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
504 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
504X8 |
504 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2, (MUXED) |
S-PQCC-J44 |
Not Qualified |
e0 |
.000001 Amp |
166 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.5 |
36 |
GRID ARRAY |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
1.58 V |
2.16 mm |
23 mm |
Not Qualified |
37748736 bit |
1.42 V |
e1 |
23 mm |
3.3 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1330 mA |
1048576 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY |
BGA484,22X22,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B484 |
3 |
1.58 V |
2.46 mm |
133 MHz |
27 mm |
Not Qualified |
37748736 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.7 Amp |
27 mm |
13 ns |
|||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1100 mA |
65536 words |
COMMON |
1.8 |
1.8 |
20 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX20 |
64K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
133 MHz |
Not Qualified |
1310720 bit |
.01 Amp |
4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
BOTTOM |
S-PBGA-B361 |
1.34 V |
2.765 mm |
21 mm |
75497472 bit |
1.26 V |
NOT SPECIFIED |
NOT SPECIFIED |
21 mm |
|||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1100 mA |
32768 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
32KX40 |
32K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
133 MHz |
Not Qualified |
1310720 bit |
.00001 Amp |
4 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
131072 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
128KX40 |
128K |
1.71 V |
-40 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
5242880 bit |
.01 Amp |
3.5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
BOTTOM |
S-PBGA-B361 |
1.34 V |
2.765 mm |
21 mm |
75497472 bit |
1.26 V |
NOT SPECIFIED |
NOT SPECIFIED |
21 mm |
|||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
175 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1179648 bit |
3 V |
e3 |
40 |
260 |
.00005 Amp |
14 mm |
20 ns |
|||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
32768 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
32KX40 |
32K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
1310720 bit |
.00001 Amp |
3.5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
8MX18 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
150994944 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
85 Cel |
4MX18 |
4M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
75497472 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
AUTOMOTIVE |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
90 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
3 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B48 |
3 |
3.63 V |
1.2 mm |
7 mm |
Not Qualified |
1048576 bit |
2.97 V |
e1 |
20 |
260 |
.01 Amp |
7 mm |
12 ns |
|||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.3 |
36 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
4MX36 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
150994944 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.3 |
36 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
4MX36 |
4M |
0 Cel |
BOTTOM |
S-PBGA-B361 |
1.34 V |
2.765 mm |
21 mm |
150994944 bit |
1.26 V |
NOT SPECIFIED |
NOT SPECIFIED |
21 mm |
|||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
900 mA |
131072 words |
COMMON |
1.8 |
1.8 |
20 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
128KX20 |
128K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
100 MHz |
Not Qualified |
2621440 bit |
.01 Amp |
4.5 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
65536 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX40 |
64K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
2621440 bit |
.01 Amp |
3.5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
8MX18 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
150994944 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
85 Cel |
8MX18 |
8M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
150994944 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
65536 words |
COMMON |
1.8 |
1.8 |
20 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX20 |
64K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
1310720 bit |
.01 Amp |
3.5 ns |
||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
52 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-XQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.015 Amp |
14 ns |
|||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
250 mA |
8192 words |
COMMON |
5 |
5 |
18 |
FLATPACK |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
2 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2 |
S-PQFP-G100 |
3 |
Not Qualified |
147456 bit |
e4 |
260 |
.0015 Amp |
25 ns |
||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
65536 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
64KX40 |
64K |
1.71 V |
-40 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
2621440 bit |
.01 Amp |
3.5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN; INTERRUPT FLAG |
e3 |
30 |
260 |
19.1262 mm |
15 ns |
|||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
900 mA |
65536 words |
COMMON |
1.8 |
1.8 |
20 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX20 |
64K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
100 MHz |
Not Qualified |
1310720 bit |
.01 Amp |
4.5 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
900 mA |
32768 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
32KX40 |
32K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
100 MHz |
Not Qualified |
1310720 bit |
.00001 Amp |
4.5 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1100 mA |
65536 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX40 |
64K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
133 MHz |
Not Qualified |
2621440 bit |
.01 Amp |
4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65536 words |
3.3 |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
2 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
524288 bit |
3 V |
INTERRUPT FLAG |
e3 |
30 |
260 |
YES |
14 mm |
15 ns |
|||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
52 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
-55 Cel |
TIN LEAD |
QUAD |
S-XQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.015 Amp |
14 ns |
|||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
128KX18 |
128K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B144 |
3.465 V |
1.6 mm |
13 mm |
Not Qualified |
2359296 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
13 mm |
4 ns |
|||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
900 mA |
65536 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
64KX40 |
64K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
100 MHz |
Not Qualified |
2621440 bit |
.01 Amp |
4.5 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
120 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
128KX18 |
128K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G120 |
3 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
14 mm |
4 ns |
||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
235 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.01 Amp |
14 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
131072 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
128KX40 |
128K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
5242880 bit |
.01 Amp |
3.5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
172 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
32KX36 |
32K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B172 |
3 |
3.465 V |
1.25 mm |
15 mm |
1179648 bit |
3.135 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e1 |
40 |
260 |
15 mm |
12.5 ns |
||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.3 |
36 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
4MX36 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
150994944 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
900 mA |
131072 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
128KX40 |
128K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
100 MHz |
Not Qualified |
5242880 bit |
.01 Amp |
4.5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
75497472 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
2048 words |
COMMON |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
.65 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.5 mm |
10 mm |
16384 bit |
4.5 V |
.015 Amp |
10 mm |
25 ns |
|||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
361 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.3 |
36 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B361 |
3 |
1.34 V |
2.765 mm |
21 mm |
75497472 bit |
1.26 V |
e1 |
21 mm |
||||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1100 mA |
131072 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
128KX40 |
128K |
1.71 V |
0 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
133 MHz |
Not Qualified |
5242880 bit |
.01 Amp |
4 ns |
||||||||||||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1100 mA |
131072 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
128KX40 |
128K |
1.71 V |
-40 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
133 MHz |
Not Qualified |
5242880 bit |
.01 Amp |
4 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.