Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
STANDARD SRAM |
MILITARY |
36 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
95 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
FLATPACK |
FL36,.5 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-55 Cel |
GOLD OVER NICKEL |
DUAL |
R-CDFP-F36 |
1 |
3.6 V |
2.99 mm |
12.19 mm |
Not Qualified |
4194304 bit |
3 V |
e4 |
.015 Amp |
23.37 mm |
12 ns |
||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.015 Amp |
35 ns |
|||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
55 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
55 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
54 |
SSOP |
RECTANGULAR |
200k Rad(Si) |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38534 Class V |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP54,.56,32 |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-55 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
3.038 mm |
11.836 mm |
Qualified |
16777216 bit |
2.2 V |
YES |
.05 Amp |
22.403 mm |
10 ns |
||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
25 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
MILITARY |
DIE |
UNSPECIFIED |
300k Rad(Si) |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
UNCASED CHIP |
125 Cel |
4MX18 |
4M |
-55 Cel |
UPPER |
X-XUUC-N |
1.9 V |
75497472 bit |
1.7 V |
BURST ARCHITECTURE |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
54 |
SSOP |
RECTANGULAR |
200k Rad(Si) |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP54,.56,32 |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-55 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
3.038 mm |
11.836 mm |
16777216 bit |
2.2 V |
YES |
.05 Amp |
22.403 mm |
10 ns |
||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
75 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
35 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
170 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.015 Amp |
20 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
35 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
20 ns |
||||||||||||||||||||||||
Infineon Technologies |
QDR SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY |
1.27 mm |
125 Cel |
2MX36 |
2M |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
21 mm |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
25 mm |
|||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1040 mA |
4194304 words |
SEPARATE |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
|||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
20 ns |
||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
65 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
45 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
65 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
45 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
45 ns |
||||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
780 mA |
8388608 words |
SEPARATE |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
|||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
FLATPACK |
FL28,.4 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDFP-F28 |
Not Qualified |
65536 bit |
e0 |
35 ns |
||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
65 mA |
8192 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
.0015 Amp |
45 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
55 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
55 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.02 Amp |
55 ns |
|||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
75 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
35 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1040 mA |
4194304 words |
COMMON |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
20 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.015 Amp |
25 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
125 Cel |
8MX18 |
8M |
-55 Cel |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
21 mm |
Qualified |
150994944 bit |
1.7 V |
25 mm |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
36 |
GRID ARRAY |
1.27 mm |
125 Cel |
4MX36 |
4M |
-55 Cel |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
21 mm |
Qualified |
150994944 bit |
1.7 V |
25 mm |
||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
MILITARY |
54 |
SSOP |
RECTANGULAR |
200k Rad(Si) |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP54,.56,32 |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-55 Cel |
DUAL |
1 |
R-PDSO-G54 |
1 |
3.6 V |
3.038 mm |
11.836 mm |
16777216 bit |
2.2 V |
YES |
.05 Amp |
22.403 mm |
10 ns |
||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
780 mA |
8388608 words |
SEPARATE |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
|||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
4194304 words |
COMMON |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
780 mA |
8388608 words |
COMMON |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
||||||||||||||
|
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
LGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1700 mA |
4194304 words |
COMMON |
1.8 |
18 |
GRID ARRAY |
LGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-55 Cel |
BOTTOM |
2 |
R-CBGA-N165 |
1 |
1.9 V |
3.07 mm |
250 MHz |
21 mm |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
2097152 words |
COMMON |
1.8 |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Not Qualified |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
|||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
780 mA |
8388608 words |
SEPARATE |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
2097152 words |
COMMON |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
QDR SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1275 mA |
4194304 words |
SEPARATE |
1.8 |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
4MX18 |
4M |
-55 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
.57 Amp |
25 mm |
.85 ns |
|||||||||||||
Infineon Technologies |
QDR SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
125 Cel |
4MX18 |
4M |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
21 mm |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
25 mm |
|||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
2097152 words |
COMMON |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-55 Cel |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Qualified |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
MILITARY |
36 |
DFP |
RECTANGULAR |
300k Rad(Si) |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
512KX8 |
512K |
-55 Cel |
NICKEL GOLD |
DUAL |
R-XDFP-F36 |
1 |
3.6 V |
2.99 mm |
12.19 mm |
Qualified |
4194304 bit |
3 V |
e4 |
23.37 mm |
12 ns |
||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
FLATPACK |
FL28,.4 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDFP-F28 |
Not Qualified |
65536 bit |
e0 |
25 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
45 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
FLATPACK |
FL28,.4 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDFP-F28 |
Not Qualified |
65536 bit |
e0 |
45 ns |
||||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
65 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
45 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
25 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.015 Amp |
25 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.02 Amp |
15 ns |
|||||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
75 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
.0015 Amp |
35 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.