Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
25 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.015 Amp |
45 ns |
|||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1700 mA |
4194304 words |
COMMON |
1.8 |
1.8 |
18 |
GRID ARRAY |
CGA165,11X15,50 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Not Qualified |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
|||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.02 Amp |
20 ns |
|||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.015 Amp |
45 ns |
|||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1040 mA |
4194304 words |
COMMON |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Qualified |
150994944 bit |
1.7 V |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
|||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
20 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
MILITARY |
165 |
LGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
125 Cel |
4MX18 |
4M |
-55 Cel |
BOTTOM |
R-CBGA-N165 |
1 |
1.9 V |
3.07 mm |
21 mm |
75497472 bit |
1.7 V |
e0 |
25 mm |
.85 ns |
||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1040 mA |
4194304 words |
SEPARATE |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
55 mA |
8192 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
.0015 Amp |
55 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
45 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
35 ns |
||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.015 Amp |
15 ns |
|||||||||||||||||||||||
Infineon Technologies |
QDR SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1275 mA |
2097152 words |
SEPARATE |
1.8 |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
2MX36 |
2M |
-55 Cel |
TIN LEAD |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
.57 Amp |
25 mm |
.85 ns |
|||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
125 Cel |
32KX8 |
32K |
-55 Cel |
GOLD |
DUAL |
R-XDIP-T32 |
1 |
5.5 V |
Qualified |
262144 bit |
4.5 V |
e4 |
35 ns |
|||||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1040 mA |
4194304 words |
COMMON |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
1040 mA |
4194304 words |
SEPARATE |
1.8 |
36 |
GRID ARRAY |
CGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-55 Cel |
TIN LEAD |
BOTTOM |
2 |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
250 MHz |
21 mm |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.39 Amp |
25 mm |
.85 ns |
|||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
MILITARY |
36 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
512KX8 |
512K |
-55 Cel |
GOLD OVER NICKEL |
DUAL |
R-CDFP-F36 |
1 |
3.6 V |
2.99 mm |
12.19 mm |
4194304 bit |
3 V |
e4 |
23.37 mm |
12 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
QDR II PLUS SRAM |
MILITARY |
165 |
LGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1700 mA |
2097152 words |
COMMON |
1.8 |
36 |
GRID ARRAY |
LGA165,11X15,50 |
1.27 mm |
125 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-55 Cel |
BOTTOM |
2 |
R-CBGA-N165 |
1 |
1.9 V |
3.07 mm |
250 MHz |
21 mm |
75497472 bit |
1.7 V |
e0 |
NO |
.66 Amp |
25 mm |
.85 ns |
||||||||||||||
Infineon Technologies |
QDR SRAM |
MILITARY |
165 |
CGA |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
GRID ARRAY |
1.27 mm |
125 Cel |
4MX18 |
4M |
-55 Cel |
BOTTOM |
R-CBGA-X165 |
1 |
1.9 V |
5.38 mm |
21 mm |
Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
25 mm |
|||||||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
COMMON |
5 |
8 |
IN-LINE |
DIP32,.3 |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-55 Cel |
GOLD |
DUAL |
R-CDIP-T32 |
1 |
5.5 V |
3.96 mm |
7.62 mm |
1048576 bit |
4.5 V |
e4 |
YES |
.01 Amp |
40.64 mm |
35 ns |
||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
48 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-55 Cel |
BOTTOM |
1 |
R-XBGA-B48 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
YES |
.05 Amp |
8 mm |
10 ns |
|||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
52 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-XQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.015 Amp |
14 ns |
|||||||||||||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
COMMON |
3.3 |
8 |
IN-LINE |
DIP32,.3 |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-55 Cel |
DUAL |
R-CDIP-T32 |
3.6 V |
3.96 mm |
7.62 mm |
1048576 bit |
3 V |
YES |
.01 Amp |
40.64 mm |
35 ns |
||||||||||||||||||||
|
Infineon Technologies |
CACHE SRAM |
MILITARY |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
125 Cel |
256KX36 |
256K |
-55 Cel |
PURE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
9437184 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
260 |
20 mm |
6.5 ns |
||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
52 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
-55 Cel |
TIN LEAD |
QUAD |
S-XQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.015 Amp |
14 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
48 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-55 Cel |
BOTTOM |
1 |
R-XBGA-B48 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
YES |
.05 Amp |
8 mm |
10 ns |
|||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
COMMON |
3.3 |
8 |
IN-LINE |
DIP32,.3 |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-55 Cel |
GOLD |
DUAL |
R-CDIP-T32 |
1 |
3.6 V |
3.96 mm |
7.62 mm |
1048576 bit |
3 V |
e4 |
YES |
.01 Amp |
40.64 mm |
35 ns |
||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
MILITARY |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
125 Cel |
512KX36 |
512K |
-55 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
3.4 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
CACHE SRAM |
MILITARY |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
125 Cel |
512KX36 |
512K |
-55 Cel |
PURE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
18874368 bit |
3.135 V |
260 |
20 mm |
6.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
190 mA |
1024 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-55 Cel |
TIN LEAD |
DUAL |
2 |
R-PDIP-T48 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
.03 Amp |
61.849 mm |
55 ns |
||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
280 mA |
1024 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-55 Cel |
MATTE TIN |
DUAL |
2 |
R-PDIP-T48 |
Not Qualified |
8192 bit |
e3 |
.03 Amp |
25 ns |
||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
230 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
MATTE TIN |
DUAL |
2 |
R-PDIP-T48 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER DOWN |
e3 |
.03 Amp |
60.96 mm |
35 ns |
||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
280 mA |
2048 words |
5 |
16 |
FLATPACK |
.5 mm |
125 Cel |
2KX16 |
2K |
-55 Cel |
QUAD |
S-PQFP-G100 |
5.5 V |
14 mm |
32768 bit |
4.5 V |
14 mm |
90 ns |
||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
280 mA |
1024 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-55 Cel |
MATTE TIN |
DUAL |
2 |
R-PDIP-T48 |
1 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
e3 |
.03 Amp |
25 ns |
|||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
230 mA |
1024 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP64,.47SQ,20 |
SRAMs |
.5 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-55 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
e3 |
30 |
260 |
.03 Amp |
35 ns |
|||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
170 mA |
1024 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
2 V |
-55 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G64 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
30 |
240 |
.004 Amp |
14 mm |
35 ns |
|||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
170 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC48,.56SQ,40 |
SRAMs |
1 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
MATTE TIN |
QUAD |
2 |
S-XQCC-N48 |
5.5 V |
14.3002 mm |
Not Qualified |
16384 bit |
4.5 V |
e3 |
.004 Amp |
14.3002 mm |
35 ns |
||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
190 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
MATTE TIN |
DUAL |
2 |
R-PDIP-T48 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER DOWN |
e3 |
.03 Amp |
60.96 mm |
55 ns |
||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
310 mA |
2048 words |
5 |
16 |
FLATPACK |
.5 mm |
125 Cel |
2KX16 |
2K |
-55 Cel |
QUAD |
S-PQFP-G100 |
5.5 V |
14 mm |
32768 bit |
4.5 V |
14 mm |
70 ns |
||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
330 mA |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
MATTE TIN |
QUAD |
S-PQCC-N52 |
5.5 V |
4.572 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER DOWN |
e3 |
19.1262 mm |
25 ns |
|||||||||||||||||||||
Renesas Electronics |
DUAL-PORT SRAM |
MILITARY |
48 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
170 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC48,.56SQ,40 |
SRAMs |
1.016 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2 |
S-CQCC-N48 |
1 |
5.5 V |
3.048 mm |
14.3002 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
NOT SPECIFIED |
240 |
.004 Amp |
14.3002 mm |
35 ns |
|||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
310 mA |
2048 words |
5 |
16 |
GRID ARRAY |
125 Cel |
2KX16 |
2K |
-55 Cel |
PERPENDICULAR |
S-CPGA-P68 |
5.5 V |
32768 bit |
4.5 V |
90 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
170 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
2 |
R-PDIP-T48 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
.004 Amp |
61.849 mm |
35 ns |
||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
140 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC48,.56SQ,40 |
SRAMs |
1 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
2 V |
-55 Cel |
MATTE TIN |
QUAD |
2 |
S-XQCC-N48 |
5.5 V |
14.3002 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
.004 Amp |
14.3002 mm |
100 ns |
||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
MATTE TIN |
DUAL |
R-PDIP-T48 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
61.849 mm |
100 ns |
||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
190 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
QFL48,.75SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-55 Cel |
MATTE TIN |
QUAD |
2 |
S-CQCC-N48 |
5.5 V |
14.3002 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
.03 Amp |
14.3002 mm |
55 ns |
||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
68 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
310 mA |
2048 words |
COMMON |
5 |
5 |
16 |
FLATPACK |
QFL68,.95SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
2KX16 |
2K |
2 V |
-55 Cel |
TIN LEAD |
QUAD |
2 |
S-CQFP-F68 |
5.5 V |
3.683 mm |
24.0792 mm |
Not Qualified |
32768 bit |
4.5 V |
e0 |
.004 Amp |
24.0792 mm |
90 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.