INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
AM3505AZERA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16		16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.48 mm		65536	23 mm		YES	16	26 MHz	30	260	23 mm		CMOS	1400 mA	1.2 V	32			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
AT91RM9200-QU-002	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8	26	NO	32	1.8,3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.65 V	85 Cel	ARM7	7	-40 Cel	MATTE TIN	NO	QUAD	YES	4.1 mm	131072	16384	28 mm	SEATED HEIGHT -MIN	YES	32	80 MHz		260	28 mm	16384	CMOS		1.8 V	20	YES	1	Microcontrollers	FLASH	.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	209 rpm	YES	e3	94
MCF5329CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM										40	260									Microprocessors		1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MCF5251CVM140	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24		32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	85 Cel			-40 Cel			BOTTOM		1.6 mm			13 mm		YES	32	140 MHz	40	260	13 mm		CMOS		1.2 V						.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO
AM3505AZCNA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16		16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		65536	17 mm		YES	16	26 MHz	30	260	17 mm		CMOS	1400 mA	1.2 V	32			Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
MC7448THX1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		36		32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel			-40 Cel	TIN LEAD		BOTTOM		2.8 mm			25 mm		YES	64	200 MHz	40	260	25 mm		CMOS		1.05 V				Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e0
P1010NXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER		BOTTOM		1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4					.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
P1010NXE5HFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel			BOTTOM		1.9 mm			19 mm		YES	32				19 mm		CMOS		1 V	4					.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
P1010NXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER		BOTTOM		1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
SAM9X60D1G-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm		69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm		CMOS		1.8 V	16					.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
ADSP-21489BSWZ-4B	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24		40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	85 Cel			-40 Cel	Matte Tin (Sn) - annealed		QUAD		1.6 mm		163840	24 mm		YES	16	25 MHz			24 mm		CMOS		1.1 V				Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
AT91SAM9261B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	1.08 V	85 Cel		3	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm		163840	15 mm		YES	32	20 MHz			15 mm		CMOS		1.2 V	19		7	Microcontrollers		.8 mm	FIXED POINT	S-PBGA-B217	3	Not Qualified	190 rpm	YES	e1
MPC8308CVMAGDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER		BOTTOM		1.54 mm			19 mm		YES			40	260	19 mm		CMOS		1 V						.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
OSD3358-512M-IND	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	NO	YES		8	28				GRID ARRAY	BGA400,20X20,50		85 Cel		1	-40 Cel			BOTTOM		2.6 mm		65536	27 mm	64kbytes shared l3 ram also available	YES	16			245	27 mm		CMOS	2000 mA	1.1 V						1.27 mm	FIXED POINT	S-PBGA-B400	4		1000 rpm	NO
AM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm			17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V						.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
ATSAMA5D27C-LD2G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0		16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel			-40 Cel			BOTTOM		1.2 mm		32768	16 mm		YES	0	24 MHz			16 mm		CMOS		1.8 V	51		1			.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
ATSAMA5D27C-D5M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16	0		16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,32	1.14 V	85 Cel			-40 Cel			BOTTOM		1.2 mm		65536	14 mm		YES	0	24 MHz			14 mm		CMOS		1.2 V	51		1			.8 mm	FIXED POINT	S-PBGA-B289			500 rpm	YES
P1010NXE5KHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM		1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	1000 rpm	NO	e2
ATSAMA5D36A-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel		1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
DM3730CBPD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26		32	1.2,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,23X23,20	1.08 V	90 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		.71 mm		16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	37 mA	1.14 V	128			Digital Signal Processors		.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
ATSAMA5D27C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel		1	-40 Cel			BOTTOM		1.4 mm		131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		1.25 V	32					.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D34A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel		1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
ADSP-BF609BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V				32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm		YES		60 MHz			19 mm		CMOS		1.25 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
MCF54418CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0		32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel			BOTTOM							YES	0	100 MHz	40	260			CMOS		1.2 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MCF5485CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.55 mm			27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		3.3 V						1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
P1010NXE5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel			BOTTOM		1.9 mm			19 mm		YES	32				19 mm		CMOS		1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
ATSAMA5D27C-LD1G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0		16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel			-40 Cel			BOTTOM		1.2 mm		32768	16 mm		YES	0	24 MHz			16 mm		CMOS		1.8 V	51		1			.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
P1010NXE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM		1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
ATSAMA5D36A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel		1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
SAM9X60D1GT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm		69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm		CMOS		1.8 V	16					.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
ATSAMA5D27C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel		1	-40 Cel			BOTTOM		1.4 mm		131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		1.25 V	32					.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
P1010NXE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM		1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
AT91SAM9261B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	1.08 V	85 Cel		3	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		163840	15 mm		YES	32	20 MHz			15 mm		CMOS		1.2 V	19		7			.8 mm	FIXED POINT	S-PBGA-B217			190 rpm	YES	e1
STM32MP157DAD1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16		32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel			-20 Cel			BOTTOM		1.2 mm		724992	10 mm		YES	16	64 MHz			10 mm		CMOS	865 mA	.9 V	48					.65 mm	FLOATING POINT	S-PBGA-B257			800 rpm	YES
ATSAMA5D26C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel		1	-40 Cel			BOTTOM		1.4 mm		131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		1.25 V	32					.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
Z84C0010PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16		8		IN-LINE		4.5 V	100 Cel		2	-40 Cel	MATTE TIN		DUAL		4.75 mm		0	15.24 mm	DRAM REFRESH COUNTER	NO	8	10 MHz			52.325 mm		CMOS	50 mA	5 V	0		0			2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	10 rpm	YES	e3
MIMXRT1015CAF4A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	0		32		FLATPACK	QFP100,.63SQ,20	1.15 V	105 Cel		0	-40 Cel	TIN		QUAD		1.7 mm		131072	14 mm	OPERATES UPTO 400 MHZ, BUT WE HAVE CHARACTERISTICS FOR 396 MHZ	YES	0	24 MHz	40	260	14 mm		CMOS	90 mA		32		6			.5 mm	FLOATING POINT	S-PQFP-G100	3		396 rpm	YES	e3
ATSAMA5D27C-D5M-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	16	0		16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,32	1.7 V	85 Cel			-40 Cel			BOTTOM		1.2 mm		65536	14 mm		YES	0	24 MHz			14 mm		CMOS		1.8 V	51		1			.8 mm	FIXED POINT	S-PBGA-B289			500 rpm	YES
MCF5485CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN LEAD		BOTTOM		2.55 mm			27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		3.3 V						1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
STM32MP157DAC1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26		32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel			-20 Cel			BOTTOM		1.2 mm		724992	12 mm		YES	0	64 MHz			12 mm		CMOS	865 mA	.9 V	48					.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
AM3352BZCZD30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
ATSAMA5D21C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL		BOTTOM		1.2 mm		131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32					.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
P1010NXE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER		BOTTOM		1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4					.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
AM3356BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.26 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3352BZCEA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64			Microprocessors		.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCED30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64			Microprocessors		.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
ADSP-BF609BBCZ-5X	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25				GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel			-40 Cel			BOTTOM		1.5 mm			19 mm	ALSO AVAILABLE IN 3.3V AND 14 BIT ADDRESS	YES	16				19 mm		CMOS		1.8 V						.8 mm	FIXED POINT	S-PBGA-B349			500 rpm	YES
AM3354BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.