INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
STM32MP157AAA3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel			-40 Cel			BOTTOM		1.32 mm		724992	18 mm			YES		0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	18 mm		CMOS		1000 mA	.9 V	48						.8 mm	FLOATING POINT	S-PBGA-B448			650 rpm	YES
Z84C0008VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16		8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel		2	-40 Cel	Matte Tin (Sn)		QUAD		4.57 mm		0	16.5862 mm		DRAM MEMORY REFRESH COUNTER	NO		8	8 MHz	40	260	16.5862 mm		CMOS		40 mA	5 V	0		0	Microprocessors			1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	8 rpm	YES	e3
AM1705DPTPD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES		8	13		32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			105 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1.6 mm		172032	24 mm			YES		16	50 MHz	30	260	24 mm		CMOS			1.2 V	40						.5 mm	FIXED POINT	S-PQFP-G176	4		375 rpm	YES	e4
AM3352BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		131072	13 mm			YES		16	26 MHz	30	260	13 mm		CMOS		400 mA	1.1 V	64			Microprocessors			.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM5708BCBDJEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm			17 mm			YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V							.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AT97SC3205T-H3M4C10B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0		8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel			-40 Cel			QUAD		.9 mm			4 mm			NO		0				4 mm		CMOS			3.3 V							.4 mm	FIXED POINT	S-PQCC-N32				NO
ATSAMA5D22C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL		BOTTOM		1.2 mm		131072	11 mm		ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES		16	24 MHz			11 mm		CMOS			1.25 V	32						.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D27C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel		1	-40 Cel			BOTTOM		1.4 mm		131072	14 mm		ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES		16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS			1.25 V	32						.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
CP3BT26Y98ADK/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	2.75 V		23		16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.25 V	85 Cel	CR16C		-40 Cel	MATTE TIN		QUAD		1.6 mm	262144		20 mm			YES		16		30	260	20 mm	32768	CMOS		20 mA	2.5 V				Microcontrollers		FLASH	.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified	24 rpm	YES	e3
CP3BT26Y98ADKX/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	2.75 V		23		16	2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.25 V	85 Cel	CR16C		-40 Cel	MATTE TIN		QUAD		1.6 mm	262144		20 mm			YES		16		30	260	20 mm	32768	CMOS		20 mA	2.5 V				Microcontrollers		FLASH	.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified	24 rpm	YES	e3
FH8065301567313	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY			110 Cel			-40 Cel			BOTTOM								NO								CMOS											FIXED POINT	R-PBGA-B1170			1330 rpm
KMPC8343CVRAGDB	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32		32		GRID ARRAY		1.14 V	105 Cel			-40 Cel	TIN SILVER		BOTTOM		2.46 mm			29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	29 mm		CMOS			1.2 V							1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LX2160XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36		64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm			40 mm			YES		128		30	245	40 mm		CMOS		.05 mA	.85 V			17				1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MC8640DTHX1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		32		32		GRID ARRAY		1 V	105 Cel			-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM		2.97 mm			33 mm			YES		32	166.66 MHz	30	245	33 mm		CMOS			1.05 V							1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e0
MCF5232CVM150J	Freescale Semiconductor		INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel	COLDFIRE		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm			15 mm			YES		32		40	260	15 mm	65536	CMOS		150 mA					Microcontrollers			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES
MCF5270CVM150R2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			15 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	75 MHz	40	260	15 mm		CMOS			1.5 V							1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF5327CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.75 mm			15 mm			YES		32	80 MHz	40	260	15 mm		CMOS			1.5 V							1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MCF53281CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			17 mm			YES		32	80 MHz	40	260	17 mm		CMOS			1.5 V							1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MPC8308CVMAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V					1,1.8,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel			-40 Cel			BOTTOM		1.54 mm			19 mm			YES			66.67 MHz	40	260	19 mm		CMOS			1 V			2	Microprocessors			.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
MPC8309CVMAGDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel			-40 Cel	TIN SILVER		BOTTOM		1.61 mm			19 mm			YES		0	66.67 MHz	40	260	19 mm		CMOS			1 V				Microprocessors			.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	400 rpm	YES	e2
MPC8347ECZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32		32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel			-40 Cel	TIN LEAD SILVER		BOTTOM		2.46 mm			29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	29 mm		CMOS			1.2 V				Microprocessors			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
P1010NXN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER		BOTTOM		1.9 mm			19 mm			YES		32		40	260	19 mm		CMOS			1 V	4			Microprocessors			.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
PPC460EX-SUA1000T	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		32				GRID ARRAY		1.2 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.65 mm			35 mm			YES		32	100 MHz			35 mm		CMOS			1.25 V							1 mm	FLOATING POINT	S-PBGA-B728		Not Qualified	1000 rpm	YES	e1
R7S721001VCBG	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		GRID ARRAY, FINE PITCH	BGA324,22X22,32	1.1 V	85 Cel		8	-40 Cel		YES	BOTTOM	YES	2.1 mm		10485760	19 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			19 mm	10485760	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)		.8 mm	FLOATING POINT	S-PBGA-B324			400 rpm	YES		169
R7S721010VCFP	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	1.1 V	85 Cel		8	-40 Cel		YES	QUAD	YES	1.7 mm		5242880	28 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			28 mm	5242880	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)		.4 mm	FLOATING POINT	S-PQFP-G256			400 rpm	YES		137
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel		6	-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm			19 mm			YES		32		40	260	19 mm		CMOS		5 mA	1 V	2		5				.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
XAM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.298 mm			17 mm			YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V							.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
XAM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel			BOTTOM		1.63 mm			23 mm			YES		32	38.4 MHz			23 mm		CMOS			1.15 V							.8 mm	FIXED POINT	S-PBGA-B760			1500 rpm	YES
Z84C0006PEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V	0	16		8		IN-LINE		4.5 V	100 Cel		2	-40 Cel	MATTE TIN		DUAL		4.75 mm		0	15.24 mm		DRAM REFRESH COUNTER	NO		8	6.17 MHz			52.325 mm		CMOS		30 mA	5 V	0		0				2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6.17 rpm	YES	e3
AM3715CUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26		32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm		65536	16 mm			YES		16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS		800 mA	1.1 V				Microprocessors			.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
AM5708BCBDJAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm			17 mm			YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V							.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.298 mm			17 mm		GPMC CONSISTS OF 28-BIT ADDRESS LINES AND 16-BIT DATA LINES	YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V							.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
KMPC8347ECVRAGDB	Freescale Semiconductor	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32		32		GRID ARRAY		1.14 V	105 Cel			-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM		2.46 mm			29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	29 mm		CMOS			1.2 V							1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LS1012AXN7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16		64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel			-40 Cel			BOTTOM		.925 mm			9.6 mm			YES		16	25 MHz	40	260	9.6 mm		CMOS			.9 V							.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
MCF5208CVM166J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm			15 mm			YES		32	40 MHz	40	260	15 mm		CMOS			1.5 V				Microprocessors			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES
PPC460EX-SUA600T	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		32				GRID ARRAY		1.2 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.65 mm			35 mm			YES		32	100 MHz			35 mm		CMOS			1.25 V							1 mm	FLOATING POINT	S-PBGA-B728		Not Qualified	600 rpm	YES	e1
STM32MP157AAB3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel			-40 Cel			BOTTOM		1.29 mm		724992	16 mm			YES		16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1000 mA	.9 V	48						.8 mm	FLOATING POINT	S-PBGA-B354			650 rpm	YES
TN80C188EA-20	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20		16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel		5	-40 Cel	TIN LEAD		QUAD		4.83 mm		0	24.2 mm			NO		8	40 MHz			24.2 mm		CMOS		90 mA	5 V	2		0	Microprocessors			1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	20 rpm	YES	e0
TN80C188EB20	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20		16	5	CHIP CARRIER	LDCC84,1.2SQ	4.5 V	85 Cel		6	-40 Cel	TIN LEAD		QUAD		4.83 mm		0	29.3116 mm		DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	NO		8	40 MHz			29.3116 mm		CMOS		108 mA	5 V	0		2	Microprocessors			1.27 mm	FIXED POINT	S-PQCC-J84		Not Qualified	20 rpm	YES	e0
Z84C0010VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16		8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel		2	-40 Cel	Matte Tin (Sn)		QUAD		4.57 mm		0	16.5862 mm		DRAM MEMORY REFRESH COUNTER	NO		8	10 MHz	40	260	16.5862 mm		CMOS		50 mA	5 V	0		0	Microprocessors			1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	10 rpm	YES	e3
STM32MP157AAD3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16		32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel			-40 Cel			BOTTOM		1.2 mm		724992	10 mm			YES		16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1000 mA	.9 V	48						.65 mm	FLOATING POINT	S-PBGA-B257			650 rpm	YES
MCF5484CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN LEAD		BOTTOM		2.55 mm			27 mm			YES			66.67 MHz	40	260	27 mm		CMOS			3.3 V							1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF53721CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.75 mm			15 mm			YES		32	80 MHz	40	260	15 mm		CMOS			1.5 V							1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MPC5200CBV266	Motorola	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32				GRID ARRAY		1.42 V	85 Cel			-40 Cel			BOTTOM		2.65 mm			27 mm			YES		32	35 MHz			27 mm		CMOS			1.5 V							1.27 mm	FIXED POINT	S-PBGA-B272		Not Qualified	266 rpm	YES
MC7448THX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36		32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel			-40 Cel	TIN LEAD		BOTTOM		2.8 mm			25 mm			YES		64	200 MHz	40	260	25 mm		CMOS			1.15 V				Microprocessors			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32		32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel			-40 Cel	TIN SILVER		BOTTOM		2.55 mm			27 mm			YES		32	66.67 MHz	40	260	27 mm		CMOS			1 V				Microprocessors			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MCF5207CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			13 mm			YES		32	40 MHz	40	260	13 mm		CMOS			1.5 V				Microprocessors			1 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	166.67 rpm	YES	e1
MCF54453CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32		32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel			-40 Cel	TIN SILVER		BOTTOM		2.48 mm			23 mm			YES		32	66 MHz	40	260	23 mm		CMOS			1.5 V				Microprocessors			1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.