INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC68SEC000CFU20	Motorola	MICROPROCESSOR	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	NO	YES				24	32		FLATPACK			85 Cel		-40 Cel		QUAD	2.45 mm		14 mm	CAN ALSO OPERATE WITH 5V SUPPLY		16	20 MHz			14 mm	CMOS		3.3 V				.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified	20 rpm	YES
MC8640DTVJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V			32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO	e2
MCF53281CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MPC8343CVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
STM32MP157DAA1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			800 rpm	YES
14305R-2000	Dialog Semiconductor	MICROPROCESSOR	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	NO	YES	3.6 V			0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel		QUAD	.9 mm		7 mm		YES	0	10 MHz		260	7 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-XQCC-N48			80 rpm	NO
AM3351BZCEA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
AM3351BZCEA30R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO HAVING 28 GPMC ADDRESS AND 16 MULTIPLEXED ADDRESS AND DATA LINES	YES	16		30	260	13 mm	CMOS		1.1 V				.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
MCF54452CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54455CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC8347ECVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
Z84C0006VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	6.17 MHz	40	260	16.5862 mm	CMOS	30 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	6.17 rpm	YES	e3
MCF5275CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
SPC5200CBV400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
FH8065301487717SR3UT	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170		RECTANGULAR	UNSPECIFIED	YES	YES					64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-XBGA-B1170			1910 rpm	NO
LS1012AXE7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
AM6411AKCGHAALV	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		0	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	1048576	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V				.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
ATSAMA5D44B-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
MC7448THX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MCF5272CVM66	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MCF5275LCVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166 rpm	YES	e1
MPC8309CVMAHFCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	417 rpm	YES	e2
MPC8349CVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349CZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8349ECVVAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
SPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		AEC-Q100	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
T2080NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM					NO			30	250		CMOS							FIXED POINT	S-PBGA-B896	3		1533 rpm	NO	e1
APX81129UG-7	Diodes Incorporated	MICROPROCESSOR	INDUSTRIAL	GULL WING	4	VSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0			SMALL OUTLINE		1.1 V	85 Cel		-40 Cel	MATTE TIN	DUAL	1 mm		1.3 mm		NO	0		30	260	2.9 mm	CMOS		2.5 V				1.778 mm	FIXED POINT	R-PDSO-G4	1	Not Qualified		NO	e3
ATSAMA5D33A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
FH8065301567313SR3UZ	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1170			1330 rpm
MPC8349ECVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349ECZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
PPC440GX-3CF667C	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	552	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.6 V			64	32	1.5	GRID ARRAY	BGA552,24X24,40	1.5 V	85 Cel		-40 Cel		BOTTOM	3.977 mm		25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83 MHz	NOT SPECIFIED	NOT SPECIFIED	25 mm	CMOS	2200 mA	1.55 V			Microprocessors	1 mm	FIXED POINT	S-CBGA-B552		Not Qualified	667 rpm	NO
SMOMAPL138BGWTA3R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	131072	16 mm		YES	16	30 MHz	20	220	16 mm	CMOS	.31 mA	1.2 V	64		Other uPs/uCs/Peripheral ICs	.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e0
ADSP-21489KCPZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.15 V	1		24	40		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.05 V	115 Cel	3	0 Cel		QUAD	.9 mm	5242880	12 mm		YES	16		30	260	12 mm	CMOS	500 mA	1.1 V	65			.5 mm	FLOATING POINT	S-XQCC-N88	3		400 rpm	NO
AM1802EZWTD3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM1808EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM3357BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3358BGCZA80EP	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			28	32		GRID ARRAY		1.056 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM					YES	16		20	220		CMOS		1.1 V					FIXED POINT	S-PBGA-B324	3		800 rpm	YES	e0
AM5706BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
ATSAMA5D26C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D31A-CFUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,22X22,20	1.08 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	12 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.2 V	39	10	Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES
LX2160XN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MCF5206ECAB40	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			28	32		FLATPACK		3 V	85 Cel		-40 Cel	TIN	QUAD	3.85 mm		28 mm		YES	32	40 MHz	30	245	28 mm	CMOS		3.3 V				.65 mm	FIXED POINT	S-PQFP-G160	3		40 rpm	YES	e3
MCF5271CVM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MPC8280CVVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64		40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e1
PPC460EX-SUB1000T	M/a-com Technology Solutions	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V			32			GRID ARRAY		1.2 V	85 Cel		-40 Cel		BOTTOM	2.65 mm		35 mm		YES	32	100 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.25 V				1 mm	FLOATING POINT	S-PBGA-B728			1000 rpm	YES
SPC5125YVN400	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel		-40 Cel	TIN SILVER	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.