INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCF5233CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5235CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
FA80386EXTC33	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			26	32		FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	118 Cel			-40 Cel		QUAD	1.7 mm			20 mm		YES	16	66 MHz	NOT SPECIFIED	NOT SPECIFIED	20 mm		CMOS		5 V						.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified	33 rpm	YES
MCF54454CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel			-40 Cel	TIN SILVER	BOTTOM	2.48 mm			23 mm		YES	32	66 MHz	40	260	23 mm		CMOS		1.5 V			Microprocessors			1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
TN80C188XL12	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		20	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel		5	-40 Cel	TIN LEAD	QUAD	4.83 mm		0	24.2316 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS	NO	8	25 MHz			24.2316 mm		CMOS	62.5 mA	5 V	2	0	Microprocessors			1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12 rpm	YES	e0
CH80566EE014DT/SLGPP	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	437	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		AEC-Q100	28	64	1	GRID ARRAY, HEAT SINK/SLUG	BGA437,21X21,40	.9 V	85 Cel			-40 Cel		BOTTOM	2.792 mm			22 mm	IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY	YES	64		NOT SPECIFIED	NOT SPECIFIED	22 mm		CMOS		1 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B437		Not Qualified	1330 rpm	YES
GG8067402570801SR2M5	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1667	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				0	64		GRID ARRAY			85 Cel			-40 Cel		BOTTOM						NO	0						CMOS									FIXED POINT	S-PBGA-B1667			1500 rpm	NO
KU80386EXTC25	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			26	32		FLATPACK		4.5 V	117 Cel			-40 Cel		QUAD	4.57 mm			24.13 mm		YES	16	50 MHz			24.13 mm		CMOS		5 V						.635 mm	FIXED POINT	S-PQFP-G132			25 rpm	YES
MC9S08PT16VLD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	FLATPACK	QFP44,.47SQ,32	2.7 V	105 Cel	HCS08		-40 Cel	TIN	QUAD		16384				NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V			Microcontrollers	FLASH		.8 mm	FIXED POINT	S-PQFP-G44	3	Not Qualified	20 rpm	YES	e3
MCIMX6L3EVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		16384	13 mm		YES	32		40	260	13 mm		CMOS	1.1 mA						CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
MCIMX6L3EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm			13 mm					40	260	13 mm		CMOS								.5 mm		S-PBGA-B	3				e1
P1010NXN5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4					.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
S3C2410A20-YO80	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V			28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel			-40 Cel		BOTTOM	1.26 mm			14 mm		YES	32	20 MHz			14 mm		CMOS		1.8 V						.8 mm	FIXED POINT	S-PBGA-B272			200 rpm	YES
CM80616003060AESLBTD	Intel	MICROPROCESSOR	INDUSTRIAL	BUTT	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			0	64		GRID ARRAY		1.045 V	85 Cel			-40 Cel		BOTTOM						YES	0	133 MHz					CMOS		1.1 V							FLOATING POINT	S-PBGA-B1156		Not Qualified	133 rpm	YES
EWIXP420ABBT	Intel	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY		YES						1.3,3.3	GRID ARRAY	BGA492,26X26,50		85 Cel			-40 Cel		BOTTOM													CMOS					Microprocessors			1.27 mm		S-PBGA-B492	1	Not Qualified
FWPXA270C5E416	Intel	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V			26	32		GRID ARRAY		1.2825 V	85 Cel			-40 Cel		BOTTOM						YES	32	3.6864 MHz					CMOS		1.35 V							FIXED POINT	S-PBGA-B360	1	Not Qualified	416 rpm	YES
GG8067402569000SR2DH	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1667		SQUARE	PLASTIC/EPOXY	YES	YES				0	64		GRID ARRAY			85 Cel			-40 Cel		BOTTOM						NO	0						CMOS									FIXED POINT	S-PBGA-B1667			1600 rpm	NO
IP80C88	Intersil	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V			20	16	5	IN-LINE	DIP40,.6	4.5 V	85 Cel			-40 Cel	TIN LEAD	DUAL	6.35 mm			15.24 mm		NO	8	5 MHz			51.75 mm		CMOS	50.5 mA	5 V			Microprocessors			2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	5 rpm	YES	e0
IP80C88-2	Intersil	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V			20	16	5	IN-LINE	DIP40,.6	4.5 V	85 Cel			-40 Cel	TIN LEAD	DUAL	6.35 mm			15.24 mm		NO	8	8 MHz			51.75 mm		CMOS	80.5 mA	5 V			Microprocessors			2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	8 rpm	YES	e0
IP80C88-2/+	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					16	5	IN-LINE	DIP40,.6		85 Cel			-40 Cel		DUAL													CMOS	80.5 mA	5 V			Microprocessors			2.54 mm		R-PDIP-T40			8 rpm
IP80C88/+	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					16	5	IN-LINE	DIP40,.6		85 Cel			-40 Cel		DUAL													CMOS	50.5 mA	5 V			Microprocessors			2.54 mm		R-PDIP-T40			5 rpm
IS80C286-20	Renesas Electronics	MICROPROCESSOR	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V			24			CHIP CARRIER		4.75 V	85 Cel			-40 Cel		QUAD	4.57 mm			24.23 mm		NO	16				24.23 mm		CMOS		5 V						1.27 mm	FIXED POINT	S-PQCC-J68			20 rpm	YES
KU80386EXTB25	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V			26	32		FLATPACK, BUMPER		2.7 V	117 Cel			-40 Cel		QUAD	4.57 mm			24.13 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	24.13 mm		CMOS		3.3 V						.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	25 rpm	YES
LUPXA255A0E400	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.64 V			26	32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2 mm			17 mm		YES	32	3.6864 MHz	40	250	17 mm		CMOS		1.3 V			Microprocessors			1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
MCF53016CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24			GRID ARRAY		1.08 V	85 Cel			-40 Cel		BOTTOM						YES	32	48 MHz					CMOS									FIXED POINT	S-PBGA-B256			240 rpm	YES
MCF5307CFT66B	Motorola	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	YES					32		FLATPACK			85 Cel			-40 Cel		QUAD						YES		66 MHz					CMOS		3.3 V							FIXED POINT	S-PQFP-G208		Not Qualified	66 rpm	YES
NHIXP435ADT	Intel		INDUSTRIAL		460			PLASTIC		YES						1.3,3.3		BGA460,24X24,50		85 Cel			-40 Cel																				Microprocessors							Not Qualified
TMPZ84C00AP	Toshiba	MICROPROCESSOR, RISC	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO					8	5	IN-LINE	DIP40,.6		85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	DUAL													CMOS		5 V			Microprocessors			2.54 mm		R-PDIP-T40		Not Qualified	4 rpm		e0
TN80C188EB-8	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			20	16	5	CHIP CARRIER	LDCC84,1.2SQ	4.5 V	85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	QUAD					8MHZ, 16MHZ SPEED VERSION NOT AVAILABLE FOR 5V OPTION	NO	8						CMOS	45 mA	5 V			Microprocessors			1.27 mm	FIXED POINT	S-PQCC-J84		Not Qualified	8 rpm	YES	e0
TN80L186EA-13	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		20	16	3/5	CHIP CARRIER	LDCC68,1.0SQ	2.7 V	85 Cel		5	-40 Cel	TIN LEAD	QUAD	4.83 mm		0	24.2 mm		NO	16	26 MHz			24.2 mm		CMOS	65 mA	5 V	2	0	Microprocessors			1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	13 rpm	YES	e0
TS68C000VC8A	Atmel	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V			24	32	5	IN-LINE	DIP64,.9	4.5 V	85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	DUAL	4.83 mm			22.86 mm		NO	16	8 MHz			81.28 mm		HCMOS	42 mA	5 V			Microprocessors			2.54 mm	FIXED POINT	R-CDIP-T64		Not Qualified	8 rpm	NO	e0
TS80C186EB13	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			20	16		FLATPACK		4.5 V	85 Cel			-40 Cel	TIN LEAD	QUAD	3.15 mm			14 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	NO	16	26 MHz			20 mm		CMOS		5 V						.8 mm	FIXED POINT	R-PQFP-G80		Not Qualified	13 rpm	YES	e0
AT97SC3205T-H3M4C00B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES				0	8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel			-40 Cel		QUAD	.9 mm			4 mm		NO	0				4 mm		CMOS		3.3 V						.4 mm	FIXED POINT	S-PQCC-N32				NO
MC68LC302CAF16CT	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES		8		20	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20		85 Cel		3	-40 Cel	TIN	QUAD	1.7 mm		1152	14 mm		NO	16	4 MHz	40	260	14 mm		CMOS		3.3 V	5	3				.5 mm	FIXED POINT	S-PQFP-G100	3		16.67 rpm	YES	e3
MPC8313ECVRAFFC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel			-40 Cel	NICKEL GOLD	BOTTOM	2.55 mm			27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e4
AM1802EZCED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		172032	13 mm		YES	16	30 MHz	30	260	13 mm		CMOS		1.2 V	80					.65 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM486DX4-100V16BHI	Advanced Micro Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	0		32	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	100 Cel		3	-40 Cel	TIN LEAD	QUAD	3.7 mm		0	28 mm		YES	32	33.33 MHz			28 mm		CMOS	700 mA	3.3 V	0	0	Microprocessors			.5 mm	FLOATING POINT	S-PQFP-G208		Not Qualified	100 rpm	YES	e0
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.96 mm			23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz		250	23 mm		CMOS		1.15 V						.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm			23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm		CMOS		1.15 V						.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AT91SAM9G15-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel		2	-40 Cel		BOTTOM	1.4 mm		32768	15 mm		YES	32	133 MHz			15 mm		CMOS		1 V	16	3	Microprocessors			.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
AT91SAM9X35-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel		1	-40 Cel		BOTTOM	1.4 mm		32768	15 mm		YES	32	50 MHz			15 mm		CMOS		1 V	16		Microprocessors			.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
ATSAMA5D22A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.1 V	85 Cel		1	-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	BOTTOM	1.2 mm		131072	11 mm		YES	32	24 MHz			11 mm		CMOS		1.2 V	51	1				.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm		131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32					.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm		131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32					.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D26C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel		1	-40 Cel		BOTTOM	1.4 mm		131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		1.25 V	32					.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D26C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel		1	-40 Cel		BOTTOM	1.4 mm		131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		1.25 V	32					.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D27A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	105 Cel			-40 Cel		BOTTOM	1.4 mm			14 mm		YES	32	24 MHz			14 mm		CMOS		1.2 V						.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D41B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.16 V	85 Cel		1	-40 Cel		BOTTOM	1.4 mm		131072	14 mm		YES	16	50 MHz			14 mm		CMOS		1.26 V	32	2				.8 mm	FLOATING POINT	S-PBGA-B289			600 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.