INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
SAM9X60D5MT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm		69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm		CMOS		1.8 V	16				.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
DM3730CBPA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm		16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	1400 mA	1.14 V	128		Digital Signal Processors		.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
AM3354BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
SAM9X60D5M-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm		69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm		CMOS		1.8 V	16				.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
MCF5328CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm		YES	32	80 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
SAM9X60D6K-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm		69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm		CMOS		1.8 V	16				.65 mm	FIXED POINT	R-PBGA-B196	3		600 rpm	YES	e1
ATSAMA5D225C-D1M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm		65536	11 mm		YES	0	24 MHz			11 mm		CMOS		1.2 V	51	1			.75 mm	FIXED POINT	S-PBGA-B196			500 rpm	YES	e2
SAM9X60D6KT-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm		69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm		CMOS		1.8 V	16				.65 mm	FIXED POINT	R-PBGA-B196	3		600 rpm	YES	e1
SPC5125YVN400R	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel			-40 Cel	TIN SILVER	BOTTOM									40	260								Microprocessors		1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
ATSAMA5D33A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel		1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39	10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
AM3357BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.26 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
MPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V			32			GRID ARRAY, HEAT SINK/SLUG		1.33 V	85 Cel			-40 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	32	35 MHz	40	260	27 mm		CMOS		1.4 V					1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
ATSAMA5D34A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel		1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39	10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
AT91SAM9263B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel		2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		98304	15 mm		YES	32	50 MHz			15 mm		CMOS	73.3 mA	1.2 V	22				.8 mm	FIXED POINT	S-PBGA-B324			240 rpm	YES	e1
ATSAMA5D35A-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel		1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39	10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
MCF5484CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
SAM9X60T-V/DWB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	228	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.21 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA228,16X16,26	1.12 V	105 Cel		1	-40 Cel		BOTTOM	1.2 mm		69632	11 mm		YES	32	48 MHz			11 mm		CMOS		1.15 V	16				.65 mm	FIXED POINT	S-PBGA-B228			600 rpm	YES
ATSAMA5D22C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm		131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32				.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D35A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel		1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39	10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
SPC5200CBV400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel			-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm		CMOS		1.5 V			Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
P1010NXE5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
AM3703CUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS	800 mA	1.1 V			Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
AT91SAM9X25-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel		1	-40 Cel		BOTTOM	1.4 mm		32768	15 mm		YES	32	16 MHz			15 mm		CMOS		1 V	16		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
ATSAMA5D42B-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel		1	-40 Cel		BOTTOM	1.2 mm		131072	16 mm		YES	32	50 MHz			16 mm		CMOS		1.26 V	32	2			.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
MCF54417CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel		BOTTOM						YES	0	100 MHz	40	260			CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
ADSP-21489BSWZ-4A	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	85 Cel			-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		163840	14 mm		YES	16	25 MHz			14 mm		CMOS		1.1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	400 rpm	NO	e3
AT91SAM9X25-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel		1	-40 Cel		BOTTOM	1.4 mm		32768	15 mm		YES	32	16 MHz			15 mm		CMOS		1 V	16		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
AM3351BZCEA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm		YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64				.65 mm	FIXED POINT	S-PBGA-B298	3		600 rpm	YES	e1
AM3354BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		131072	13 mm		YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
MCF5373LCVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm		YES	32	80 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MPC8280CZUQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM	1.65 mm			37.5 mm		YES	64		40	260	37.5 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs		1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	YES	e0
DM3725CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS	37 mA	1.14 V	128		Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
DM3730CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS	37 mA	1.14 V	128		Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
ATSAMA5D44B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel		1	-40 Cel		BOTTOM	1.2 mm		131072	16 mm		YES	32	50 MHz			16 mm		CMOS		1.26 V	32	2			.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
MCF54416CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel		BOTTOM						YES	0	100 MHz	40	260			CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
AM3356BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
MC9S08PT8VLC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY		YES					8	3/5	FLATPACK	QFP32,.35SQ,32		105 Cel	HCS08		-40 Cel	TIN	QUAD		8192							40	260		2048	CMOS	14 mA				Microcontrollers	FLASH	.8 mm		S-PQFP-G32	3	Not Qualified	20 rpm		e3
AM3517AZERA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm		65536	23 mm		YES	16	26 MHz	30	260	23 mm		CMOS	1500 mA	1.2 V	32		Microprocessors		1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
SPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm		CMOS		1.5 V			Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
AM3354BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.26 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
OMAP3530ECBBA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES						1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16		105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm			12 mm					30	260	12 mm		CMOS					Graphics Processors		.4 mm		S-PBGA-B515	3	Not Qualified	720 rpm		e1
AM3356BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM5748ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm			23 mm		YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V					.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM3703CBPA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.9 V	105 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm		65536	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	800 mA	1.1 V			Microprocessors		.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
AT91SAM9G35-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel		1	-40 Cel		BOTTOM	1.4 mm		32768	15 mm		YES	32	50 MHz			15 mm		CMOS		1 V	16		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
MPC8270CVVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm			37.5 mm		YES	64		40	260	37.5 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs		1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e1
T2080NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY, FINE PITCH			105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			25 mm		NO			30	250	25 mm		CMOS							.8 mm	FIXED POINT	S-PBGA-B896	3		1800 rpm	NO	e1
AM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm			23 mm		YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V					.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.