256 Other Function uPs,uCs & Peripheral ICs 29

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification
OSD3358-1G-ISM	Octavo Systems	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA256,16X16,50		85 Cel	-40 Cel		BOTTOM	2.58 mm	21 mm					21 mm	CMOS		1.1 V			1.27 mm	S-PBGA-B256
A2F200M3F-FGG256I	Microchip Technology	SoC FPGA		BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V		GRID ARRAY, LOW PROFILE		1.425 V	100 Cel	-40 Cel	MATTE TIN	BOTTOM					30	250		CMOS		1.5 V				S-PBGA-B256	3
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM											Other uPs/uCs/Peripheral ICs		.8 mm	S-XBGA-B256		Not Qualified
TFB2002BM	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	FLAT	256	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES			FLATPACK			125 Cel	-55 Cel		QUAD								CMOS		5 V				S-CQFP-F256		Not Qualified
TFB2022AMHFHB	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	GULL WING	256	QFP	SQUARE	CERAMIC, GLASS-SEALED	YES	5.25 V		FLATPACK		4.75 V	125 Cel	-55 Cel		QUAD								CMOS		5 V				S-GQFP-G256		Not Qualified
TFB2022AM	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	FLAT	256	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES			FLATPACK			125 Cel	-55 Cel		QUAD								CMOS		5 V				S-CQFP-F256		Not Qualified
XOMAPL137AZKB3	Texas Instruments		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM											Other Microprocessor ICs		1 mm	S-PBGA-B256		Not Qualified
OMAPL137CZKBD	Texas Instruments	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA256,16X16,40		70 Cel	-40 Cel		BOTTOM	2.05 mm	17 mm					17 mm	CMOS					1 mm	S-PBGA-B256
OMAPL137BZKBA4	Texas Instruments	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V		GRID ARRAY	BGA256,16X16,40	1.25 V	85 Cel	-40 Cel		BOTTOM	2.05 mm	17 mm					17 mm	CMOS		1.3 V			1 mm	S-PBGA-B256
LH7A400N0G076	NXP Semiconductors		INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		85 Cel	-40 Cel		BOTTOM											Other Microprocessor ICs		1 mm	S-PBGA-B256		Not Qualified
MC9328MXLDVM20	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	-30 Cel		BOTTOM	1.6 mm	14 mm			40	260	14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256	3
MC9328MXLVM15R2	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	0 Cel		BOTTOM	1.6 mm	14 mm			40	260	14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256	3
MC9328MXLVM20R2	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	0 Cel		BOTTOM	1.6 mm	14 mm					14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256
LH7A400N0F076	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM											Other Microprocessor ICs		1 mm	S-PBGA-B256		Not Qualified
LH7A400N0E000B5	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM											Other uPs/uCs/Peripheral ICs		.8 mm	S-XBGA-B256		Not Qualified
MC9328MXLCVM15R2	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel	-40 Cel		BOTTOM	1.6 mm	14 mm			40	260	14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256	3
LH7A400N0G000	NXP Semiconductors		INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		85 Cel	-40 Cel		BOTTOM											Other Microprocessor ICs		1 mm	S-PBGA-B256		Not Qualified
MC9328MXLDVM15R2	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	-30 Cel		BOTTOM	1.6 mm	14 mm					14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256
LH7A400N0E000	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM											Other Microprocessor ICs		.8 mm	S-XBGA-B256		Not Qualified
LH7A400N0B000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM											Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B256		Not Qualified
LH7A400N0F000	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM											Other Microprocessor ICs		1 mm	S-PBGA-B256		Not Qualified
LH7A400N0B000B5	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM											Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B256		Not Qualified
MC9328MXLDVM20R2	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	-30 Cel		BOTTOM	1.6 mm	14 mm					14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256
LH7A400N0B000	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM											Other Microprocessor ICs		1 mm	S-PBGA-B256		Not Qualified
MC9328MXLDVM15	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	-30 Cel		BOTTOM	1.6 mm	14 mm					14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256
MC9328MXLCVM15	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel	-40 Cel		BOTTOM	1.6 mm	14 mm			40	260	14 mm	CMOS		1.8 V			.8 mm	S-PBGA-B256	3
UPD65977S1-XXX-B6	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY		3 V	85 Cel	-40 Cel		BOTTOM	2.2 mm	27 mm					27 mm	CMOS		3.3 V			1.27 mm	S-PBGA-B256
UPD65948S1-068	Renesas Electronics		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		3.3	GRID ARRAY	BGA256,20X20,50		70 Cel	0 Cel		BOTTOM								CMOS	.3 mA	3.3 V	Other Microprocessor ICs		1.27 mm	S-PBGA-B256		Not Qualified
BCM5820KTB	Broadcom	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	2.625 V		GRID ARRAY	BGA256,20X20,50	2.375 V	70 Cel	0 Cel		BOTTOM	1.75 mm	27 mm	64	90 MHz			27 mm	CMOS		2.5 V		PCI	1.27 mm	S-PBGA-B256

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.